A Novel Inorganic Aqueous Solution and its Effect on Liquid Spreading and Freeze/Thaw Processes

2013 ◽  
Author(s):  
Jacob Supowit ◽  
Sean Reilly ◽  
Ladan Amouzegar ◽  
Ivan Catton
Keyword(s):  
Heat Transfer ◽  
Aqueous Solution ◽  
Phase Change ◽  
Melting Process ◽  
Melting Rate ◽  
Working Fluid ◽  
Freeze Thaw ◽  
Liquid Spreading ◽  
Phase Change Heat Transfer ◽  
Inorganic Aqueous Solution

Frozen startup of phase change heat transfer devices is a complex problem that can have a large impact on heat transfer systems. A patented novel working fluid developed at UCLA comprised of an inorganic aqueous solution (IAS) was investigated for potential effects on the freeze/thaw capabilities in phase change heat transfer devices by examining the melting process of droplets. Preliminary visual tests were conducted to gain insight into any physical processes that surface augmentation created by this fluid may have on the freezing and melting process. These tests demonstrated significant differences in liquid spreading, the melting process, and the melting rate of droplets on surfaces pre-treated with IAS. Contact angle measurements exhibited enhanced wetting properties. SEM images of frozen droplets showed that liquid freezes in the small capillary wick formed by the initial evaporation of IAS. Video of melting droplets showed a significant increase in melting rate when the surface was first treated with IAS due to superior liquid spreading.

scholarly journals Investigation of the Use of an Inorganic Aqueous Solution in Copper-Made Phase-Change Heat Transfer Devices

2017 ◽  
Vol 140 (4) ◽  
Author(s):  
Qi Yao ◽  
Jacob Supowit ◽  
Ivan Catton
Keyword(s):  
Heat Transfer ◽  
Aqueous Solution ◽  
Phase Change ◽  
Heat Transfer Performance ◽  
Capillary Rise ◽  
Copper Surface ◽  
Working Fluid ◽  
Transfer Performance ◽  
Phase Change Heat Transfer ◽  
Inorganic Aqueous Solution

A novel inorganic aqueous solution (IAS) is shown to have a better heat transfer performance than water when used as the working fluid in copper-made phase-change heat transfer devices. First, the physical properties of IAS are measured and compared to those of water. Another, a chemical analysis is performed, and the chemical reactions involved between IAS and the copper surface are listed and categorized by their contributions to the heat transfer performance. In addition, a capillary rise test is performed to show how each chemical contributes to the improvement of the surface wettability. Last, using IAS in copper-made phase-change heat transfer devices is discussed, and the main focus is how IAS improves the heat transfer performance by a smaller thermal resistance and a larger critical heat flux. The conclusion is validated by thermo-siphon tests at different inclination angles.

scholarly journals Investigation of the Use of an Inorganic Aqueous Solution in Aluminum-Made Phase-Change Heat Transfer Devices

2017 ◽  
Vol 139 (12) ◽  
Author(s):  
Qi Yao ◽  
Michael J. Stubblebine ◽  
Ivan Catton
Keyword(s):  
Heat Transfer ◽  
Aqueous Solution ◽  
Natural Convection ◽  
Phase Change ◽  
Aluminum Surface ◽  
Back Flow ◽  
Convection Cooling ◽  
Phase Change Heat Transfer ◽  
Aluminum Passivation ◽  
Inorganic Aqueous Solution

An inorganic aqueous solution, known as IAS, has shown its compatibility with aluminum phase-change heat transfer devices. When using IAS in aluminum devices, aluminum prefers to react with the two oxidizers, permanganate and chromate, rather than water to generate a thin and compact layer of aluminum oxide, which protects the aluminum surface and prevents further reactions. In addition, an electrochemical theory of aluminum passivation is introduced, and the existence of an electrochemical cycle is demonstrated by an aluminum thermosiphon test. The electrochemistry cycle, built up by liquid back flow and tube wall, allows the oxidizers to passivate the aluminum surface inside the device without being directly in contact with it. However, failure was detected while using IAS in thermosiphons with air natural convection cooling. The importance of a continuous liquid back flow to aluminum passivation in phase-change heat transfer devices is pointed out, and a vertical thermosiphon test with natural convection cooling is used to demonstrate that a discontinuous liquid back flow is the main reason of the failures.

