A CMOS Compatible Metal-Polymer Microchannel Heat Sink for Monolithic Chip Cooling Applications

2010 ◽  
Author(s):  
Aziz Koyuncuog˘lu ◽  
Tuba Okutucu ◽  
Haluk Ku¨lah
Keyword(s):  
Heat Sink ◽  
Complementary Metal Oxide Semiconductor ◽  
Heat Sinks ◽  
Oxide Semiconductor ◽  
Microchannel Heat Sink ◽  
Liquid Cooling ◽  
Chip Cooling ◽  
Electronic Circuitry ◽  
Cmos Compatible ◽  
Adjacent Channels

A novel complementary metal oxide semiconductor (CMOS) compatible microchannel heat sink is designed and fabricated for monolithic liquid cooling of electronic circuits. The microchannels are fabricated with full metal walls between adjacent channels with a polymer top layer for easy sealing and optical visibility of the channels. The use of polymer also provides flexibility in adjusting the width of the channels allowing better management of the pressure drop. The proposed microchannel heat sink requires no design change of the electronic circuitry underneath, hence, can be produced by adding a few more steps to the standard CMOS fabrication flow. The microchannel heat sinks were tested successfully under various heat flux and coolant flow rate conditions. The preliminary cooling tests indicate that the proposed design is promising as a monolithic liquid cooling solution for CMOS circuits.

Study on the Performance of a Y-Shaped Liquid Cooling Heat Sink Based on Constructal Law for Electronic Chip Cooling

2020 ◽  
Vol 13 (3) ◽  
Author(s):  
Zhihao Lu ◽  
Kai Zhang
Keyword(s):  
Surface Temperature ◽  
Heat Sink ◽  
Data Center ◽  
Cooling Water ◽  
Heat Sinks ◽  
Liquid Cooling ◽  
Air Conditioning System ◽  
Chip Cooling ◽  
Constructal Law ◽  
Heat Released

Abstract The power of one rack in a data center can be greater than 3 kW, which is released within a relatively small area. However, most of the heat in a data center is released from the electronic chips. Thus, the energy consumption of the air-conditioning system in a data center will be significantly decreased if the heat released by the electronic chips can be reduced directly. Although liquid cooling heat sinks (LCHS) have been demonstrated as an effective way to resolve this problem, the application of LCHS is limited by the uneven cooling distribution on the surface of the electronic chips and the liquid leakage of the LCHS. The constructal law optimizes the design of the pipeline by introducing the freedom of deformation in the fluid geometry to obtain the optimal global performance. In this study, a novel Y-shaped liquid cooling heat sink (YLCHS) was proposed based on the constructal law, in which the cooling water enters the center of the heat sink through the inlet pipe and diffuses into the periphery through the internal Y-shaped microchannels. A numerical simulation was carried out to determine the cooling effect of the YLCHS. Compared to those of the conventional S-shaped liquid cooling heat sink (CSLCHS), the peak surface temperature and the average surface temperature of the electronic chip with YLCHS were decreased by 15.2 °C and 6.3 °C, respectively. Furthermore, the pressure loss of the electronic chip with YLCHS was also reduced by 63.0%.

scholarly journals Effect of liquid cooling on PCR performance with the parametric study of cross-section shapes of microchannels

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Yousef Alihosseini ◽  
Mohammad Reza Azaddel ◽  
Sahel Moslemi ◽  
Mehdi Mohammadi ◽  
Ali Pormohammad ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Cross Section ◽  
Cross Sections ◽  
Heat Sink ◽  
Evaluation Criteria ◽  
Circular Cross Section ◽  
Microchannel Heat Sink ◽  
Liquid Cooling ◽  
Maximum Heat ◽  
Maximum Heat Transfer

