A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints
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Reliability of plastic ball grid array (PBGA) SnAgCu lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a PBGA package assembly is predicted and compared with thermal cycling test results.
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2014 ◽
Vol 8
(1/2/3)
◽
pp. 3
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2004 ◽
Vol 7
(4)
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pp. 308-313
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2000 ◽
Vol 2000
(0)
◽
pp. 521-522
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