Using an Inorganic Aqueous Solution (IAS) in Copper and Aluminum Phase Change Heat Transfer Devices

2013 ◽  
Author(s):  
Qi Yao ◽  
Mike Stubblebine ◽  
Sean Reilly ◽  
Ladan Amouzegar ◽  
Ivan Catton
Keyword(s):  
Heat Transfer ◽  
Aqueous Solution ◽  
Heat Transfer Performance ◽  
Working Fluid ◽  
Transfer Performance ◽  
Reactive Material ◽  
Boiling Process ◽  
Phase Change Heat Transfer ◽  
Aluminum Surfaces ◽  
Inorganic Aqueous Solution

A novel Inorganic Aqueous Solution (IAS) is shown to have a better thermal performance than water when used as the working fluid in copper or aluminum made heat transfer devices. The effect of each chemical in the IAS and how it benefits heat transfer performance for different materials is explained. It was found that the IAS fluid reacts with copper and coats the surface with a layer of hydrophilic products during the initial boiling process. The surface roughness and wettability were increased which led to an enhanced heat transfer performance. The IAS passivates aluminum surfaces and makes water compatible for use with aluminum heat transfer devices. In addition, IAS has potential to improve the heat transfer performance by 50% lower the superheat when used with non-reactive material heat transfer devices.

Use of an Inorganic Aqueous Solution to Prevent Non-Condensable Gas Formation in Aluminum Heat Pipes

2013 ◽  
Author(s):  
Michael Stubblebine ◽  
Sean Reilly ◽  
Qi Yao ◽  
Ivan Catton
Keyword(s):  
Heat Transfer ◽  
Aqueous Solution ◽  
Heat Pipe ◽  
Heat Pipes ◽  
Solid Metal ◽  
Aluminum Surface ◽  
Working Fluid ◽  
Water Based ◽  
Inorganic Aqueous Solution ◽  
Over Time

Heat pipes are used in many applications as an effective means for transferring heat from a source to a sink. The basic heat pipe typically consists of a solid metal casing within which a working fluid is sealed inside at a given pressure. The latent heat transfer via the heat pipe’s working fluid allows it to carry a larger amount of heat energy than would normally be possible with an identically dimensioned solid metal rod. Water is often used as a working fluid due to its high heat of vaporization and suitable operating range for electronics cooling. For many applications, especially space, aluminum is desired as a casing material for its high thermal conductivity, low weight, and low cost. However, water is incompatible for use with aluminum heat pipes because it forms a non-condensable gas (NCG), hydrogen, when they contact. In this work, an inorganic aqueous solution (IAS), which has thermophysical properties similar to water, has been used as the working fluid with an aluminum alloy 5052-H2 casing. The prepared thermosiphon underwent long-term lifetime testing and the results indicate no tube failure or significant NCG formation for the duration of the 9 week study. Furthermore, the data indicate that the IAS fluid not only inhibited NCG production but also led to a reduction in heat pipe thermal resistance over time. It is believed that the chemicals in IAS react with the aluminum surface to create a compact oxide layer and electrochemical reaction which prevents hydrogen generation. A secondary, hydrophilic surface coating is also generated by the fluid on top of the first oxide (passivation) layer. This hydrophilic layer is believed to be responsible for the heat transfer enhancement which was observed during testing and the reduction in ΔT (defined as Tevap−Tcond) over time. Aluminum heat pipes used currently in practice utilize ammonia, or other non-water based working fluids, which have inferior latent heats of vaporization compared to water or an aqueous-based fluid such as IAS. The use of aluminum heat pipe casings in combination with a water-based fluid such as IAS has the potential to provide a significant increase in heat transport capability per device unit mass over traditional ammonia charged aluminum heat pipes.

