Novel short-pulse laser diode source for high-resolution 3D flash LIDAR

2017 ◽  
Author(s):  
Celine Canal ◽  
Arnaud Laugustin ◽  
Andreas Kohl ◽  
Olivier Rabot
Keyword(s):  
High Resolution ◽  
Pulse Laser ◽  
Laser Diode ◽  
Short Pulse ◽  
Short Pulse Laser ◽  
Flash Lidar

A high-power short-pulse laser diode for an SHG pumping source

2005 ◽  
Author(s):  
M. Kume ◽  
H. Naito ◽  
J. Ohya ◽  
I. Ohta ◽  
H. Shimizu ◽  
...  
Keyword(s):  
Pulse Laser ◽  
Laser Diode ◽  
High Power ◽  
Short Pulse ◽  
Short Pulse Laser

Novel high-energy short-pulse laser diode source for 3D lidar systems

2018 ◽  
Author(s):  
Andreas Kohl ◽  
Celine Canal ◽  
Arnaud Laugustin ◽  
Olivier Rabot
Keyword(s):  
Pulse Laser ◽  
Laser Diode ◽  
Short Pulse ◽  
High Energy ◽  
Short Pulse Laser ◽  
3D Lidar

High-energy, high-resolution x-ray imaging on the Trident short-pulse laser facility

2008 ◽  
Vol 79 (10) ◽  
pp. 10E905 ◽  
Author(s):  
J. Workman ◽  
J. Cobble ◽  
K. Flippo ◽  
D. C. Gautier ◽  
S. Letzring
Keyword(s):  
High Resolution ◽  
Pulse Laser ◽  
Short Pulse ◽  
High Energy ◽  
X Ray ◽  
Short Pulse Laser ◽  
X Ray Imaging ◽  
Laser Facility

A high-power short-pulse laser diode for waveguide second harmonic generation

1991 ◽  
Vol 34 (12) ◽  
pp. 1329-1333 ◽  
Author(s):  
Masahiro Kume ◽  
Hiroki Naito ◽  
Jun Ohya ◽  
Issey Ohta ◽  
Hirokazu Shimizu ◽  
...  
Keyword(s):  
Second Harmonic Generation ◽  
Pulse Laser ◽  
Harmonic Generation ◽  
Laser Diode ◽  
High Power ◽  
Second Harmonic ◽  
Short Pulse ◽  
Short Pulse Laser

Silicon Thinning using Ultra-Short Pulse Laser Ablation

2004 ◽  
Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Sample Preparation ◽  
Pulse Laser ◽  
Pulse Laser Ablation ◽  
Short Pulse ◽  
Special Care ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.

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