Changes in optical interference coatings exposed to 193-nm excimer laser radiation

Author(s):  
Joerg Heber ◽  
Roland Thielsch ◽  
Holger Blaschke ◽  
Norbert Kaiser ◽  
Uwe Leinhos ◽  
...  
1999 ◽  
Vol 138-139 ◽  
pp. 93-96 ◽  
Author(s):  
P Laurens ◽  
B Sadras ◽  
F Decobert ◽  
F Arefi ◽  
J Amouroux

1995 ◽  
Vol 60 (3) ◽  
pp. 261-270 ◽  
Author(s):  
A. Costela ◽  
J. M. Figuera ◽  
F. Florido ◽  
I. Garc�a-Moreno ◽  
E. P. Collar ◽  
...  

1999 ◽  
Vol 69 (7) ◽  
pp. S739-S741 ◽  
Author(s):  
S. Pissadakis ◽  
L. Reekie ◽  
M. Hempstead ◽  
M.N. Zervas ◽  
J.S. Wilkinson

Author(s):  
S. Pissadakis ◽  
S. Mailis ◽  
L. Reekie ◽  
R.W. Eason ◽  
N.A. Vainos ◽  
...  

2013 ◽  
Vol 114 (5) ◽  
pp. 053511 ◽  
Author(s):  
Enamul H. Khan ◽  
S. C. Langford ◽  
J. T. Dickinson ◽  
L. A. Boatner

1986 ◽  
Vol 75 ◽  
Author(s):  
Joseph Zahavi ◽  
Pehr E. Pehrsson

AbstractWe have demonstrated metal deposition on semiconductors immersed in electroplating solution by exposure to UV laser radiation. N-type β-SiC and Si in gold or Pd/Ni electroplating solutions were exposed to 20 ns pulses of 193 nm or 248 nm excimer laser radiation. The energy per pulse was 20–100 mJ. Au and Pd/Ni metallizations deposited in lines and circles on SiC showed leaky Schottky barrier I-V characteristics. The thickness increased with increasing pulse energy or number. Both masked and maskless deposition were demonstrated without apparent damage to the substrate. Details of the process, potential mechanisms, and sample characterization are discussed.


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