Thermal Stability of Co-Sputtered Ru-Ti Alloy Electrodes for Dynamic Random Access Memory Applications

1998 ◽  
Vol 37 (Part 2, No. 10B) ◽  
pp. L1247-L1250 ◽  
Author(s):  
Ray-Hua Horng ◽  
Dong-Sing Wuu ◽  
Luh-Huei Wu ◽  
Ming-Kwei Lee ◽  
Shih-Hsiung Chan ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Random Access ◽  
Random Access Memory ◽  
Dynamic Random Access Memory ◽  
Ti Alloy ◽  
Access Memory ◽  
Memory Applications ◽  
Thermal Stability Of

Effects of Post-Annealing on the Conduction Properties ofPt/(Ba,Sr)TiO3/PtCapacitors for Dynamic Random Access Memory Applications

1997 ◽  
Vol 36 (Part 1, No. 7A) ◽  
pp. 4382-4385 ◽  
Author(s):  
Jae-Hyun Joo ◽  
Yoo-Chan Jeon ◽  
Jeong-Min Seon ◽  
Ki-Young Oh ◽  
Jae-Sung Roh ◽  
...  
Keyword(s):  
Random Access ◽  
Random Access Memory ◽  
Dynamic Random Access Memory ◽  
Access Memory ◽  
Post Annealing ◽  
Memory Applications ◽  
Conduction Properties

(Ba,Sr)TiO3 thin films with conducting perovskite electrodes for dynamic random access memory applications

1999 ◽  
Vol 74 (21) ◽  
pp. 3194-3196 ◽  
Author(s):  
B. Nagaraj ◽  
T. Sawhney ◽  
S. Perusse ◽  
S. Aggarwal ◽  
R. Ramesh ◽  
...  
Keyword(s):  
Thin Films ◽  
Random Access ◽  
Random Access Memory ◽  
Dynamic Random Access Memory ◽  
Access Memory ◽  
Memory Applications
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