A Case Study of Nickel Dendritic Growth on Printed-Circuit Boards

Author(s):  
Prabjit Singh ◽  
Madhana Sunder ◽  
Eric Campbell ◽  
Larry Palmer
2013 ◽  
Vol 47 ◽  
pp. 19-25 ◽  
Author(s):  
Mattias Lindahl ◽  
Niclas Svensson ◽  
Bo H. Svensson ◽  
Erik Sundin

2013 ◽  
Vol 726-731 ◽  
pp. 2865-2869
Author(s):  
Chih Yen Chou ◽  
Ching Jung Chang ◽  
Alex Wang ◽  
Pei Yao Wu ◽  
Chung Pao Wu

This paper study was commenced to treat fatal contamination at the Er-Jen River, supplied water for agricultural irrigation, aquaculture and industrial in Kaohsiung and Tainan Area, when the Sixth River Management of Water Resources Agency (WRA) developed the project to build flood embankment. The fatal contamination was throw into the discard by illegal manufacturer which discarded the wastage of printed circuit boards, toxic heavy metal contained sludge, and waste aluminum slag. The treatment project was conducted by Industrial Technology Research Institute (ITRI) on preliminary tests, cleanup planning, and process supervision to ensure contamination removal, flood protection, and landscape improvement. The accumulative volume cleaned and screened on this site reached 45,159 cubic meters, whereas 378.25 tons of waste printed circuit boards, 12,833 tons of toxic heavy metal contained sludge, and 31,000 tons of general industrial wastages. The waste printed circuit boards through stripping/acid washing and screening, there are 334.653 tons valuable (including 0.143 tons of copper and 334.51 tons of wire casting materials) from the recycle extract and 43.597 tons of wastes that were not valuable for reutilize. Toxicity characteristic leaching procedure (TCLP) tests were conducted on the site after cleanup to verify the treatment work successful, because the rate of contamination removal was greater than 90%.


2004 ◽  
Vol 03 (01) ◽  
pp. 69-83 ◽  
Author(s):  
M. C. JOTHISHANKAR ◽  
TONG (TERESA) WU ◽  
JOHNIE ROBERTS ◽  
JIUN-YAN SHIAU

One of the defects during the re-flow soldering in printed circuit boards is the defect of tombstone. It is a chip component that has partially or completely lifted off one end of the surface of the pad. Tombstones may be caused by several factors. In this paper, a description of the problem is presented with the factors that cause tombstones. Data mining approaches are presented to identify the factors that are significant. Data was collected over a period of one year to study this problem. Results are presented with suggested improvements.


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