Contact pressure distribution of chemical mechanical polishing based on bionic polishing pad

2010 ◽  
Author(s):  
Jun Wang ◽  
Xue-Ling Xing ◽  
Yu-Shan Lu ◽  
Liao-Yuan Zhang
Keyword(s):  
Pressure Distribution ◽  
Contact Pressure ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Contact Pressure Distribution ◽  
Polishing Pad

Analysis on the Contact Pressure Distribution of Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotactic Pattern

2011 ◽  
Vol 215 ◽  
pp. 217-222 ◽  
Author(s):  
Y.S. Lv ◽  
Nan Li ◽  
Jun Wang ◽  
Tian Zhang ◽  
Min Duan ◽  
...  
Keyword(s):  
Pressure Distribution ◽  
Contact Pressure ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Wafer Surface ◽  
Boundary Edge ◽  
Contact Pressure Distribution ◽  
Element Analysis ◽  
Pressure Distributions ◽  
Polishing Pad

In order to make the contact pressure distribution of polishing wafer surface more uniform during chemical mechanical polishing (CMP), a kind of the bionic polishing pad with sunflower seed pattern has been designed based on phyllotaxis theory, and the contact model and boundary condition of CMP have been established. Using finite element analysis, the contact pressure distributions between the polishing pad and wafer have been obtained when polishing silicon wafer and the effects of the phyllotactic parameter of polishing pad on the contact pressure distribution are found. The results show that the uniformity of the contact pressure distribution can be improved and the singularity of the contact pressure in the boundary edge of polished wafer can be decreased when the reasonable phyllotactic parameters are selected.

The Contact Pressure Distribution and its Effects on the Magnetic Disc Substrate Surface Profiles in Chemical Mechanical Polishing

2010 ◽  
Vol 135 ◽  
pp. 84-89
Author(s):  
Yu Shan Lu ◽  
Qi Lin Shu ◽  
Jun Wang
Keyword(s):  
Pressure Distribution ◽  
Contact Pressure ◽  
Chemical Mechanical Polishing ◽  
Substrate Surface ◽  
Mechanical Polishing ◽  
Contact Pressure Distribution ◽  
Study Results ◽  
Surface Profiles ◽  
Magnetic Disc ◽  
Polished Substrate

In order to obtain the contact pressure distribution between the hard disc substrate and the polishing pad and its effects on the profile of polished substrate surface, the elastic contact mechanical model and mathematical equations on the chemical mechanical polishing of the hard magnetic disc substrate are established, and also the relevant boundary conditions are put forward. The contact pressure distribution is calculated with FEM, the polishing experiments are carried out and the surface profiles of polished substrates are obtained. The study results show that the contact pressure distribution on the substrate surface is non-uniformity and the contact pressure in the substrate edge present biggish undulation. Choosing properly the Young’s modulus of the polishing pads and decreasing its Poisson’s ratios can make the uniform area of the contact pressure distribution enlarging and improve the flatness of polished substrate.

Rim Slip and Bead Fitment of Tires: Analysis and Design2

2006 ◽  
Vol 34 (1) ◽  
pp. 38-63 ◽  
Author(s):  
C. Lee
Keyword(s):  
Pressure Distribution ◽  
Contact Pressure ◽  
Frictional Torque ◽  
Finite Element Analyses ◽  
Inflation Pressure ◽  
Contact Pressure Distribution ◽  
Design Modification ◽  
Iterative Design ◽  
Slip Resistance ◽  
Braking Torque

Abstract A tire slips circumferentially on the rim when subjected to a driving or braking torque greater than the maximum tire-rim frictional torque. The balance of the tire-rim assembly achieved with weight attachment at certain circumferential locations in tire mounting is then lost, and vibration or adverse effects on handling may result when the tire is rolled. Bead fitment refers to the fit between a tire and its rim, and in particular, to whether a gap exists between the two. Rim slip resistance, or the maximum tire-rim frictional torque, is the integral of the product of contact pressure, friction coefficient, and the distance to the wheel center over the entire tire-rim interface. Analytical solutions and finite element analyses were used to study the dependence of the contact pressure distribution on tire design and operating attributes such as mold ring profile, bead bundle construction and diameter, and inflation pressure, etc. The tire-rim contact pressure distribution consists of two parts. The pressure on the ledge and the flange, respectively, comes primarily from tire-rim interference and inflation. Relative contributions of the two to the total rim slip resistance vary with tire types, depending on the magnitudes of ledge interference and inflation pressure. Based on the analyses, general guidelines are established for bead design modification to improve rim slip resistance and mountability, and to reduce the sensitivity to manufacturing variability. An iterative design and analysis procedure is also developed to improve bead fitment.

