scholarly journals Internal Passage Heat Transfer Prediction Using Multiblock Grids and a k-ω Turbulence Model

1996 ◽  
Author(s):  
David L. Rigby ◽  
A. A. Ameri ◽  
E. Steinthorsson
Keyword(s):  
Heat Transfer ◽  
Turbulence Model ◽  
Three Dimensional ◽  
Reynolds Numbers ◽  
Three Dimensional Flow ◽  
Flow And Heat Transfer ◽  
Aspect Ratios ◽  
Single Block ◽  
Multiblock Grid ◽  
Good Agreement

Numerical simulations of the three-dimensional flow and heat transfer in a rectangular duct with a 180° bend were performed. Results are presented for Reynolds numbers of 17,000 and 37,000 and for aspect ratios of 0.5 and 1.0. A k-ω turbulence model with no reference to distance to a wall is used. Direct comparison between single block and multiblock grid calculations are made. Heat transfer and velocity distributions are compared to available literature with good agreement. The multi-block grid system is seen to produce more accurate results compared to a single-block grid with the same number of cells.

Fluid Flow and Heat Transfer in a Novel Microchannel Heat Sink Partially Filled With Metal Foam Medium

2014 ◽  
Vol 6 (2) ◽  
Author(s):  
E. Farsad ◽  
S. P. Abbasi ◽  
M. S. Zabihi
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Metal Foam ◽  
Three Dimensional ◽  
Numerical Data ◽  
Flow And Heat Transfer ◽  
Cooling Devices ◽  
Volume Method ◽  
Steady Laminar ◽  
Good Agreement

Performance of microchannel heatsink (MCHS) partially filled with foam is investigated numerically. The open cell copper foams have the porosity and pore density in the ranges of 60–90% and 60–100 PPI (pore per inch), respectively. The three-dimensional steady, laminar flow, and heat transfer governing equations are solved using finite volume method. The performance of microchannel heatsink is evaluated in terms of overall thermal resistance, pressure drop, and heat transfer coefficient and temperature distribution. It is found that the results of the surface temperature profile are in good agreement with numerical data. The results show the microchannel heatsink with insert foam appears to be good candidates as the next generation of cooling devices for high power electronic devices. The thermal resistance for all cases decreases with the decrease in porosity. The uniformity of temperature in this heatsink is enhanced compared the heatsink with no foam. The thermal resistance versus the pumping power is depicted, it is found that 80% is the optimal porosity for the foam at 60 PPI with a minimum thermal resistance 0.346 K/W. The results demonstrate the microchannel heatsink partially filled with foam is capable for removing heat generation 100 watt over an area of 9 × 10−6 m2 with the temperature of heat flux surface up to 59 °C.

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