Effects of nanoscale abrasive agglomeration on material removal in magnetorheological finishing

Author(s):  
Qikai Li ◽  
Xiaoyuan Li ◽  
Zuoyan Ye ◽  
Lili Wang ◽  
Jinlong Pan ◽  
...  
2007 ◽  
Vol 359-360 ◽  
pp. 384-388
Author(s):  
Feng Jun Chen ◽  
Shao Hui Yin ◽  
Jian Wu Yu ◽  
Hitoshi Ohmori ◽  
Wei Min Lin ◽  
...  

According to the sharp rheological characteristics of magnetorheological fluid in the magnetic field, the principle and mechanism of magnetorheological finishing is analyzed. Based on the Preston equation, the Reynolds equation and its boundary conditions, the two-dimensional material removal model is built and simulated. Furthermore, a series of MRF experiments are carried out, and the influence of the immersed depth and material kinds on material removal rate are clarified respectively. The experimental results are compared with the modeling results of material removal rate to confirm the mechanistic model validity.


Author(s):  
Feng Jun Chen ◽  
Shao Hui Yin ◽  
Jian Wu Yu ◽  
Hitoshi Ohmori ◽  
Wei Min Lin ◽  
...  

2011 ◽  
Vol 50 (14) ◽  
pp. 1984 ◽  
Author(s):  
William Kordonski ◽  
Sergei Gorodkin

2016 ◽  
Vol 874 ◽  
pp. 158-166
Author(s):  
Run Chen ◽  
Jia Bin Lu ◽  
Qiu Sheng Yan ◽  
Xiao Lan Xiao ◽  
De Yuan Li

The polishing experiments of anodic oxide film of aluminum were performed to research the influence of polishing parameters on the surface roughness and material removal rate in the cluster magnetorheological finishing (MRF). Experimental results demonstrate that a mirror effect can be reached when the anodic oxide film of aluminum is polished by the Cluster MRF. The roughness of the workpiece surface after polishing for 15 min is decreased from Ra 0.575μm to Ra 4.13nm and the material removal rate is 0.653mg/min. With the extension of the polishing time, the surface roughness rapidly declines at first and then slowly decreases. When the machining time is more than 15min, the anodic oxide film of aluminum is easily worn out, resulting in a sharp increase in the surface roughness. The machining gap between the workpiece and the polishing plate influences the polishing effect of anodic oxide film of aluminum. With the increase of the machining gap, the material removal rate decreases and the surface roughness increases. A good surface quality can be got at the machining gap of 1.1mm. The type and size of abrasive particles will directly affect the polishing effect of anodic oxide film of aluminum, and when using CeO2 abrasive with the particle size of W3, a higher material removal rate and a smaller surface roughness can be obtained.


2021 ◽  
Author(s):  
Bin Luo ◽  
Qiusheng Yan ◽  
Jingfu Chai ◽  
Wenqing Song ◽  
Jisheng Pan

Abstract with the high performance of microelectronic and optoelectronic devices, the new generation of optoelectronic wafers is developing in the direction of large size and ultra-thinning, which requires ultra-smooth surfaces with sub-nanometer surface roughness. It puts forward new requirements and challenges for the efficient and ultra-smooth planarization processing of optoelectronic wafers. This paper proposes a novel method of cluster magnetorheological finishing based on array circular holes polishing disk, which can effectively improve the polishing shear force and polishing efficiency. The appropriate polishing shear force and material removal rate are the keys to achieve low roughness and low damage processing of optoelectronic wafers. Therefore, the shear force model of solid particles in magnetorheological finishing fluid is established based on the tribological principle. The material removal rate model is established by combining the polishing shear force model with the velocity model. The correctness of the above model is verified by the rotary dynamometer and repeated single-factor experiments. The errors between theoretical and experimental values of polishing shear force and material removal rate are 8.8% and 10.8%, respectively. The new magnetorheological finishing method can realize the efficient and ultra-smooth planarization of optoelectronic wafers. The established model can theoretically guide the optimization of the surface structure and polishing process of polishing disks.


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