Application of Ion Doping and Excimer Laser Annealing to Fabrication of Low-Temperature Polycrystalline Si Thin-Film Transistors

1994 ◽  
Vol 33 (Part 1, No. 4A) ◽  
pp. 2092-2099 ◽  
Author(s):  
Genshiro Kawachi ◽  
Takashi Aoyama ◽  
Akio Mimura ◽  
Nobutake Konishi
1990 ◽  
Vol 29 (Part 2, No. 12) ◽  
pp. L2370-L2372 ◽  
Author(s):  
Genshiro Kawachi ◽  
Takashi Aoyama ◽  
Takaya Suzuki ◽  
Akio Mimura ◽  
Yasunori Ohno ◽  
...  

2017 ◽  
Vol 110 (13) ◽  
pp. 133503 ◽  
Author(s):  
Juan Paolo S. Bermundo ◽  
Yasuaki Ishikawa ◽  
Mami N. Fujii ◽  
Hiroshi Ikenoue ◽  
Yukiharu Uraoka

1996 ◽  
Vol 420 ◽  
Author(s):  
Kwon-Young Choi ◽  
Jae-Hong Jeon ◽  
Min-Koo Han ◽  
Yong-Sang Kim

AbstractThe performance of polysilicon thin film transistors fabricated by two-step annealing, which consists of furnace annealing and subsequent excimer laser annealing, is described. It was found that the average grain size of low temperature furnace annealed polysilicon films was several times larger than that of excimer laser annealed polysilicon films while the density of in-grain defect in low temperature furnace annealed films was much higher than that of excimer laser annealed film. The device characteristics of the low temperature furnace annealed polysilicon thin film transistors were improved significantly by postannealing, such as high temperature furnace annealing and excimer laser annealing, due to the effective elimination of in-grain defects. The density of trap states, which was extracted from the transfer curves of polysilicon thin film transistors, was used to demonstrate the effects of modifying the deep and tail trap levels by two-step annealing.


2013 ◽  
Vol 102 (12) ◽  
pp. 122107 ◽  
Author(s):  
Mami Fujii ◽  
Yasuaki Ishikawa ◽  
Ryoichi Ishihara ◽  
Johan van der Cingel ◽  
Mohammad R. T. Mofrad ◽  
...  

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