AbstractIn recent years, PCR-based methods as a rapid and high accurate technique in the industry and medical fields have been expanded rapidly. Where we are faced with the COVID-19 pandemic, the necessity of a rapid diagnosis has felt more than ever. In the current interdisciplinary study, we have proposed, developed, and characterized a state-of-the-art liquid cooling design to accelerate the PCR procedure. A numerical simulation approach is utilized to evaluate 15 different cross-sections of the microchannel heat sink and select the best shape to achieve this goal. Also, crucial heat sink parameters are characterized, e.g., heat transfer coefficient, pressure drop, performance evaluation criteria, and fluid flow. The achieved result showed that the circular cross-section is the most efficient shape for the microchannel heat sink, which has a maximum heat transfer enhancement of 25% compared to the square shape at the Reynolds number of 1150. In the next phase of the study, the circular cross-section microchannel is located below the PCR device to evaluate the cooling rate of the PCR. Also, the results demonstrate that it takes 16.5 s to cool saliva samples in the PCR well, which saves up to 157.5 s for the whole amplification procedure compared to the conventional air fans. Another advantage of using the microchannel heat sink is that it takes up a little space compared to other common cooling methods.

Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components

2000 ◽  
Author(s):  
X. Wei ◽  
Y. Joshi
Keyword(s):  
Flow Rate ◽  
Heat Sink ◽  
Water Flow Rate ◽  
Heat Removal ◽  
Single Layer ◽  
Heat Sinks ◽  
Computationally Efficient ◽  
Liquid Cooling ◽  
Number Of Layers ◽  
Microelectronic Components

Abstract A novel heat sink based on a multi-layer stack of liquid cooled microchannels is investigated. For a given pumping power and heat removal capability for the heat sink, the flow rate across a stack of microchannels is lower compared to a single layer of microchannels. Numerical simulations using a computationally efficient multigrid method [1] were carried out to investigate the detailed conjugate transport within the heat sink. The effects of the microchannel aspect ratio and total number of layers on thermal performance were studied for water as coolant. A heat sink of base area 10 mm by 10 mm with a height in the range 1.8 to 4.5 mm (2–5 layers) was considered with water flow rate in the range 0.83×10−6 m3/s (50 ml/min) to 6.67×10−6 m3/s (400 ml/min). The results of the computational simulations were also compared with a simplified thermal resistance network analysis.

Performance Comparison of Microchannel Heat Sink Using Boron-Based Ceramic Materials

2021 ◽  
Vol 1163 ◽  
pp. 73-88
Author(s):  
Md Tanbir Sarowar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Sink ◽  
Electronic Devices ◽  
Ceramic Materials ◽  
Substrate Material ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Microchannel Heat Sink ◽  
Small Surface

Microchannel heat sink plays a vital role in removing a considerable amount of heat flux from a small surface area from different electronic devices. In recent times, the rapid development of electronic devices requires the improvement of these heat sinks to a greater extent. In this aspect, the selection of appropriate substrate materials of the heat sinks is of vital importance. In this paper, three boron-based ultra-high temperature ceramic materials (ZrB2, TiB2, and HfB2) are compared as a substrate material for the microchannel heat sink using a numerical approach. The fluid flow and heat transfer are analyzed using the finite volume method. The results showed that the maximum temperature of the heat source didn’t exceed 355K at 3.6MWm-2 for any material. The results also indicated HfB2 and TiB2 to be more useful as a substrate material than ZrB2. By applying 3.6 MWm-2 heat flux at the source, the maximum obtained surface heat transfer coefficient was 175.2 KWm-2K-1 in a heat sink having substrate material HfB2.

Optimization Under Uncertainty of Manifold Microchannel Heat Sinks

2012 ◽  
Author(s):  
Suchismita Sarangi ◽  
Karthik K. Bodla ◽  
Suresh V. Garimella ◽  
Jayathi Y. Murthy
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Heat Sinks ◽  
Optimization Under Uncertainty ◽  
Microchannel Heat Sink ◽  
Probabilistic Optimization ◽  
Manifold Microchannel

