Study on Copper Cold Plate Designs for Electronics Liquid Cooling System

2006 ◽  
Author(s):  
Yi. Feng ◽  
Y. Wang ◽  
C. Y. Huang
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Cooling System ◽  
Pure Copper ◽  
Cold Plate ◽  
Performance Limits ◽  
Liquid Cooling ◽  
Cold Plates ◽  
Management Approaches ◽  
Liquid Cooling System

The increasing power consumption of microelectronic systems and the dense layout of semiconductor components leave very limited design spaces with tight constraints for the thermal solution. Conventional thermal management approaches, such as extrusion, fold-fin, and heat pipe heat sinks, are somehow reaching their performance limits, due to the geometry constraints. Currently, more studies have been carried out on the liquid cooling technologies, as the flexible tubing connection of liquid cooling system makes both the accommodation in constrained design space and the simultaneous cooling of multi heating sources feasible. To significantly improve the thermal performance of a liquid cooling system, heat exchangers with more liquid-side heat transfer area with acceptable flow pressure drop are expected. This paper focuses on the performance of seven designs of source heat exchanger (cold plate). The presented cold plates are all made in pure copper material using wire cutting, soldering, brazing, or sintering process. Enhanced heat transfer surfaces such as micro channel and cooper mesh are investigated. Detailed experiments have been conducted to understand the performance of these seven cooper cold plates. The same radiators, fan, and water pump were connected with each cooper cold plate to investigate the overall thermal performance of liquid cooling system. Water temperature readings at the inlets and outlets of radiators, pump, and colder plate have been taken to interpret the thermal resistance distribution along the cooling loop.

Application of Micro-Channel Fin for Cold Plate of Liquid Cooling System and Vapor Chamber

2009 ◽  
Author(s):  
Koichi Mashiko ◽  
Masataka Mochizuki ◽  
Yuji Saito ◽  
Yasuhiro Horiuchi ◽  
Thang Nguyen ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Cooling System ◽  
Cold Plate ◽  
Micro Channel ◽  
Vapor Chamber ◽  
Liquid Cooling ◽  
Liquid Cooling System ◽  
Heat Spreading

Recently energy saving is most important concept for all electric products and production. Especially, in Data-Center cooling system, power consumption of current air cooling system is increasing. For not only improving thermal performance but also reducing electric power consumption of this system, liquid cooling system has been developed. This paper reports the development of cold plate technology and vapor chamber application by using micro-channel fin. In case of cold plate application, micro-channel fin technology is good for compact space design, high thermal performance, and easy for design and simulation. Another application is the evaporating surface for vapor chamber. The well-known devices for effective heat transfer or heat spreading with the lowest thermal resistance are heat pipes and vapor chamber, which are two-phase heat transfer devices with excellent heat spreading and heat transfer characteristics. Normally, vapor chamber is composed of sintered power wick. Vapor chamber container is mechanically supported by stamped pedestal or wick column or solid column, but the mechanical strength is not enough strong. So far, the application is limited in the area of low strength assembly. Sometime the mechanical supporting frame is design for preventing deformation. In this paper, the testing result of sample is described that thermal resistance between the heat source and the ambient can be improved approximately 0.1°C/W by using the micro-channel vapor chamber. Additionally, authors presented case designs using vapor chamber for cooling computer processors, and proposed ideas of using micro-channel vapor chamber for heat spreading to replace the traditional metal plate heat spreader.

Self-Contained, Oscillating Flow Liquid Cooling System for Thin Form Factor High Performance Electronics

2010 ◽  
Vol 132 (5) ◽  
Author(s):  
R. Wälchli ◽  
T. Brunschwiler ◽  
B. Michel ◽  
D. Poulikakos
Keyword(s):  
Heat Transfer ◽  
Form Factor ◽  
Waste Heat ◽  
Cooling System ◽  
Heat Removal ◽  
Flow Loop ◽  
Liquid Cooling ◽  
High Heat Transfer ◽  
Cold Plates ◽  
Liquid Cooling System

A self-contained, small-volume liquid cooling system for thin form-factor electronic equipment (e.g., blade server modules) is demonstrated experimentally in this paper. A reciprocating water flow loop absorbs heat using mesh-type microchannel cold plates and spreads it periodically to a larger area. From there, the thermal energy is interchanged via large area, low pressure drop cold plates with a secondary heat transfer loop (air or liquid). Four phase-shifted piston pumps create either a linearly or radially oscillating fluid flow in the frequency range of 0.5–3 Hz. The tidal displacement of the pumps covers 42–120% of the fluid volume, and, therefore, an average flow rate range of 100–800 ml/min is tested. Three different absorber mesh designs are tested. Thermal and fluidic characteristics are presented in a time-resolved and a time-averaged manner. For a fluid pump power of 1 W, a waste heat flux of 180 W/cm2(ΔT=67 K) could be dissipated from a 3.5 cm2 chip. A linear oscillation flow pattern is advantageous over a radial one because of the more efficient heat removal from the chip and lower hydraulic losses. The optimum microchannel mesh density is determined as a combination of low pump losses and high heat transfer rates.

