Geometry-Based Crosstalk Reduction in CNT Interconnects

2019 ◽  
Vol 29 (06) ◽  
pp. 2050094 ◽  
Author(s):  
P. Uma Sathyakam ◽  
P. S. Mallick ◽  
Paridhi Singh
Keyword(s):  
Carbon Nanotube ◽  
Transmission Line ◽  
Vlsi Circuits ◽  
Delay Reduction ◽  
Capacitively Coupled ◽  
Coupling Capacitance ◽  
Propagation Delays ◽  
Crosstalk Reduction ◽  
Global Interconnects ◽  
Transmission Line Models

This paper proposes novel triangular cross-sectioned geometry of carbon nanotube (CNT) bundles for crosstalk and delay reduction in CNT bundle interconnects for VLSI circuits. First, we formulate the equivalent single conductor (ESC) transmission line models of the interconnects. Through SPICE analysis of the ESC circuits, we find the propagation delays of the proposed CNT bundles. Next, we model the capacitively coupled interconnects for crosstalk analysis. It is found that the coupling capacitance of triangular CNT bundle is 29% lesser than the traditionally used square CNT bundles. Further, the crosstalk-induced delay of triangular interconnects is found to be 30% lesser when compared to square bundle interconnects. The reduction in delay is found to increase as the number of CNTs in the bundle increases. So, we suggest that triangular CNT bundles are the most suitable candidates as global interconnects.

Geometry Induced Crosstalk Reduction in CNT Interconnects for VLSI Circuits

2018 ◽  
Vol 24 (8) ◽  
pp. 5778-5784
Author(s):  
P. Uma Sathyakam ◽  
Paridhi Singh ◽  
Priyamanga Bhardwaj ◽  
P. S Mallick
Keyword(s):  
Carbon Nanotube ◽  
Transmission Line ◽  
Vlsi Circuits ◽  
Delay Reduction ◽  
Capacitively Coupled ◽  
Coupling Capacitance ◽  
Crosstalk Reduction ◽  
Global Interconnects ◽  
Transmission Line Models

This paper proposes novel triangular cross sectioned geometry of carbon nanotube (CNT) bundles for crosstalk and hence, delay reduction in CNT bundle interconnects for VLSI circuits. We formulate the equivalent single conductor (ESC) transmission line models of the interconnects and show that the coupling capacitance of triangular bundle is 29% lesser than the traditionally used square bundles of carbon nanotube interconnects. We further simulate the proposed ESC models of capacitively coupled CNT bundle interconnects using Smart SPICE and find that the crosstalk induced delay of triangular interconnects is 30% lesser as compared to square bundle interconnects. The reduction in delay is found to increase as the number of CNTs increase in the bundle. From these results, we suggest that triangle cross-sectioned CNT bundles are the most suitable candidates as global interconnects.

scholarly journals FDTD modeling for Crosstalk Reduction in Coupled RLC Interconnects with Active Shielding

2019 ◽  
Vol 8 (11) ◽  
pp. 1038-1042
Keyword(s):  
Crosstalk Noise ◽  
Delay Reduction ◽  
Proposed Model ◽  
Rlc Interconnects ◽  
Crosstalk Reduction ◽  
Global Interconnects ◽  
Active Shielding

This paper presents efficient geometry for crosstalk noise and delay reduction using Active shielding in RLC interconnects with resistive drivers .FDTD modeling has been used for proposed geometry and is validated by HSPICE simulations for 32nm global interconnects .From the results it has been verified that the proposed model results and HSPICE simulations differ by 5% . From the outcomes it has been confirmed that the proposed model outcomes and HSPICE outcomes differ by 5% and by using proposed geometry crosstalk noise and delay has come down by 73% and 60% when compared to unshielded line

scholarly journals FDTD Modeling with Passive Shielding for Crosstalk Reduction in Coupled RLC Interconnects

