Predicting the Material Removal Rate (MRR) in surface Magnetorheological Finishing (MRF) based on the synergistic effect of pressure and shear stress

2020 ◽  
Vol 504 ◽  
pp. 144492 ◽  
Author(s):  
Jiabao Liu ◽  
Xiaoyuan Li ◽  
Yunfei Zhang ◽  
Dong Tian ◽  
Minheng Ye ◽  
...  
Keyword(s):  
Shear Stress ◽  
Synergistic Effect ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Magnetorheological Finishing ◽  
Effect Of Pressure

A Mechanistic Model of Material Removal in Magnetorheological Finishing (MRF)

2007 ◽  
Vol 359-360 ◽  
pp. 384-388
Author(s):  
Feng Jun Chen ◽  
Shao Hui Yin ◽  
Jian Wu Yu ◽  
Hitoshi Ohmori ◽  
Wei Min Lin ◽  
...  
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Reynolds Equation ◽  
Removal Rate ◽  
Mechanistic Model ◽  
Magnetorheological Fluid ◽  
Magnetorheological Finishing ◽  
Material Removal Model ◽  
Removal Model ◽  
The Magnetic Field

According to the sharp rheological characteristics of magnetorheological fluid in the magnetic field, the principle and mechanism of magnetorheological finishing is analyzed. Based on the Preston equation, the Reynolds equation and its boundary conditions, the two-dimensional material removal model is built and simulated. Furthermore, a series of MRF experiments are carried out, and the influence of the immersed depth and material kinds on material removal rate are clarified respectively. The experimental results are compared with the modeling results of material removal rate to confirm the mechanistic model validity.

Experimental Research of Cluster Magnetorheological Finishing on Anodic Oxide Film of Aluminum

2016 ◽  
Vol 874 ◽  
pp. 158-166
Author(s):  
Run Chen ◽  
Jia Bin Lu ◽  
Qiu Sheng Yan ◽  
Xiao Lan Xiao ◽  
De Yuan Li
Keyword(s):  
Surface Roughness ◽  
Oxide Film ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Anodic Oxide ◽  
Anodic Oxide Film ◽  
Magnetorheological Finishing ◽  
Machining Time ◽  
Good Surface

The polishing experiments of anodic oxide film of aluminum were performed to research the influence of polishing parameters on the surface roughness and material removal rate in the cluster magnetorheological finishing (MRF). Experimental results demonstrate that a mirror effect can be reached when the anodic oxide film of aluminum is polished by the Cluster MRF. The roughness of the workpiece surface after polishing for 15 min is decreased from Ra 0.575μm to Ra 4.13nm and the material removal rate is 0.653mg/min. With the extension of the polishing time, the surface roughness rapidly declines at first and then slowly decreases. When the machining time is more than 15min, the anodic oxide film of aluminum is easily worn out, resulting in a sharp increase in the surface roughness. The machining gap between the workpiece and the polishing plate influences the polishing effect of anodic oxide film of aluminum. With the increase of the machining gap, the material removal rate decreases and the surface roughness increases. A good surface quality can be got at the machining gap of 1.1mm. The type and size of abrasive particles will directly affect the polishing effect of anodic oxide film of aluminum, and when using CeO2 abrasive with the particle size of W3, a higher material removal rate and a smaller surface roughness can be obtained.

scholarly journals Theoretical and Experimental Research on a Novel Method of Cluster Magnetorheological Finishing Based on Array Circular Holes Polishing Disk

2021 ◽  
Author(s):  
Bin Luo ◽  
Qiusheng Yan ◽  
Jingfu Chai ◽  
Wenqing Song ◽  
Jisheng Pan
Keyword(s):  
Material Removal Rate ◽  
Shear Force ◽  
Material Removal ◽  
High Performance ◽  
Removal Rate ◽  
Solid Particles ◽  
Force Model ◽  
Magnetorheological Finishing ◽  
Circular Holes ◽  
Novel Method

