Direct-Write Fabrication of Microchannel in Epoxy Matrix

Microelectromechanical Systems ◽

10.1115/imece2005-82905 ◽

2005 ◽

Cited By ~ 2

Author(s):

Ebrahim Ghafar-Zadeh ◽

Mohamad Sawan ◽

Daniel Therriault

Keyword(s):

Epoxy Matrix ◽

Direct Write ◽

Cmos Circuit ◽

Cmos Chip ◽

On Chip ◽

Nanocomposite Matrix

This paper describes the fabrication of microchannels by direct-write assembly and their integration into CMOS circuit technologies. A robotic apparatus was used to deposit a fugitive ink filament on glass and CMOS chip substrates. An epoxy and a nanocomposite matrix were both used to enclose the ink which was subsequently removed under heat and pressure in order to form a microchannel. Here, we demonstrate the fabrication of a microchannel by direct-write assembly on top of a CMOS chip for potential laboratory-on-chip applications such as bioparticle detection and manipulation.

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Electro-Fluidic Packaging for CMOS Based Laboratory-on-Chips

Microelectromechanical Systems ◽

10.1115/imece2006-14861 ◽

2006 ◽

Author(s):

Ebrahim Ghafar-Zadeh ◽

Mohamad Sawan ◽

Daniel Therriault

Keyword(s):

Epoxy Resin ◽

High Precision ◽

Three Dimensional ◽

Fabrication Process ◽

Moderate Temperature ◽

Direct Write ◽

Deposition Technique ◽

Experimental Section ◽

Cmos Chip ◽

On Chip

Direct-write fabrication process (DWFP) is a robotic deposition technique used to produce planar or three-dimensional (3D) microscale structures. These structures consist of paste-like filaments which are extruded through a micronozzle and deposited on a substrate [1]. These filaments are encapsulated inside an epoxy resin and then melted and removed by applying a moderate temperature for the creation of microfluidic components (e.g., microchannels, reservoirs). Following our previous reports [2–3] on the fabrication of microchannels by DWFP and high precision CMOS capacitive sensors [4], we present in this paper a microfluidic packaging procedure to realize microchannel and fluidic connections on top of CMOS chip. The compatibility of this fluidic packaging procedure with conventional electrical packaging techniques (e.g. wire bonding) is an important advantage of DWFP for CMOS based Laboratory-On-Chip applications. The fabrication challenges are discussed in the experimental section.

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Integrated micromachined decoupled CMOS chip on chip

Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems An Investigation of Micro Structures Sensors Actuators Machines and Robots MEMSYS-97 ◽

10.1109/memsys.1997.581913 ◽

2002 ◽

Cited By ~ 7

Author(s):

M. Schneider ◽

T. Muller ◽

A. Haberli ◽

M. Hornung ◽

H. Baltes

Keyword(s):

Cmos Chip ◽

On Chip

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On-Chip Electrochemical Analysis System Using Nanoelectrodes and Bioelectronic CMOS Chip

IEEE Sensors Journal ◽

10.1109/jsen.2006.881351 ◽

2006 ◽

Vol 6 (5) ◽

pp. 1280-1286 ◽

Cited By ~ 36

Author(s):

X. Zhu ◽

C.H. Ahn

Keyword(s):

Electrochemical Analysis ◽

Cmos Chip ◽

Analysis System ◽

On Chip

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Micro-Organism-on-Chip: Emerging Direct-Write CMOS-Based Platform for Biological Applications

IEEE Transactions on Biomedical Circuits and Systems ◽

10.1109/tbcas.2009.2023453 ◽

2009 ◽

Vol 3 (4) ◽

pp. 212-219 ◽

Cited By ~ 8

Author(s):

Ebrahim Ghafar-Zadeh ◽

Mohamad Sawan ◽

Vamsy P. Chodavarapu

Keyword(s):

Direct Write ◽

Biological Applications ◽

On Chip

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Integration of Lithium Ion Battery and Electrochemical Capacitor Energy Storage Directly On-Chip using Direct Write Dispenser Printing

ECS Meeting Abstracts ◽

10.1149/ma2008-02/9/679 ◽

2008 ◽

Keyword(s):

Energy Storage ◽

Lithium Ion Battery ◽

Lithium Ion ◽

Electrochemical Capacitor ◽

Direct Write ◽

Dispenser Printing ◽

On Chip

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Novel direct-write CMOS-based laboratory-on-chip: Design, assembly and experimental results

Sensors and Actuators A Physical ◽

10.1016/j.sna.2006.05.022 ◽

2007 ◽

Vol 134 (1) ◽

pp. 27-36 ◽

Cited By ~ 47

Author(s):

Ebrahim Ghafar-Zadeh ◽

Mohamad Sawan ◽

Daniel Therriault

Keyword(s):

Experimental Results ◽

Direct Write ◽

Chip Design ◽

On Chip

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A HARDWARE EFFICIENT CASCADABLE CHIP SET FOR ANN'S WITH ON-CHIP BACKPROPAGATION

International Journal of Neural Systems ◽

10.1142/s0129065793000298 ◽

1993 ◽

Vol 04 (04) ◽

pp. 351-358 ◽

Cited By ~ 7

Author(s):

TORSTEN LEHMANN

Keyword(s):

Neural Networks ◽

Artificial Neural Networks ◽

Back Propagation ◽

Feedforward Network ◽

Arbitrary Size ◽

And Topology ◽

Learning Scheme ◽

Cmos Chip ◽

Neuron Chip ◽

On Chip

In this paper, an analogue, cascadable, CMOS chip set for artificial neural networks is presented. The chip set (a synapse chip and a neuron chip) offer on-chip back-propagation learning in a fully parallel, layered, feedforward network of arbitrary size and topology. The learning scheme is implemented with no extra circuits at the synapse sites (compared to the system without the learning scheme) and extra circuits of a complexity only about the same as the neurons at the neuron sites. Also, no additional wiring is required by the learning scheme. Measurements on an experimental chip set are presented.

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Investigation of Intermittent Resistive Faults in Digital CMOS Circuits

Journal of Circuits System and Computers ◽

10.1142/s0218126616400235 ◽

2015 ◽

Vol 25 (03) ◽

pp. 1640023 ◽

Cited By ~ 1

Author(s):

Hans G. Kerkhoff ◽

Hassan Ebrahimi

Keyword(s):

Hardware Implementation ◽

Occurrence Rate ◽

Cmos Circuits ◽

Cmos Circuit ◽

Data Logging ◽

Digital Cmos ◽

Short Pulses ◽

Scientific Challenge ◽

On Chip ◽

The Impact

No fault found (NFF) is a major threat in extremely dependable high-end process node integrated systems, in e.g., avionics. One category of NFFs is the intermittent resistive fault (IRF), often originating from bad (e.g., via- or TSV-based) interconnections. This paper will show the impact of these faults on the behavior of a digital CMOS circuit via simulation. As the occurrence rate of this kind of defects can take e.g., one month, while the duration of the defect can be as short as 50[Formula: see text]ns, thus to evoke and detect these faults is a huge scientific challenge. Two methods to detect short pulses induced by IRFs are proposed. To improve the task of maintenance of avionics and reduce the current high debugging costs, an on-chip data logging system with time stamp and stored environmental conditions is introduced. Finally, a hardware implementation of an IRF generator is presented.

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