Performance Measurement of Liquid-Cooled Cold Plates for Humanoid Robot Cooling

2007 ◽  
Author(s):  
Sarng Woo Karng ◽  
Suk Won Lee ◽  
Kyudae Hwang ◽  
Seo Young Kim
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Humanoid Robot ◽  
Cooling System ◽  
Base Plate ◽  
Unit Mass ◽  
Cold Plate ◽  
Transfer Coefficients ◽  
Cold Plates ◽  
Aluminum Base

In this study, we compare thermal performance between one metallic cold plate and three different types of non-metallic cold plates for humanoid robot cooling. The four types of cold plates have the same dimension of 20×20 mm2 base area with 7 mm high. A metallic cold plate is made of copper. Three non-metallic PC (polycarbonate) cold plates, which are designed to reduce the overall weight of robot cooling system, are composed of a polycarbonate cover with three different base shapes. All cold plates are mounted on a 20×20 mm2 copper heating block with two cartridge heaters of 30 W/cm2. The overall heat transfer coefficients per unit mass and thermal resistances are obtained for the liquid-cooled cold plates. It is interesting to note that the PC cold plate with an aluminum base plate with 18 channels shows the best heat transfer performance per unit mass. Most polycarbonate cold plates display fairly comparable thermal performance with more reduced weight compared to a conventional copper cold plate.

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

2019 ◽  
Vol 141 (4) ◽  
Author(s):  
Bharath Ramakrishnan ◽  
Yaser Hadad ◽  
Sami Alkharabsheh ◽  
Paul R. Chiarot ◽  
Bahgat Sammakia
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Thermal Resistance ◽  
High Heat ◽  
High Heat Flux ◽  
Cold Plate ◽  
Liquid Cooling ◽  
Maximum Heat ◽  
Effective Heat ◽  
Cold Plates

Data center energy usage keeps growing every year and will continue to increase with rising demand for ecommerce, scientific research, social networking, and use of streaming video services. The miniaturization of microelectronic devices and an increasing demand for clock speed result in high heat flux systems. By adopting direct liquid cooling, the high heat flux and high power demands can be met, while the reliability of the electronic devices is greatly improved. Cold plates which are mounted directly on to the chips facilitate a lower thermal resistance path originating from the chip to the incoming coolant. An attempt was made in the current study to characterize a commercially available cold plate which uses warm water in carrying the heat away from the chip. A mock package mimicking a processor chip with an effective heat transfer area of 6.45 cm2 was developed for this study using a copper block heater arrangement. The thermo-hydraulic performance of the cold plates was investigated by conducting experiments at varying chip power, coolant flow rates, and coolant temperature. The pressure drop (ΔP) and the temperature rise (ΔT) across the cold plates were measured, and the results were presented as flow resistance and thermal resistance curves. A maximum heat flux of 31 W/cm2 was dissipated at a flow rate of 13 cm3/s. A resistance network model was used to calculate an effective heat transfer coefficient by revealing different elements contributing to the total resistance. The study extended to different coolant temperatures ranging from 25 °C to 45 °C addresses the effect of coolant viscosity on the overall performance of the cold plate, and the results were presented as coefficient of performance (COP) curves. A numerical model developed using 6SigmaET was validated against the experimental findings for the flow and thermal performance with minimal percentage difference.

Analysis and Optimization of Flow and Heat Transfer in a Liquid Cooling System for an LED Array

2011 ◽  
Vol 8 (2) ◽  
pp. 72-82
Author(s):  
Samhitha Poonacha ◽  
Basawaraj ◽  
Hemanth Kumar T.R. Seetharam ◽  
K.N. Seetharamu
Keyword(s):  
Heat Transfer ◽  
Cooling System ◽  
Liquid Cooling ◽  
Flow And Heat Transfer ◽  
Led Array ◽  
Liquid Cooling System

Development of a Mini Liquid Cooling System for High Heat Flux Electronic Devices

2009 ◽  
Author(s):  
Chien-Yuh Yang ◽  
Chun-Ta Yeh ◽  
Kou-Chung Huang ◽  
Shao-Nong Tsai
Keyword(s):  
Flow Rate ◽  
Cooling System ◽  
Maximum Flow ◽  
Maximum Pressure ◽  
High Heat Flux ◽  
Cold Plate ◽  
Liquid Cooling ◽  
Commercial Products ◽  
Micro Pump ◽  
Liquid Cooling System

The size of the most of the current commercialized liquid cooling systems is apparently too large to be easily adapted in a notebook or a mini size desk top computer. This study incorporated the authors’ previous micro heat exchanger design with an extra slim pump concept proposed by a local manufacturer to develop a high performance miniature liquid cooling system. An integrated pump and cold plate assembly was also developed for further reducing the overall size of the system. In comparing to the commercial products, the test results show that the micro pump provides a higher maximum pressure head and maximum flow rate performance. The cold plate has the lowest thermal resistance at moderate and high flow rate region. And the performed of the entire liquid system is similar to that of the recently announced product. It is emphasized that the size of the present developed cold plate, pump and liquid cooling system is much smaller than that of all commercial products.

Study on the Heat Sink Structure and Heat Transfer Effect of Liquid Cooling System for High Power LEDs

2015 ◽  
Vol 35 (3) ◽  
pp. 0323003
Author(s):  
田立新 Tian Lixin ◽  
文尚胜 Wen Shangsheng ◽  
黄伟明 Huang Weiming ◽  
夏云云 Xia Yunyun ◽  
姚日晖 Yao Rihui
Keyword(s):  
Heat Transfer ◽  
High Power ◽  
Heat Sink ◽  
Cooling System ◽  
Transfer Effect ◽  
Liquid Cooling ◽  
Liquid Cooling System
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