Erosion Behavior of Plasma Nitriding Stainless Steel by Molten Sn-Ag-Cu Lead-Free Solder

2011 ◽  
Author(s):  
Naoya Matsubara ◽  
Ikuo Shohji ◽  
Hideyuki Kuwahara
Keyword(s):  
Stainless Steel ◽  
Plasma Nitriding ◽  
Nitrided Layer ◽  
Lead Free ◽  
Lead Free Solder ◽  
Erosion Behavior ◽  
Sus304 Stainless Steel ◽  
Microstructure Observation ◽  
Erosion Test ◽  
Free Solder

The erosion behavior of plasma nitriding SUS304 stainless steel by molten lead-free solder was examined. Plasma nitriding treatment was conducted to the surface of SUS304 steel. The thickness of the nitriding layer was approximately 17 μm. The layer mainly consists of Fe4N, CrN and Cr2N. Erosion of nitriding SUS304 stainless steel was observed after erosion test with molten Sn-3Ag-0.5Cu (mass%) solder at 450°C for 100 h. On the basis of the result of microstructure observation, it was found that Sn diffusion into the nitrided layer occurred in non eroded area. The result shows that Sn diffusion into the nitrided layer induces erosion of plasma nitriding stainless steel.

GS0414 Initial Corrosion Behavior of Stainless Steel in the Molten Lead-free Solder

2016 ◽  
Vol 2016.22 (0) ◽  
pp. _GS0414-1_-_GS0414-2_
Author(s):  
Kenji MIKI ◽  
Akira YAMAUCHI ◽  
Masashi KUROSE ◽  
Makoto NANKO
Keyword(s):  
Stainless Steel ◽  
Corrosion Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Molten Lead ◽  
Free Solder

Effects of Plasma Nitriding on the Erosion Behavior of AISI 403 Stainless Steel Solid State Particles

2014 ◽  
Vol 52 (8) ◽  
pp. 581-588 ◽  
Author(s):  
Kyeong Ho Baik ◽  
Ji Won Seo ◽  
Hee Jin Park ◽  
In Soo Kim ◽  
Byung Il Yang
Keyword(s):  
Stainless Steel ◽  
Solid State ◽  
Plasma Nitriding ◽  
Erosion Behavior

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

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