2019 ◽  
Vol 8 (3) ◽  
pp. 4965-4970
Keyword(s):  
Crosstalk Noise ◽  
Worst Case ◽  
Delay Reduction ◽  
Proposed Model ◽  
Rlc Interconnects ◽  
Crosstalk Reduction ◽  
Global Interconnects

This paper presents passive shielding technique for crosstalk noise and delay reduction in resistive driven RLC interconnect. FDTD technique is used for modeling proposed geometry. The worst case delay and noise induced due to crosstalk in passive shielded interconnects are compared with unshielded lines and is validated using HSPICE simulations for 32nm global interconnects. From the results it has been demonstrated that the proposed model results and HSPICE simulations differ by 8% and by using proposed geometry crosstalk noise and delay has come down by 90% and 52% when compared to unshielded line.

Composite right/left-handed transmission line with array of thermocouples for generating terahertz radiation

2020 ◽  
Vol 92 (2) ◽  
pp. 20502
Author(s):  
Behrokh Beiranvand ◽  
Alexander S. Sobolev ◽  
Anton V. Kudryashov
Keyword(s):  
Transmission Line ◽  
Terahertz Radiation ◽  
Transmission Lines ◽  
Software Package ◽  
Optical Pulses ◽  
Capacitively Coupled ◽  
Voltage Difference ◽  
Left Handed ◽  
Microwave Transmission ◽  
Commercial Software Package

We present a new concept of the thermoelectric structure that generates microwave and terahertz signals when illuminated by femtosecond optical pulses. The structure consists of a series array of capacitively coupled thermocouples. The array acts as a hybrid type microwave transmission line with anomalous dispersion and phase velocity higher than the velocity of light. This allows for adding up the responces from all the thermocouples in phase. The array is easily integrable with microstrip transmission lines. Dispersion curves obtained from both the lumped network scheme and numerical simulations are presented. The connection of the thermocouples is a composite right/left-handed transmission line, which can receive terahertz radiation from the transmission line ports. The radiation of the photon to the surface of the thermocouple structure causes a voltage difference with the bandwidth of terahertz. We examined a lossy composite right/left-handed transmission line to extract the circuit elements. The calculated properties of the design are extracted by employing commercial software package CST STUDIO SUITE.

Analysis of Thin Film Optical Filters Using Transmission Line Models

1994 ◽  
Vol 23 (1) ◽  
pp. 39-43
Author(s):  
B. Lakshmi ◽  
K. R. Suresh Nair ◽  
Y. G. K. Patro ◽  
B. M. Arora
Keyword(s):  
Thin Film ◽  
Transmission Line ◽  
Optical Filters ◽  
Transmission Line Models

Modeling of Mechanical Systems Using Rigid Bodies and Transmission Line Joints

1999 ◽  
Vol 121 (4) ◽  
pp. 606-611 ◽  
Author(s):  
Petter Krus
Keyword(s):  
Transmission Line ◽  
Hydraulic System ◽  
Large Scale ◽  
Mechanical Systems ◽  
Rigid Bodies ◽  
Large Scale Systems ◽  
Distributed Parameters ◽  
Transmission Line Modeling ◽  
Integration Algorithms ◽  
Transmission Line Models

Dynamic simulation of systems, where the differential equations of the system are solved numerically, is a very important tool for analysis of the detailed behavior of a system. The main problem when dealing with large complex systems is that most simulation packages rely on centralized integration algorithms. For large scale systems, however, it is an advantage if the system can be partitioned in such a way that the parts can be evaluated with only a minimum of interaction. Using transmission line models, with distributed parameters, physically motivated pure time delays are introduced in the communication between components. These models can be used to represent both lines in a hydraulic system and springs in mechanical systems. As a result, components and subsystems can be simulated more independently of each other. In this paper it is shown how flexible joints based on transmission line modeling (TLM) with distributed parameters can be used to simplify modeling of large mechanical link systems interconnected with other physical domains. Furthermore, it provides a straightforward formulation for parallel processing.

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