Fabrication of a Vapor Chamber on a Plastic Board

2015 ◽  
Author(s):  
Fumihiko Hideyama ◽  
Shuto Nonoshita ◽  
Yasushi Koito ◽  
Toshio Tomimura
Keyword(s):  
Heat Transfer ◽  
Phase Change ◽  
Low Cost ◽  
Cooling Water ◽  
Working Fluid ◽  
Liquid Volume ◽  
Transient Temperature ◽  
Vapor Chamber ◽  
Condenser Section ◽  
Phase Change Heat Transfer

A vapor chamber is a flat-plate heat pipe, where a cooled (condenser) section is much larger than a heated (evaporator) section, and has been used as a heat spreader to enhance the cooling of electronic devices. An objective of this study is to integrate the vapor chamber into a polycarbonate board. Plastic materials are easy to manufacturing, light weight, low cost, flexible, and then the present study aims at performing a phase-change heat transfer and a heat spreading inside the polycarbonate board. A sintered copper powder and water are used as a wick structure and a working fluid, respectively. In experiments, the heat is applied by a heater while the cooling water is circulated between a thermostatic bath and a cooling jacket. The experiments are conducted changing a liquid volume and a heat input, and the transient temperature distribution of the vapor chamber is measured by thermocouples. For comparison, the experiment is also conducted where the working fluid is not charged into the vapor chamber. Moreover, based on a thermal resistance network, an analytical model of the vapor chamber is made and the analysis is performed on the phase-change heat transfer inside the vapor chamber. From the experimental and analytical results, the heat transfer characteristics of the polymer-based vapor chamber and the effectiveness of the phase-change heat transfer are confirmed.

Fabrication of Heat Pipes on an Acrylic Resin Board

2013 ◽  
Author(s):  
Yasushi Koito ◽  
Hiroyuki Maehara ◽  
Toshio Tomimura
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Phase Change ◽  
Heat Pipe ◽  
Heat Pipes ◽  
Acrylic Resin ◽  
Working Fluid ◽  
Liquid Volume ◽  
Wiring Board ◽  
Phase Change Heat Transfer

As a first step to develop an electronic wiring board in which micro or miniature heat pipes are internally fabricated, the experimental and analytical studies are performed on a wickless gravity-assisted heat pipe, namely thermosyphon, fabricated on a surface of an acrylic resin board. This proposal aims at performing a phase-change heat transfer inside an electronic wiring board having a low thermal conductivity. In experiments, the evaporator section of the heat pipe is heated by a heater while the condenser section is water-cooled by a heat sink. Water is used as a working fluid. Changing a heat input and a liquid volume ratio inside the heat pipe, the temperature distribution is measured by thermocouples and then compared to the case where the working fluid is not charged. Moreover, the simple model of the heat pipe is made based on a thermal resistance network, and the analysis is performed on a phase-change heat transfer and a conductive heat transfer inside the resin board having the heat pipe. The effective thermal conductivity of the heat pipe is evaluated. Although this study is an initial stage, the operational and the heat transfer characteristics of the resin board having the heat pipe are confirmed.

A Capillary-Wick Heat Pipe Fabricated on a Plastic Board (Fundamental Experiments on Heat Transport Characteristics)

2015 ◽  
Author(s):  
Yasushi Koito ◽  
Hiroyuki Maehara ◽  
Daisuke Shimada ◽  
Toshio Tomimura
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Phase Change ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Working Fluid ◽  
Experimental Investigations ◽  
Liquid Volume ◽  
Experimental Conditions ◽  
Phase Change Heat Transfer

A capillary-wick heat pipe having the dimensions of 5.0 mm × 5.0 mm × 100 mm (length) is fabricated on a surface of a plastic board, and the experimental investigations are conducted on the operational characteristics of the heat pipe. Plastics are easy to manufacturing, lightweight, low cost, flexible, and besides, the present study aims at the phase-change heat transfer inside the plastic board. A sintered copper powder and water are used as the wick structure and the working fluid of the heat pipe, respectively. In experiments, an evaporator section of the heat pipe is heated by a heater while a condenser section is water-cooled by a heat sink. A heat input and a liquid volume inside the heat pipe are changed, and the temperature distribution of the heat pipe is measured by thermocouples. Moreover, a one-dimensional thermal circuit model is made to evaluate the effective thermal conductivity of the heat pipe. From the experimental results, the continuous phase-change heat transfer inside the plastic board and its effectiveness are confirmed. It is also revealed that the effective thermal conductivity of the heat pipe is 854 W/(m·K) in maximum under the present experimental conditions.

Sign in / Sign up

Export Citation Format

Share Document