Improved Properties of Silicon Nitride Films Prepared by the Catalytic Chemical Vapor Deposition Method

1997 ◽  
Vol 36 (Part 1, No. 11) ◽  
pp. 7035-7040 ◽  
Author(s):  
Shinya Okada ◽  
Hideki Matsumura
2003 ◽  
Vol 762 ◽  
Author(s):  
A. Izumi ◽  
A. Kikkawa ◽  
K. Higashimine ◽  
H. Matsumura

AbstractThis paper reports about the interface of silicon nitride (SiNx) formed on Si(100) prepared by combination of catalytic-nitridation and catalytic-vapor deposition method in a catalytic chemical vapor deposition system. It is found that flat interface of SiNx/Si(100) is formed by inserting nitridation layer before growing the SiNx films.


1998 ◽  
Vol 508 ◽  
Author(s):  
A. Izumi ◽  
T. Ichise ◽  
H. Matsumura

AbstractSilicon nitride films prepared by low temperatures are widely applicable as gate insulator films of thin film transistors of liquid crystal displays. In this work, silicon nitride films are formed around 300 °C by deposition and direct nitridation methods in a catalytic chemical vapor deposition system. The properties of the silicon nitride films are investigated. It is found that, 1) the breakdown electric field is over 9MV/cm, 2) the surface state density is about 1011cm−2eV−1 are observed in the deposition films. These result shows the usefulness of the catalytic chemical vapor deposition silicon nitride films as gate insulator material for thin film transistors.


2008 ◽  
Vol 516 (5) ◽  
pp. 687-690 ◽  
Author(s):  
Hiroaki Yasuoka ◽  
Masahiro Yoshida ◽  
Ken Sugita ◽  
Keisuke Ohdaira ◽  
Hideyuki Murata ◽  
...  

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