Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using 3D Metal Printing and Metal Injection Molding Technologies

Author(s):  
Jimmy Chuang ◽  
Jin Yang ◽  
David Shia ◽  
Y L Li

Abstract In order to meet increasing performance demand from high-performance computing (HPC) and edge computing, thermal design power (TDP) of CPU and GPU needs to increase. This creates thermal challenge to corresponding electronic packages with respect to heat dissipation. In order to address this challenge, two-phase immersion cooling is gaining attention as its primary mode of heat of removal is via liquid-to-vapor phase change, which can occur at relatively low and constant temperatures. In this paper, integrated heat spreader (IHS) with boiling enhancement features is proposed. 3D metal printing and metal injection molding (MIM) are the two approaches used to manufacture the new IHS. The resultant IHS with enhancement features are used to build test vehicles (TV) by following standard electronic package assembly process. Experimental results demonstrated that boiling enhanced TVs improved two-phase immersion cooling capability by over 50% as compared to baseline TV without boiling enhanced features.

2017 ◽  
Vol 28 (10) ◽  
pp. 2687-2693 ◽  
Author(s):  
Zhiyuan Sun ◽  
Mingli Qin ◽  
Rui Li ◽  
Jidong Ma ◽  
Fei Fang ◽  
...  

2014 ◽  
Vol 879 ◽  
pp. 102-106
Author(s):  
Noorsyakirah Abdullah ◽  
Mohd Afian Omar ◽  
Shamsul Baharin Jamaludin ◽  
Nurazilah Mohd Zainon ◽  
Norazlan Roslani ◽  
...  

Powder injection molding (PIM) is a powder metallurgy process currently used for the production of complicated and near net shape parts of high performance materials [. This technique basically combines the advantages of plastic injection molding and the versatility of the conventional powder metallurgy technique. The process overcomes the shape limitation of powder compaction, the cost of machining, the productivity limits of isostatic pressing and slip casting, and the defect and tolerance limitations of conventional casting [1, 2, . According to German and Bose [, the technology of metal injection molding (MIM) is more complicated than that of the plastic injection molding, which arises from the need to remove the binder and to densify and strengthen the part. The process composed of four sequential steps: mixing of the powder and organic binder, injection molding, debinding where all binders are removed and sintering [1, 2, 3, 4]. If it necessary, secondary operations such as heat treatments after sintering can be performed [1, 2, 3, 4, .


2013 ◽  
Vol 138 (2-3) ◽  
pp. 444-448 ◽  
Author(s):  
Jidong Ma ◽  
Mingli Qin ◽  
Lin Zhang ◽  
Ruijie Zhang ◽  
Lusha Tian ◽  
...  

2016 ◽  
Vol 704 ◽  
pp. 118-121 ◽  
Author(s):  
Toby Tingskog ◽  
Frederic Larouche ◽  
Louis Philippe Lefebvre

Ti 6-4 and other Titanium alloys have great potential for Metal Injection Molding of high performance parts. Markets like Automotive, Aerospace, 3C and sporting goods can benefit from the low density and high strength of Titanium. A new feedstock has been developed that incorporates pre-alloyed Ti 6-4 and discrete additions that simplify MIM processing and enhance properties. Processing and sintering parameters are presented together with mechanical and metallurgical properties of completed parts.


Author(s):  
Nikhil Lakhkar ◽  
Madhusudan Iyengar ◽  
Michael Ellsworth ◽  
Dereje Agonafer

With the continuing industry trends towards smaller, faster and higher power devices, thermal management has become an extremely important element in the development of computer products. The primary goal of a good thermal design is to ensure that the chip can function at its rated frequency, while maintaining its junction temperature below the specified limit, to ensure reliable operation. The use of a heat sink or cold plate to manage the external thermal resistance has been well documented in the literature. However, the measurement of thermal performance of today state-of-the-art cold plates is challenging because of the low value of thermal resistance that they offer to heat dissipation. In this paper, the design of a tester apparatus for such high performance cold plates is presented. The expected performance of the tester is modeled numerically for a heat flux of 250 W/cm2, and for a range of footprint areas of 100-400 mm2. The analysis study is supported by a detailed uncertainty analysis that utilizes a Monte Carlo simulation approach. It was observed that the sum of random and repeatable errors could be controlled to within ±7.5% even for a very high performance cold plate with an effective heat transfer coefficient of 200,000 W/m2-K dissipating 250 W/cm2, with assumed errors in other relevant parameters.


Sign in / Sign up

Export Citation Format

Share Document