Extensive Experimental Study on Diaphragm-Based Piezoelectric Microphone
Abstract This paper reports our extensive experimental study on diaphragm-based piezoelectric microphones fabricated on a silicon substrate. We have fabricated and carefully analyzed about 60 micromachined piezoelectric microphones (composed of piezoelectric ZnO film, insulating layers and electrodes) built on a low-stress silicon nitride diaphragm (with and without corrugation on the diaphragm and with five kinds of residual stress in the diaphragm). Microphone sensitivity is measured in an acoustic chamber with a B&K4135 microphone. Vertical displacement of a microphone diaphragm under an applied acoustic pressure is measured with a focused-beam laser Doppler displacement meter. Our results show that (1) corrugation releases both tensile stress and compressive stress effectively, and increases the center displacement greatly, (2) a good bending curvature in the active area is needed for a good microphone sensitivity, and (3) ZnO structural integrity is the major factor that affects the bending curvature in the active area.