A study of the adsorption of formic acid and related molecules onto evaporated copper films, both clean and oxide-covered, by infrared ellipsometric spectroscopy

1978 ◽  
Vol 56 (8) ◽  
pp. 1088-1092 ◽  
Author(s):  
Robert William Stobie ◽  
Michael John Dignam
Keyword(s):  
Formic Acid ◽  
Published Data ◽  
Copper Films ◽  
Molecular Processes ◽  
Free Oxygen ◽  
Copper Surfaces ◽  
Spectrum Characteristic ◽  
Carbonate Species

Species formed on evaporated copper surfaces, both clean and oxide-covered, were examined using ir ellipsometric spectroscopy (IRES). Spectra were obtained for CO adsorbed on both bare and oxide-covered copper, the spectra being in accord with published data. No spectra were observed for formic acid adsorption unless free oxygen was present, in which case a spectrum characteristic of a carbonate species was found. Supporting data were obtained to show that the carbonate species was formed by reaction of formic acid and oxygen on the oxide-covered surface. These data illustrate some of the unique advantages of IRES for studying molecular processes on surfaces.

Copper-Coated Cylindrical Internal Reflection Elements for Investigating Interfacial Phenomena

1986 ◽  
Vol 40 (7) ◽  
pp. 1062-1065 ◽  
Author(s):  
Teiki Iwaoka ◽  
Peter R. Griffiths ◽  
John T. Kitasako ◽  
Gill G. Geesey
Keyword(s):  
Copper Film ◽  
Internal Reflection ◽  
Interfacial Phenomena ◽  
Aqueous Environment ◽  
Copper Films ◽  
Depth Of Penetration ◽  
Exponential Relationship ◽  
Copper Surfaces ◽  
Copper Coatings ◽  
The Stability

Techniques for coating thin copper films on the surface of cylindrical germanium internal reflection elements are described. These films were then characterized in an aqueous environment. The expected exponential relationship between the depth of penetration of the evanescent wave into water and the thickness of the copper film was verified experimentally. The stability of vacuum-deposited copper coatings was strong enough that the internal reflection element could be exposed to an aqueous solution of a polysaccharide for more than 40 h. The weak adhesion of polysaccharides to copper surfaces was studied spectroscopically.

New insights into the kinetics of formic acid decomposition on copper surfaces

1986 ◽  
Vol 172 (2) ◽  
pp. 385-397 ◽  
Author(s):  
L.H. Dubois ◽  
T.H. Ellis ◽  
B.R. Zegarski ◽  
S.D. Kevan
Keyword(s):  
Formic Acid ◽  
Acid Decomposition ◽  
Copper Surfaces ◽  
Formic Acid Decomposition ◽  
Kinetics Of

The Structure of the Other Rotamer of Formic Acid, cis-HCOOH1,2

1978 ◽  
Vol 33 (5) ◽  
pp. 610-618 ◽  
Author(s):  
E. Bjarnov ◽  
W. H. Hocking
Keyword(s):  
Formic Acid ◽  
The Other ◽  
Published Data ◽  
Hydrogen Atoms ◽  
Microwave Spectra

The very weak microwave spectra of six isotopically substituted species of formic acid in the cis rotamer form (i.e. with the two hydrogen atoms cis to each other) have been studied. From the data on HC18OOH, HCO18OH, H13COOH, HCOOD, DCOOH and DCOOD, together with the previously published data for HCOOH, the complete substitution structure of the eis rotamer of formic acid has been derived. The structure is: rs(C-H) = 1.105(4) A, rs(C=O) = 1.195(3) A, rs(C-O) = 1.352(3) Å, rs(O-H) = 0.956(5) Å, ∢(OCO) = 122.1(4)°, ∢(HC-O) = 114.6(6)° and ∢(COH) = 109.7(4)°

scholarly journals On the supposed extracellular photosynthesis of carbon dioxide by chlorophyll

1908 ◽  
Vol 80 (536) ◽  
pp. 30-36 ◽  
Keyword(s):  
Carbon Dioxide ◽  
Formic Acid ◽  
The Other ◽  
Free Oxygen

