Interfacial Fracture Toughness for Film on Substrate Determined by Indentation Method

2007 ◽  
Vol 345-346 ◽  
pp. 801-804
Author(s):  
Soo Hyun Lee ◽  
Jink Wang Kim ◽  
Su Nam Kim ◽  
Sang Bong Cho ◽  
Jon Do Yun
Keyword(s):  
Fracture Toughness ◽  
Tensile Testing ◽  
Interfacial Fracture ◽  
Interface Fracture ◽  
Interfacial Fracture Toughness ◽  
Indentation Method ◽  
Element Analysis ◽  
Fracture Toughness Measurement ◽  
Interface Fracture Toughness ◽  
Toughness Measurement

Indentation method was used to determine the interfacial fracture toughness of epoxy coating on aluminum substrate. Tensile testing followed by finite element analysis was also performed to determine the interface fracture toughness. Fracture toughness values determined by two methods were consistent, giving reliability to indentation method for interfacial fracture toughness measurement.

Interfacial Fracture Toughness Measurement of a Ti/Si Interface

2004 ◽  
Vol 126 (3) ◽  
pp. 301-307 ◽  
Author(s):  
Mitul Modi ◽  
Suresh K. Sitaraman
Keyword(s):  
Fracture Toughness ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness ◽  
Thermally Induced ◽  
Adhesive Layers ◽  
Available Energy ◽  
Fracture Toughness Measurement ◽  
Test Parameters ◽  
Metal Layers ◽  
Toughness Measurement

Titanium adhesive layers are commonly used in microelectronic and MEMS applications to help improve the adhesion of other metal layers to a silicon substrate. Such Ti/Si interfaces could potentially delaminate under externally applied mechanical loads, thermally induced stresses, or process-induced intrinsic stresses or a combination of these different loads. In order to design against delamination, knowledge of the interfacial fracture toughness of the Ti/Si interface is necessary. However, interfacial fracture toughness data for such interfaces is not widely available in the open literature, in part due to the difficulty in measuring the strength of thin film interfaces. The Modified Decohesion Test (MDT), a new test developed by the authors, has been used to characterize the mode mix dependent interfacial fracture toughness of a Ti/Si interface. In this approach, a highly stressed super layer is used to drive delamination and generate any mode mix at the crack tip. MDT uses the change in crack surface area to vary the available energy per unit area for crack growth and thus to bound the interfacial fracture toughness. Therefore, this technique uses a single sample to measure the interfacial fracture toughness. Since the deformations remain elastic, a mechanics-based solution can be used to correlate test parameters to the energy release rate. Common IC fabrication techniques are used to prepare the sample and execute the test, thereby making the test compatible with current microelectronic or MEMS facilities. Using the MDT, interfacial fracture toughness (Γ) bounds were found for a Ti/Si interface at three mode mixes. At a mode mix of 19.5 deg, 5.97J/m2⩽Γ⩽7.87J/m2, at a mode mix of 23 deg, 9.32J/m2⩽Γ⩽10.42J/m2, and at a mode mix of 30 deg, 12.70J/m2⩽Γ⩽17.02J/m2.

scholarly journals Solutions and Discussions of thin film Undergoing the Nonlinear Peeling

2003 ◽  
Vol 795 ◽  
Author(s):  
Yueguang Wei ◽  
Siqi Shu ◽  
Ying Du LNM
Keyword(s):  
Thin Film ◽  
Fracture Toughness ◽  
Effective Strain ◽  
Slope Angle ◽  
Interfacial Crack ◽  
Crack Tip ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness ◽  
Element Analysis ◽  
Von Mises

ABSTRACTBased on the bending model, three double-parameter criteria characterizing thin film peeling process are introduced and analyzed in detail. Three double-parameter criteria include: (1) the interfacial fracture toughness and the separation strength, (2) the interfacial fracture toughness and the interfacial crack tip slope angle of thin film, and (3) the interfacial fracture toughness and the critical von Mises effective strain of thin film at crack tip. Based on the three double-parameter criteria, the thin film nonlinear peeling problems are solved analytically for each case. The results show that the solutions of thin film nonlinear peeling based on the bending model are very sensitive to the model parameter selections. Through analyses and comparisons for different solutions, a connection between solutions based on the bending models and based on the two-dimensional elastic-plastic finite element analysis is obtained.

HVOF Coating of Metallic Surfaces Using Different Powders: Fracture Toughness Measurement of Resulting Surfaces

2012 ◽  
Vol 445 ◽  
pp. 621-626 ◽  
Author(s):  
Y.A. Al-Shehri ◽  
M.S.J. Hashmi ◽  
Bekir Sami Yilbas
Keyword(s):  
Fracture Toughness ◽  
Microstructural Analysis ◽  
Metallic Surfaces ◽  
Indentation Method ◽  
Hvof Coatings ◽  
Fracture Toughness Measurement ◽  
Coated Surface ◽  
Coating Layers ◽  
Micro Indentation ◽  
Toughness Measurement

In the present study, two layer HVOF coatings of carbon steel is carried out. The microstructural changes in the coating layers and fracture toughness of the coated surface are examined. The micro indentation method is incorporated for the fracture toughness measurements, while optical and scanning electron microscopy are used for the microstructural analysis. It is found that the fracture toughness of the coating surface produced by the tungsten carbide blended powders is less than that of the coating produced by corrosion resistance powders. Key words: HVOF, Diamalloy 2002, Diamalloy 4010, Fracture toughness.

Sign in / Sign up

Export Citation Format

Share Document