Conventional microchannel heat sinks provide good heat dissipation capability but are associated with high pressure drop and corresponding pumping power. The use of a manifold system that distributes the flow into the microchannels through multiple, alternating inlet and outlet pairs is investigated here. This manifold arrangement greatly reduces the pressure drop incurred due to the smaller flow paths, while simultaneously increasing the heat transfer coefficient by tripping the thermal boundary layers. A three-dimensional numerical model is developed and validated, to study the effect of various geometric parameters on the performance of the manifold microchannel heat sink. Apart from a deterministic analysis, a probabilistic optimization study is also performed. In the presence of uncertainties in the geometric and operating parameters of the system, this probabilistic optimization approach yields an optimal design that is also robust and reliable. Uncertainty-based optimization also yields auxiliary information regarding local and global sensitivities and helps identify the input parameters to which outputs are most sensitive. This information can be used to design improved experiments targeted at the most sensitive inputs. Optimization under uncertainty also provides a quantitative estimate of the allowable uncertainty in input parameters for an acceptable uncertainty in the relevant output parameters. The optimal geometric design parameters with uncertainties that maximize heat transfer coefficient while minimizing pressure drop for fixed input conditions are identified for a manifold microchannel heat sink. A comparison between the deterministic and probabilistic optimization results is also presented.

Performance of Concentrator Photovoltaic Systems Integrated With Double Layer Microchannel Heat Sink

2019 ◽  
Author(s):  
Ali Radwan ◽  
Mohamed M. Awad ◽  
Shinichi Ookawara ◽  
Mahmoud Ahmed
Keyword(s):  
Solar Cell ◽  
Double Layer ◽  
Heat Sink ◽  
Flow Boiling ◽  
Microchannel Heat Sink ◽  
Temperature Uniformity ◽  
Liquid Cooling ◽  
Cell Temperature ◽  
Wide Range ◽  
Phase Liquid

Abstract In this study, a new design of double layer microchannel heat sink (DL-MCHS) has been monolithically fabricated using 3D metal printer and experimentally examined as a heat sink for concentrator photovoltaic (CPV) systems. Single phase liquid cooling using ethanol and flow boiling cooling using NOVEC-7000 coolant in the designed DL-MCHS are experimentally compared. The results proved that using the flow boiling cooling technique for the CPV systems attained a lower solar cell temperature with high temperature uniformity. In more details, flow boiling in counterflow (CF) operated DL-MCHS, attained a very low solar cell temperature close to the NOVEC-7000 boiling point with temperature uniformity of 0.2 °C over a wide range of coolant flow rate from 25–250 ml/hr.

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

2019 ◽  
Author(s):  
Devdatta P. Kulkarni ◽  
Priyanka Tunuguntla ◽  
Guixiang Tan ◽  
Casey Carte
Keyword(s):  
Heat Pipe ◽  
High Power ◽  
Heat Sink ◽  
Capital Investment ◽  
Thermal Design ◽  
Heat Sinks ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Pipe Heat

Abstract In recent years, rapid growth is seen in computer and server processors in terms of thermal design power (TDP) envelope. This is mainly due to increase in processor core count, increase in package thermal resistance, challenges in multi-chip integration and maintaining generational performance CAGR. At the same time, several other platform level components such as PCIe cards, graphics cards, SSDs and high power DIMMs are being added in the same chassis which increases the server level power density. To mitigate cooling challenges of high TDP processors, mainly two cooling technologies are deployed: Liquid cooling and advanced air cooling. To deploy liquid cooling technology for servers in data centers, huge initial capital investment is needed. Hence advanced air-cooling thermal solutions are being sought that can be used to cool higher TDP processors as well as high power non-CPU components using same server level airflow boundary conditions. Current air-cooling solutions like heat pipe heat sinks, vapor chamber heat sinks are limited by the heat transfer area, heat carrying capacity and would need significantly more area to cool higher TDP than they could handle. Passive two-phase thermosiphon (gravity dependent) heat sinks may provide intermediate level cooling between traditional air-cooled heat pipe heat sinks and liquid cooling with higher reliability, lower weight and lower cost of maintenance. This paper illustrates the experimental results of a 2U thermosiphon heat sink used in Intel reference 2U, 2 node system and compare thermal performance using traditional heat sinks solutions. The objective of this study was to showcase the increased cooling capability of the CPU by at least 20% over traditional heat sinks while maintaining cooling capability of high-power non-CPU components such as Intel’s DIMMs. This paper will also describe the methodology that will be used for DIMMs serviceability without removing CPU thermal solution, which is critical requirement from data center use perspective.

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