One-Dimensional Contact Pressure Distribution of Radial Tires in Motion

1995 ◽  
Vol 23 (2) ◽  
pp. 116-135 ◽  
Author(s):  
H. Shiobara ◽  
T. Akasaka ◽  
S. Kagami ◽  
S. Tsutsumi
Keyword(s):  
Pressure Distribution ◽  
Contact Pressure ◽  
Experimental Studies ◽  
Rolling Resistance ◽  
Leading Edge ◽  
Forward Direction ◽  
Contact Pressure Distribution ◽  
Support Ring ◽  
One Dimensional ◽  
Lowered Pressure

Abstract The contact pressure distribution and the rolling resistance of a running radial tire under load are fundamental properties of the tire construction, important to the steering performance of automobiles, as is well known. Many theoretical and experimental studies have been previously published on these tire properties. However, the relationships between tire performances in service and tire structural properties have not been clarified sufficiently due to analytical and experimental difficulties. In this paper, establishing a spring support ring model made of a composite belt ring and a Voigt type viscoelastic spring system of the sidewall and the tread rubber, we analyze the one-dimensional contact pressure distribution of a running tire at speeds of up to 60 km/h. The predicted distribution of the contact pressure under appropriate values of damping coefficients of rubber is shown to be in good agreement with experimental results. It is confirmed by this study that increasing velocity causes the pressure to rise at the leading edge of the contact patch, accompanied by the lowered pressure at the trailing edge, and further a slight movement of the contact area in the forward direction.

Analysis of the Contact Deformation of a Radial Tire with Camber Angle

1995 ◽  
Vol 23 (1) ◽  
pp. 26-51 ◽  
Author(s):  
S. Kagami ◽  
T. Akasaka ◽  
H. Shiobara ◽  
A. Hasegawa
Keyword(s):  
Pressure Distribution ◽  
Contact Pressure ◽  
Contact Region ◽  
Contact Deformation ◽  
Contact Pressure Distribution ◽  
Radial Tire ◽  
Ring Model ◽  
Camber Angle ◽  
Contact Free ◽  
Good Agreement

Abstract The contact deformation of a radial tire with a camber angle, has been an important problem closely related to the cornering characteristics of radial tires. The analysis of this problem has been considered to be so difficult mathematically in describing the asymmetric deformation of a radial tire contacting with the roadway, that few papers have been published. In this paper, we present an analytical approach to this problem by using a spring bedded ring model consisting of sidewall spring systems in the radial, the lateral, and the circumferential directions and a spring bed of the tread rubber, together with a ring strip of the composite belt. Analytical solutions for each belt deformation in the contact and the contact-free regions are connected by appropriate boundary conditions at both ends. Galerkin's method is used for solving the additional deflection function defined in the contact region. This function plays an important role in determining the contact pressure distribution. Numerical calculations and experiments are conducted for a radial tire of 175SR14. Good agreement between the predicted and the measured results was obtained for two dimensional contact pressure distribution and the camber thrust characterized by the camber angle.

Measurement and Visualization of the Contact Pressure Distribution of Rubber Disks and Tires

1995 ◽  
Vol 23 (4) ◽  
pp. 238-255 ◽  
Author(s):  
E. H. Sakai
Keyword(s):  
Pressure Distribution ◽  
Contact Pressure ◽  
Contact Area ◽  
Light Absorption ◽  
Lateral Force ◽  
Contact Pressure Distribution ◽  
High Definition ◽  
The Road ◽  
Close Relationship ◽  
Processing Techniques

Abstract The contact conditions of a tire with the road surface have a close relationship to various properties of the tire and are among the most important characteristics in evaluating the performance of the tire. In this research, a new measurement device was developed that allows the contact stress distribution to be quantified and visualized. The measuring principle of this device is that the light absorption at the interface between an optical prism and an evenly ground or worn rubber surface is a function of contact pressure. The light absorption can be measured at a number of points on the surface to obtain the pressure distribution. Using this device, the contact pressure distribution of a rubber disk loaded against a plate was measured. It was found that the pressure distribution was not flat but varied greatly depending upon the height and diameter of the rubber disk. The variation can be explained by a “spring” effect, a “liquid” effect, and an “edge” effect of the rubber disk. Next, the measurement and image processing techniques were applied to a loaded tire. A very high definition image was obtained that displayed the true contact area, the shape of the area, and the pressure distribution from which irregular wear was easily detected. Finally, the deformation of the contact area and changes in the pressure distribution in the tread rubber block were measured when a lateral force was applied to the loaded tire.

scholarly journals Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad

2021 ◽  
Vol 11 (10) ◽  
pp. 4358
Author(s):  
Hanchul Cho ◽  
Taekyung Lee ◽  
Doyeon Kim ◽  
Hyoungjae Kim
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Shape Error ◽  
Profile Shape ◽  
Conditioning Process ◽  
Polishing Pad ◽  
Simulation Based ◽  
Diamond Conditioner ◽  
Pad Conditioning ◽  
Good Agreement

The uniformity of the wafer in a chemical mechanical polishing (CMP) process is vital to the ultra-fine and high integration of semiconductor structures. In particular, the uniformity of the polishing pad corresponding to the tool directly affects the polishing uniformity and wafer shape. In this study, the profile shape of a CMP pad was predicted through a kinematic simulation based on the trajectory density of the diamond abrasives of the diamond conditioner disc. The kinematic prediction was found to be in good agreement with the experimentally measured pad profile shape. Based on this, the shape error of the pad could be maintained within 10 μm even after performing the pad conditioning process for more than 2 h, through the overhang of the conditioner.

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