Holographic optical probing of the computing properties of single neurons

2021 ◽  
Author(s):  
Vincent Daria
Author(s):  
Ng Sea Chooi ◽  
Chor Theam Hock ◽  
Ma Choo Thye ◽  
Khoo Poh Tshin ◽  
Dan Bockelman

Abstract Trends in the packaging of semiconductors are towards miniaturization and high functionality. The package-on-package(PoP) with increasing demands is beneficial in cost and space saving. The main failure mechanisms associated with PoP technology, including open joints and warpage, have created a lot of challenges for Assembly and Failure Analysis (FA). This paper outlines the sample preparation process steps to overcome the challenges to enable successful failure analysis and optical probing.


Author(s):  
Ryan Xiao ◽  
William Wang ◽  
Ang Li ◽  
Shengqiu Xu ◽  
Binghai Liu

Abstract With the development of semiconductor technology and the increment quantity of metal layers in past few years, backside EFA (Electrical Failure Analysis) technology has become the dominant method. In this paper, abnormally high Signal Noise Ratio (SNR) signal captured by Electro-Optical Probing (EOP)/Laser Voltage Probing (LVP) from backside is shown and the cause of these phenomena are studied. Based on the real case collection, two kinds of failure mode are summarized, and simulated experiments are performed. The results indicate that when a current path from power to ground is formed, the high SNR signal can be captured at the transistor which was on this current path. It is helpful of this consequence for FA to identify the failure mode by high SNR signal.


Author(s):  
Shida Tan ◽  
Richard H. Livengood ◽  
Dane Scott ◽  
Roy Hallstein ◽  
Pat Pardy ◽  
...  

Abstract High resolution optical imaging is critical in assisting backside circuit edit (CE) and optical probing navigation. In this paper, we demonstrated improved optical image quality using VIS-NIR narrow band light emitting diode (LED) illumination in various FIB and optical probing platforms. The proof of concept was demonstrated with both common non-contact air gap lenses and solid immersion lenses (SIL).


Neuron ◽  
2011 ◽  
Vol 69 (3) ◽  
pp. 548-562 ◽  
Author(s):  
Itzhak Fried ◽  
Roy Mukamel ◽  
Gabriel Kreiman

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Anthony D. Fouad ◽  
Alice Liu ◽  
Angelica Du ◽  
Priya D. Bhirgoo ◽  
Christopher Fang-Yen

AbstractLaser microsurgery has long been an important means of assessing the functions of specific cells and tissues. Most laser ablation systems use short, highly focused laser pulses to create plasma-mediated lesions with dimensions on the order of the wavelength of light. While the small size of the lesion enables ablation with high spatial resolution, it also makes it difficult to ablate larger structures. We developed an infrared laser ablation system capable of thermally lesioning tissues with spot sizes tunable by the duration and amplitude of laser pulses. We used our laser system in the roundworm C. elegans to kill single neurons and to sever the dorsal and ventral nerve cords, structures that are difficult to lesion using a plasma-based ablation system. We used these ablations to investigate the source of convulsions in a gain-of-function mutant for the acetylcholine receptor ACR-2. Severing the ventral nerve cord caused convulsions to occur independently anterior and posterior to the lesion, suggesting that convulsions can arise independently from distinct subsets of the motor circuit.


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