Microchannel heat sink with alternating directions of water flow in adjacent channels (Invited Paper)

1992 ◽  
Author(s):  
Leo J. Missaggia ◽  
James N. Walpole
Keyword(s):  
Water Flow ◽  
Heat Sink ◽  
Microchannel Heat Sink ◽  
Adjacent Channels

A CMOS Compatible Metal-Polymer Microchannel Heat Sink for Monolithic Chip Cooling Applications

2010 ◽  
Author(s):  
Aziz Koyuncuog˘lu ◽  
Tuba Okutucu ◽  
Haluk Ku¨lah
Keyword(s):  
Heat Sink ◽  
Complementary Metal Oxide Semiconductor ◽  
Heat Sinks ◽  
Oxide Semiconductor ◽  
Microchannel Heat Sink ◽  
Liquid Cooling ◽  
Chip Cooling ◽  
Electronic Circuitry ◽  
Cmos Compatible ◽  
Adjacent Channels

A novel complementary metal oxide semiconductor (CMOS) compatible microchannel heat sink is designed and fabricated for monolithic liquid cooling of electronic circuits. The microchannels are fabricated with full metal walls between adjacent channels with a polymer top layer for easy sealing and optical visibility of the channels. The use of polymer also provides flexibility in adjusting the width of the channels allowing better management of the pressure drop. The proposed microchannel heat sink requires no design change of the electronic circuitry underneath, hence, can be produced by adding a few more steps to the standard CMOS fabrication flow. The microchannel heat sinks were tested successfully under various heat flux and coolant flow rate conditions. The preliminary cooling tests indicate that the proposed design is promising as a monolithic liquid cooling solution for CMOS circuits.

scholarly journals Error Quantification of Nusselt Number Analysis in Miniature Heat Sinks: Verification and Validation Assessment

2021 ◽  
Author(s):  
Mahyar Pourghasemi ◽  
Nima Fathi
Keyword(s):  
Experimental Data ◽  
Water Flow ◽  
Heat Sink ◽  
Numerical Procedure ◽  
Numerical Results ◽  
Heat Sinks ◽  
Uniform Heat Flux ◽  
Microchannel Heat Sink ◽  
Order Of Accuracy ◽  
Nusselt Numbers

Abstract Solution verification is performed to quantify the numerical uncertainty of Nusselt numbers in micro-scale heat sinks obtained from 3-D numerical simulations. A numerical procedure is first developed to calculate local and average Nusselt numbers along 4 different miniature heat sinks. Validation process is performed by comparing the obtained numerical results experimental data. Fairly good agreement between numerical results and experimental data confirms the reliability and accuracy of the proposed numerical procedure. The observed order of accuracy for water flow in a micro-tube with constant uniform heat flux is 1.81 while the observed order of accuracy for conjugate heat transfer of water flow within a microchannel heat sink is estimated as 1.2. The numerical uncertainty for local Nusselt numbers within the investigated microchannel heat sink is estimated to be 0.13.

Investigation of On-Chip Hot Spot Cooling Using Microchannel Heat Sink

2013 ◽  
Vol 455 ◽  
pp. 466-469
Author(s):  
Yun Chuan Wu ◽  
Shang Long Xu ◽  
Chao Wang
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Hot Spots ◽  
Hot Spot ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Sink ◽  
Three Dimensional Model ◽  
Spot Cooling ◽  
On Chip

With the increase of performance demands, the nonuniformity of on-chip power dissipation becomes greater, causing localized high heat flux hot spots that can degrade the processor performance and reliability. In this paper, a three-dimensional model of the copper microchannel heat sink, with hot spot heating and background heating on the back, was developed and used for numerical simulation to predict the hot spot cooling performance. The hot spot is cooled by localized cross channels. The pressure drop, thermal resistance and effects of hot spot heat flux and fluid flow velocity on the cooling of on-chip hot spots, are investigated in detail.

Sign in / Sign up

Export Citation Format

Share Document