In two recent papers, Usher and Priestley have brought forward evidence to show that chlorophyll is able to assimilate carbon dioxide and produce formaldehyde outside the plant, and that hydroxyl is the other product and is decomposed into water and free oxygen in the presence of a particular ferment. It is, unfortunately, necessary to point out that their work is to some extent vitiated by certain oversights and by one serious inaccuracy. In their first paper they confirm Bach’s statement that formaldehyde is produced when light acts on a solution of uranium in the presence of carbon dioxide and water, although formic acid is much more abundant. In a later paper they contradict this result, stating that formic acid alone is present and no formaldehyde, thus confirming Euler’s criticism of Bach’s Results.

scholarly journals Copper Nitride Nanowire Arrays—Comparison of Synthetic Approaches

Materials ◽  
2021 ◽  
Vol 14 (3) ◽  
pp. 603 ◽  
Author(s):  
Aleksandra Scigala ◽  
Edward Szłyk ◽  
Tomasz Rerek ◽  
Marek Wiśniewski ◽  
Lukasz Skowronski ◽  
...  
Keyword(s):  
Physical Vapor Deposition ◽  
Ammonia Solution ◽  
Nanowire Arrays ◽  
Copper Films ◽  
Copper Nitride ◽  
Copper Surfaces ◽  
Cu Films ◽  
Selected Area Electron Diffraction ◽  
Pure Oxide ◽  
Synthetic Approaches

Copper nitride nanowire arrays were synthesized by an ammonolysis reaction of copper oxide precursors grown on copper surfaces in an ammonia solution. The starting Cu films were deposited on a silicon substrate using two different methods: thermal evaporation (30 nm thickness) and electroplating (2 μm thickness). The grown CuO or CuO/Cu(OH)2 architectures were studied in regard to morphology and size, using electron microscopy methods (SEM, TEM). The final shape and composition of the structures were mostly affected by the concentration of the ammonia solution and time of the immersion. Needle-shaped 2–3 μm long nanostructures were formed from the electrodeposited copper films placed in a 0.033 M NH3 solution for 48 h, whereas for the copper films obtained by physical vapor deposition (PVD), well-aligned nano-needles were obtained after 3 h. The phase composition of the films was studied by X-ray diffraction (XRD) and selected area electron diffraction (SAED) analysis, indicating a presence of CuO and Cu(OH)2, as well as Cu residues. Therefore, in order to obtain a pure oxide film, the samples were thermally treated at 120–180 °C, after which the morphology of the structures remained unchanged. In the final stage of this study, Cu3N nanostructures were obtained by an ammonolysis reaction at 310 °C and studied by SEM, TEM, XRD, and spectroscopic methods. The fabricated PVD-derived coatings were also analyzed using a spectroscopic ellipsometry method, in order to calculate dielectric function, band gap and film thickness.

New insights into the kinetics of formic acid decomposition on copper surfaces

1986 ◽  
Vol 172 (2) ◽  
pp. A345
Author(s):  
L.H. Dubois ◽  
T.H. Ellis ◽  
B.R. Zegarski ◽  
S.D. Kevan
Keyword(s):  
Formic Acid ◽  
Acid Decomposition ◽  
Copper Surfaces ◽  
Formic Acid Decomposition ◽  
Kinetics Of

A low temperature self-reducible copper hydroxide amino–alcohol complex catalyzed by formic acid for conductive copper films

2018 ◽  
Vol 6 (42) ◽  
pp. 11320-11327 ◽  
Author(s):  
Tianke Qi ◽  
Zhaoqiang Zhang ◽  
Yan Li ◽  
Jianzhong Wang ◽  
Fei Xiao
Keyword(s):  
Low Temperature ◽  
Formic Acid ◽  
Amino Alcohol ◽  
Copper Film ◽  
Copper Films ◽  
Copper Hydroxide

Conductive copper film was firstly fabricated from copper hydroxide via a self-reduction of a Cu(OH)2–DMAPD complex catalyzed by formic acid.

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