Fluorocarbon Films Deposited by Deep Reactive Ion Etching for Stiction Minimization of MEMS Structures

2005 ◽  
Author(s):  
Yan Xin Zhuang ◽  
Aric K. Menon
Keyword(s):  
Thermal Stability ◽  
Contact Angle ◽  
Surface Energy ◽  
Reactive Ion Etching ◽  
Adhesive Force ◽  
Measuring System ◽  
Ion Etching ◽  
Deep Reactive Ion Etching ◽  
Fluorocarbon Films ◽  
Nano Scale

Fluorocarbon films, which can be used to minimize stiction of silicon microstructures, have been deposited by passivation process in deep reactive ion etching tool. The wettability, surface energy, nano-scale adhesive force, and thermal stability have been investigated by contact angle measuring system, atomic force microscopy (AFM) and ellipsometry. The fluorocarbon films are good for anti-stiction applications due to their high water contact angle (110°), low surface energy (14.5mJ/m2), low nano-scale adhesive force (33 nN) and high thermal stability up to 300°C.

Superhydrophobic surfaces by dynamic nanomasking and deep reactive ion etching

2007 ◽  
Vol 221 (2) ◽  
pp. 41-48 ◽  
Author(s):  
Ying Song ◽  
Min Zou
Keyword(s):  
Contact Angle ◽  
Au Nanoparticles ◽  
Reactive Ion Etching ◽  
Thin Layers ◽  
Superhydrophobic Surfaces ◽  
Sem Images ◽  
Water Contact ◽  
Ion Etching ◽  
Deep Reactive Ion Etching ◽  
Wetting Properties

This paper reports a study on fabricating superhydrophobic surfaces with micro- and nanohierarchical topography by dynamic nanomasking (DNM) and deep reactive ion etching (DRIE). In this study, thin layers of gold (Au) were sputtered on silicon (Si) wafers followed by annealing the samples in a conventional furnace to break the thin films into Au nanoparticles attached to the Si surfaces. These randomly distributed nanoparticles served as dynamic nanomasks during DRIE processes, in which sulphur hexafluoride (SF6) and octofluorocyclobutane (C4F8) were used as etching and polymerization gases, respectively. Surface topography and wetting properties of the samples were characterized by scanning electron microscopy (SEM) and a video-based optical contact angle meter (VOCAM). SEM images show that this technique created micro-sized craters with Au nanoparticles residing on the ridges of the microstructures. The largest water contact angle (WCA) obtained by this method is about 163°. The surface superhydrophobicity is attributed to the combination of micro- and nano-hierarchical topography and surface polymerization.

Streamlined cryogenic deep reactive ion etching protocol for hybrid micronozzle arrays

2011 ◽  
Vol 21 (10) ◽  
pp. 105001
Author(s):  
Ahmet Erten ◽  
Milan Makale ◽  
Xuekun Lu ◽  
Bernd Fruhberger ◽  
Santosh Kesari ◽  
...  
Keyword(s):  
Reactive Ion Etching ◽  
Ion Etching ◽  
Deep Reactive Ion Etching

scholarly journals Correction to Ultrahigh Resolution Titanium Deep Reactive Ion Etching

2017 ◽  
Vol 9 (27) ◽  
pp. 23263-23263
Author(s):  
Bryan W. K. Woo ◽  
Shannon C. Gott ◽  
Ryan A. Peck ◽  
Dong Yan ◽  
Mathias W. Rommelfanger ◽  
...  
Keyword(s):  
Reactive Ion Etching ◽  
Ultrahigh Resolution ◽  
Ion Etching ◽  
Deep Reactive Ion Etching

Deep reactive ion etching of sub-micrometer trenches with ultra high aspect ratio

2014 ◽  
Vol 113 ◽  
pp. 35-39 ◽  
Author(s):  
Jayalakshmi Parasuraman ◽  
Anand Summanwar ◽  
Frédéric Marty ◽  
Philippe Basset ◽  
Dan E. Angelescu ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Reactive Ion Etching ◽  
Ion Etching ◽  
Deep Reactive Ion Etching

Modeling and simulation of the lag effect in a deep reactive ion etching process

2006 ◽  
Vol 16 (12) ◽  
pp. 2570-2575 ◽  
Author(s):  
Yiyong Tan ◽  
Rongchun Zhou ◽  
Haixia Zhang ◽  
Guizhang Lu ◽  
Zhihong Li
Keyword(s):  
Modeling And Simulation ◽  
Reactive Ion Etching ◽  
Etching Process ◽  
Ion Etching ◽  
Deep Reactive Ion Etching ◽  
Lag Effect
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