Thermal Fatigue-Life Prediction of Lead-Free Solder Joints

2004 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Dongkai Shangguan
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Life Prediction ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a plastic ball grid array (PBGA) package assembly is predicted and discussed.

A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

2005 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Walter Dauksher ◽  
Dongkai Shangguan ◽  
Fubin Song ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of plastic ball grid array (PBGA) SnAgCu lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a PBGA package assembly is predicted and compared with thermal cycling test results.

Effects of Dwell-Time on the Thermal-Fatigue Life of SnAgCu Lead-Free Solder Joints

2004 ◽  
Author(s):  
John Lau ◽  
Walter Dauksher
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Dwell Time ◽  
Solder Joints ◽  
Temperature Cycling ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Free Solder

The effects of temperature-cycling dwell-time on the thermal-fatigue life of lead-free solder joints are investigated in this study. Emphasis is placed on the determination of creep responses and the creep strain energy density per cycle of a PBGA (plastic ball grid array) package’s lead-free solder joints subjected to various dwell times (namely, 15, 60, and 480 minutes) at peak cycling temperatures (0°C and 100°C).

scholarly journals Thermal Fatigue Life Simulation for Sn-Ag-Cu Lead-Free Solder Joints

2004 ◽  
Vol 7 (4) ◽  
pp. 308-313 ◽  
Author(s):  
Hiroyuki TAKAHASHI ◽  
Takashi KAWAKAMI ◽  
Minoru MUKAI ◽  
Nobutada OHNO
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Free Solder

Thermal-Fatigue Life Prediction Equation for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints

2005 ◽  
Author(s):  
John Lau ◽  
S. W. Ricky Lee ◽  
Fubin Song ◽  
Dongkai Shangguan ◽  
Dennis C. Lau ◽  
...  
Keyword(s):  
Life Prediction ◽  
Ball Grid Array ◽  
Prediction Equation ◽  
Fatigue Life Prediction ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

A new thermal-fatigue life prediction equation for a class of lead-free solder alloys, 95.5wt%Sn4.0wt%Ag0.5wt%Cu, is proposed in this investigation. The test vehicle consists of a lead-free solder plastic ball grid array (PBGA) package, a lead-free PCB, and lead-free solder paste (95.5wt%Sn3.9wt%Ag0.6wt%Cu). The coefficients of the fatigue equation presented herein are determined by best fit of the test vehicle’s isothermal fatigue data. Failure modes and locations of the failed samples are discussed.

Thermal Fatigue Life Estimation of Lead-Free Solder Using Inelastic Constitutive Model

2002 ◽  
Vol 2002.6 (0) ◽  
pp. 283-284
Author(s):  
Hiroyuki TAKAHASHI ◽  
Takashi KAWAKAMI ◽  
Minoru MUKAI ◽  
Mineo KOBAYASHI ◽  
Nobutada OHNO ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Constitutive Model ◽  
Thermal Fatigue ◽  
Lead Free ◽  
Lead Free Solder ◽  
Life Estimation ◽  
Thermal Fatigue Life ◽  
Fatigue Life Estimation ◽  
Free Solder
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