Effects of nanoscale abrasive agglomeration on material removal in magnetorheological finishing

2021 ◽  
Author(s):  
Qikai Li ◽  
Xiaoyuan Li ◽  
Zuoyan Ye ◽  
Lili Wang ◽  
Jinlong Pan ◽  
...  
Keyword(s):  
Material Removal ◽  
Magnetorheological Finishing

A Mechanistic Model of Material Removal in Magnetorheological Finishing (MRF)

2007 ◽  
Vol 359-360 ◽  
pp. 384-388
Author(s):  
Feng Jun Chen ◽  
Shao Hui Yin ◽  
Jian Wu Yu ◽  
Hitoshi Ohmori ◽  
Wei Min Lin ◽  
...  
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Reynolds Equation ◽  
Removal Rate ◽  
Mechanistic Model ◽  
Magnetorheological Fluid ◽  
Magnetorheological Finishing ◽  
Material Removal Model ◽  
Removal Model ◽  
The Magnetic Field

According to the sharp rheological characteristics of magnetorheological fluid in the magnetic field, the principle and mechanism of magnetorheological finishing is analyzed. Based on the Preston equation, the Reynolds equation and its boundary conditions, the two-dimensional material removal model is built and simulated. Furthermore, a series of MRF experiments are carried out, and the influence of the immersed depth and material kinds on material removal rate are clarified respectively. The experimental results are compared with the modeling results of material removal rate to confirm the mechanistic model validity.

A Mechanistic Model of Material Removal in Magnetorheological Finishing (MRF)

2007 ◽  
pp. 384-388
Author(s):  
Feng Jun Chen ◽  
Shao Hui Yin ◽  
Jian Wu Yu ◽  
Hitoshi Ohmori ◽  
Wei Min Lin ◽  
...  
Keyword(s):  
Material Removal ◽  
Mechanistic Model ◽  
Magnetorheological Finishing

Surface roughness and material removal models for magnetorheological finishing

2013 ◽  
Vol 6 (1) ◽  
pp. 70 ◽  
Author(s):  
Chun Wai Kum ◽  
Takashi Sato ◽  
Stephen Wan
Keyword(s):  
Surface Roughness ◽  
Material Removal ◽  
Magnetorheological Finishing

Predicting the Material Removal Rate (MRR) in surface Magnetorheological Finishing (MRF) based on the synergistic effect of pressure and shear stress

2020 ◽  
Vol 504 ◽  
pp. 144492 ◽  
Author(s):  
Jiabao Liu ◽  
Xiaoyuan Li ◽  
Yunfei Zhang ◽  
Dong Tian ◽  
Minheng Ye ◽  
...  
Keyword(s):  
Shear Stress ◽  
Synergistic Effect ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Magnetorheological Finishing ◽  
Effect Of Pressure

Material removal in magnetorheological finishing of optics

2011 ◽  
Vol 50 (14) ◽  
pp. 1984 ◽  
Author(s):  
William Kordonski ◽  
Sergei Gorodkin
Keyword(s):  
Material Removal ◽  
Magnetorheological Finishing

Experimental Research of Cluster Magnetorheological Finishing on Anodic Oxide Film of Aluminum

2016 ◽  
Vol 874 ◽  
pp. 158-166
Author(s):  
Run Chen ◽  
Jia Bin Lu ◽  
Qiu Sheng Yan ◽  
Xiao Lan Xiao ◽  
De Yuan Li
Keyword(s):  
Surface Roughness ◽  
Oxide Film ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Anodic Oxide ◽  
Anodic Oxide Film ◽  
Magnetorheological Finishing ◽  
Machining Time ◽  
Good Surface

The polishing experiments of anodic oxide film of aluminum were performed to research the influence of polishing parameters on the surface roughness and material removal rate in the cluster magnetorheological finishing (MRF). Experimental results demonstrate that a mirror effect can be reached when the anodic oxide film of aluminum is polished by the Cluster MRF. The roughness of the workpiece surface after polishing for 15 min is decreased from Ra 0.575μm to Ra 4.13nm and the material removal rate is 0.653mg/min. With the extension of the polishing time, the surface roughness rapidly declines at first and then slowly decreases. When the machining time is more than 15min, the anodic oxide film of aluminum is easily worn out, resulting in a sharp increase in the surface roughness. The machining gap between the workpiece and the polishing plate influences the polishing effect of anodic oxide film of aluminum. With the increase of the machining gap, the material removal rate decreases and the surface roughness increases. A good surface quality can be got at the machining gap of 1.1mm. The type and size of abrasive particles will directly affect the polishing effect of anodic oxide film of aluminum, and when using CeO2 abrasive with the particle size of W3, a higher material removal rate and a smaller surface roughness can be obtained.

scholarly journals Theoretical and Experimental Research on a Novel Method of Cluster Magnetorheological Finishing Based on Array Circular Holes Polishing Disk

2021 ◽  
Author(s):  
Bin Luo ◽  
Qiusheng Yan ◽  
Jingfu Chai ◽  
Wenqing Song ◽  
Jisheng Pan
Keyword(s):  
Material Removal Rate ◽  
Shear Force ◽  
Material Removal ◽  
High Performance ◽  
Removal Rate ◽  
Solid Particles ◽  
Force Model ◽  
Magnetorheological Finishing ◽  
Circular Holes ◽  
Novel Method

Abstract with the high performance of microelectronic and optoelectronic devices, the new generation of optoelectronic wafers is developing in the direction of large size and ultra-thinning, which requires ultra-smooth surfaces with sub-nanometer surface roughness. It puts forward new requirements and challenges for the efficient and ultra-smooth planarization processing of optoelectronic wafers. This paper proposes a novel method of cluster magnetorheological finishing based on array circular holes polishing disk, which can effectively improve the polishing shear force and polishing efficiency. The appropriate polishing shear force and material removal rate are the keys to achieve low roughness and low damage processing of optoelectronic wafers. Therefore, the shear force model of solid particles in magnetorheological finishing fluid is established based on the tribological principle. The material removal rate model is established by combining the polishing shear force model with the velocity model. The correctness of the above model is verified by the rotary dynamometer and repeated single-factor experiments. The errors between theoretical and experimental values of polishing shear force and material removal rate are 8.8% and 10.8%, respectively. The new magnetorheological finishing method can realize the efficient and ultra-smooth planarization of optoelectronic wafers. The established model can theoretically guide the optimization of the surface structure and polishing process of polishing disks.

Research on material removal model and processing parameters of cluster magnetorheological finishing with dynamic magnetic fields

2018 ◽  
Vol 100 (9-12) ◽  
pp. 2283-2297 ◽  
Author(s):  
Jisheng Pan ◽  
Mingliang Guo ◽  
Qiusheng Yan ◽  
Kun Zheng ◽  
Xiaolan Xiao
Keyword(s):  
Magnetic Fields ◽  
Material Removal ◽  
Processing Parameters ◽  
Magnetorheological Finishing ◽  
Material Removal Model ◽  
Removal Model
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