Abstract with the high performance of microelectronic and optoelectronic devices, the new generation of optoelectronic wafers is developing in the direction of large size and ultra-thinning, which requires ultra-smooth surfaces with sub-nanometer surface roughness. It puts forward new requirements and challenges for the efficient and ultra-smooth planarization processing of optoelectronic wafers. This paper proposes a novel method of cluster magnetorheological finishing based on array circular holes polishing disk, which can effectively improve the polishing shear force and polishing efficiency. The appropriate polishing shear force and material removal rate are the keys to achieve low roughness and low damage processing of optoelectronic wafers. Therefore, the shear force model of solid particles in magnetorheological finishing fluid is established based on the tribological principle. The material removal rate model is established by combining the polishing shear force model with the velocity model. The correctness of the above model is verified by the rotary dynamometer and repeated single-factor experiments. The errors between theoretical and experimental values of polishing shear force and material removal rate are 8.8% and 10.8%, respectively. The new magnetorheological finishing method can realize the efficient and ultra-smooth planarization of optoelectronic wafers. The established model can theoretically guide the optimization of the surface structure and polishing process of polishing disks.

Analysis of material removal rate and stability in lap-magnetorheological finishing

2018 ◽  
Vol 57 (05) ◽  
pp. 1 ◽  
Author(s):  
Feng Guan ◽  
Hao Hu ◽  
Shengyi Li ◽  
Xiaoqiang Peng ◽  
Feng Shi
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Magnetorheological Finishing

Effects of Process Parameters on Surface Roughness and MRR in the hard turning of EN 36 steel

2018 ◽  
pp. 102-110
Author(s):  
Amritpal Singh ◽  
Rakesh Kumar
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Hard Turning ◽  
Control Parameter ◽  
Removal Rate ◽  
Cutting Speed ◽  
Depth Of Cut ◽  
Cutting Condition ◽  
Dry Cutting

In the present study, Experimental investigation of the effects of various cutting parameters on the response parameters in the hard turning of EN36 steel under the dry cutting condition is done. The input control parameters selected for the present work was the cutting speed, feed and depth of cut. The objective of the present work is to minimize the surface roughness to obtain better surface finish and maximization of material removal rate for better productivity. The design of experiments was done with the help of Taguchi L9 orthogonal array. Analysis of variance (ANOVA) was used to find out the significance of the input parameters on the response parameters. Percentage contribution for each control parameter was calculated using ANOVA with 95 % confidence value. From results, it was observed that feed is the most significant factor for surface roughness and the depth of cut is the most significant control parameter for Material removal rate.

Performance Analysis of Trihexyltetradecylphosphonium Chloride Ionic Fluid under MQL Condition in Hard turning

2020 ◽  
Vol 17 (1) ◽  
pp. 7629-7647
Author(s):  
A. Pandey ◽  
R. Kumar ◽  
A. K. Sahoo ◽  
A. Paul ◽  
A. Panda
Keyword(s):  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Cutting Speed ◽  
Coconut Oil ◽  
Chip Morphology ◽  
Weight Fraction ◽  
Cutting Fluid ◽  
Depth Of Cut

The current research presents an overall performance-based analysis of Trihexyltetradecylphosphonium Chloride [[CH3(CH2)5]P(Cl)(CH2)13CH3] ionic fluid mixed with organic coconut oil (OCO) during turning of hardened D2 steel. The application of cutting fluid on the cutting interface was performed through Minimum Quantity Lubrication (MQL) approach keeping an eye on the detrimental consequences of conventional flood cooling. PVD coated (TiN/TiCN/TiN) cermet tool was employed in the current experimental work. Taguchi’s L9 orthogonal array and TOPSIS are executed to analysis the influences, significance and optimum parameter settings for predefined process parameters. The prime objective of the current work is to analyze the influence of OCO based Trihexyltetradecylphosphonium Chloride ionic fluid on flank wear, surface roughness, material removal rate, and chip morphology. Better quality of finish (Ra = 0.2 to 1.82 µm) was found with 1% weight fraction but it is not sufficient to control the wear growth. Abrasion, chipping, groove wear, and catastrophic tool tip breakage are recognized as foremost tool failure mechanisms. The significance of responses have been studied with the help of probability plots, main effect plots, contour plots, and surface plots and the correlation between the input and output parameters have been analyzed using regression model. Feed rate and depth of cut are equally influenced (48.98%) the surface finish while cutting speed attributed the strongest influence (90.1%). The material removal rate is strongly prejudiced by cutting speed (69.39 %) followed by feed rate (28.94%) whereas chip reduction coefficient is strongly influenced through the depth of cut (63.4%) succeeded by feed (28.8%). TOPSIS significantly optimized the responses with 67.1 % gain in closeness coefficient.

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