Evaluation of silicon fracture strength dependence on stealth dicing layers for “cleave-before-use” MEMS freestanding cantilever probes
1978 ◽
Vol 36
(2)
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pp. 220-221
1989 ◽
Vol 38
(424)
◽
pp. 32-38
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2006 ◽
Vol 306
(2)
◽
pp. 176-180
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1988 ◽
Vol 12
(2)
◽
pp. 89-96
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Keyword(s):
Comparison of mode-resolved fracture strength of silicon with mixed-mode failure of diamond crystals
2010 ◽
Vol 77
(2)
◽
pp. 193-200
◽
2003 ◽
Vol 07
(03)
◽
pp. 139-146
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