CASE STUDY: APPLYING DATA MINING TO DEFECT DIAGNOSIS
2004 ◽
Vol 03
(01)
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pp. 69-83
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Keyword(s):
One Year
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One of the defects during the re-flow soldering in printed circuit boards is the defect of tombstone. It is a chip component that has partially or completely lifted off one end of the surface of the pad. Tombstones may be caused by several factors. In this paper, a description of the problem is presented with the factors that cause tombstones. Data mining approaches are presented to identify the factors that are significant. Data was collected over a period of one year to study this problem. Results are presented with suggested improvements.
2012 ◽
Vol 12
(3)
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pp. 271-278
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2018 ◽
Vol 2018.12
(0)
◽
pp. A19
Keyword(s):
Keyword(s):
2013 ◽
Vol 47
◽
pp. 19-25
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2013 ◽
Vol 726-731
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pp. 2865-2869
2015 ◽
Vol 90
◽
pp. 211-219
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2012 ◽
Vol 132
(12)
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pp. 1897-1903
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Keyword(s):
2015 ◽
Vol 135
(1)
◽
pp. 9-16
Keyword(s):