scholarly journals Interfacial fracture toughness measurement of welded Babbitt alloy SnSb11Cu6/20Steel

2021 ◽  
Author(s):  
Yuepeng Gao ◽  
Jianmei Wang ◽  
Yuyang Liu
Keyword(s):  
Fracture Toughness ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness ◽  
Fracture Toughness Measurement ◽  
Toughness Measurement ◽  
Babbitt Alloy

Interfacial fracture toughness measurement for thin film interfaces

2004 ◽  
Vol 71 (9-10) ◽  
pp. 1219-1234 ◽  
Author(s):  
Mitul B. Modi ◽  
Suresh K. Sitaraman
Keyword(s):  
Thin Film ◽  
Fracture Toughness ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness ◽  
Fracture Toughness Measurement ◽  
Toughness Measurement

Interfacial Fracture Toughness for Film on Substrate Determined by Indentation Method

2007 ◽  
Vol 345-346 ◽  
pp. 801-804
Author(s):  
Soo Hyun Lee ◽  
Jink Wang Kim ◽  
Su Nam Kim ◽  
Sang Bong Cho ◽  
Jon Do Yun
Keyword(s):  
Fracture Toughness ◽  
Tensile Testing ◽  
Interfacial Fracture ◽  
Interface Fracture ◽  
Interfacial Fracture Toughness ◽  
Indentation Method ◽  
Element Analysis ◽  
Fracture Toughness Measurement ◽  
Interface Fracture Toughness ◽  
Toughness Measurement

Indentation method was used to determine the interfacial fracture toughness of epoxy coating on aluminum substrate. Tensile testing followed by finite element analysis was also performed to determine the interface fracture toughness. Fracture toughness values determined by two methods were consistent, giving reliability to indentation method for interfacial fracture toughness measurement.

Interfacial fracture toughness measurement using indentation

1994 ◽  
Vol 29 (15) ◽  
pp. 4022-4026 ◽  
Author(s):  
J. Zhang ◽  
J. J. Lewandowski
Keyword(s):  
Fracture Toughness ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness ◽  
Fracture Toughness Measurement ◽  
Toughness Measurement

Interfacial Fracture Toughness Measurement of a Ti/Si Interface

2004 ◽  
Vol 126 (3) ◽  
pp. 301-307 ◽  
Author(s):  
Mitul Modi ◽  
Suresh K. Sitaraman
Keyword(s):  
Fracture Toughness ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness ◽  
Thermally Induced ◽  
Adhesive Layers ◽  
Available Energy ◽  
Fracture Toughness Measurement ◽  
Test Parameters ◽  
Metal Layers ◽  
Toughness Measurement

Titanium adhesive layers are commonly used in microelectronic and MEMS applications to help improve the adhesion of other metal layers to a silicon substrate. Such Ti/Si interfaces could potentially delaminate under externally applied mechanical loads, thermally induced stresses, or process-induced intrinsic stresses or a combination of these different loads. In order to design against delamination, knowledge of the interfacial fracture toughness of the Ti/Si interface is necessary. However, interfacial fracture toughness data for such interfaces is not widely available in the open literature, in part due to the difficulty in measuring the strength of thin film interfaces. The Modified Decohesion Test (MDT), a new test developed by the authors, has been used to characterize the mode mix dependent interfacial fracture toughness of a Ti/Si interface. In this approach, a highly stressed super layer is used to drive delamination and generate any mode mix at the crack tip. MDT uses the change in crack surface area to vary the available energy per unit area for crack growth and thus to bound the interfacial fracture toughness. Therefore, this technique uses a single sample to measure the interfacial fracture toughness. Since the deformations remain elastic, a mechanics-based solution can be used to correlate test parameters to the energy release rate. Common IC fabrication techniques are used to prepare the sample and execute the test, thereby making the test compatible with current microelectronic or MEMS facilities. Using the MDT, interfacial fracture toughness (Γ) bounds were found for a Ti/Si interface at three mode mixes. At a mode mix of 19.5 deg, 5.97J/m2⩽Γ⩽7.87J/m2, at a mode mix of 23 deg, 9.32J/m2⩽Γ⩽10.42J/m2, and at a mode mix of 30 deg, 12.70J/m2⩽Γ⩽17.02J/m2.

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