Improved Crystalline Quality of GaN by Substrate Ion Beam Pretreatment

2002 ◽  
Vol 41 (Part 1, No. 6B) ◽  
pp. 4299-4303 ◽  
Author(s):  
Yong Suk Cho ◽  
Junggeun Jhin ◽  
Eui Kwan Koh ◽  
Young Ju Park ◽  
Eun Kyu Kim ◽  
...  
Keyword(s):  
Ion Beam ◽  
Author(s):  
S. Intarasiri ◽  
A. Hallén ◽  
T. Kamwanna ◽  
L.D. Yu ◽  
G. Possnert ◽  
...  

1988 ◽  
Vol 116 ◽  
Author(s):  
Yoshiki Nishibayashi ◽  
Takeshi Imura ◽  
Yukio Osaka ◽  
Hirofumi Fukumoto

AbstractZirconium dioxide (ZrO2) films are deposited on Si(100) and Si(lll) substrates at 800ºC by vacuum evaporation. Channeling spectrum of the Rutherford backscattering shows that ZrO2 films (tetragonal(200)) are epitaxially grown on the Si(100) substrate. The fluctuation of crystallite orientation in the epitaxial layer is estimated to be 0.32º, by analyzing the angular dependence of the aligned and random backscattering spectra. Energy dependence of dechanneling factors in 0.3—2.0 MeV 4He+ indicates that the dominant defect arises from the stackingfaults.


1988 ◽  
Vol 63 (2) ◽  
pp. 581-582 ◽  
Author(s):  
Yukio Osaka ◽  
Takeshi Imura ◽  
Yoshiki Nishibayashi ◽  
Fumitaka Nishiyama

Author(s):  
Alain Claverie ◽  
Zuzanna Liliental-Weber

GaAs layers grown by MBE at low temperatures (in the 200°C range, LT-GaAs) have been reported to have very interesting electronic and transport properties. Previous studies have shown that, before annealing, the crystalline quality of the layers is related to the growth temperature. Lowering the temperature or increasing the layer thickness generally results in some columnar polycrystalline growth. For the best “temperature-thickness” combinations, the layers may be very As rich (up to 1.25%) resulting in an up to 0.15% increase of the lattice parameter, consistent with the excess As. Only after annealing are the technologically important semi-insulating properties of these layers observed. When annealed in As atmosphere at about 600°C a decrease of the lattice parameter to the substrate value is observed. TEM studies show formation of precipitates which are supposed to be As related since the average As concentration remains almost unchanged upon annealing.


Author(s):  
C. Rue ◽  
S. Herschbein ◽  
C. Scrudato ◽  
L. Fischer ◽  
A. Shore

Abstract The efficiency of Gas-Assisted Etching (GAE) and depositions performed using the Focused Ion Beam (FIB) technique is subject to numerous factors. Besides the wellknown primary parameters recommended by the FIB manufacturer (pixel spacing, dwell time, and gas pressures), certain secondary factors can also have a pronounced effect on the quality of these gas-assisted FIB operations. The position of the gas delivery nozzle during XeF2 mills on silicon is examined and was found to affect both the milling speed and the texture on the floor of the FIB trench. Limitations arising from the memory capacity of the FIB computer can also influence process times and trench quality. Exposing the FIB vacuum chamber to TMCTS during SiO2 depositions is found to temporarily impede the performance of subsequent tungsten depositions, especially following heavy or prolonged TMCTS exposure. A delay period may be required to achieve optimal tungsten depositions following TMCTS use. Finally, the focusing conditions of the ion beam are found to have a significant impact on the resistance of FIB-deposited metal films. This effect is attributed to partial milling of the deposition film due to the intense current density of the collimated ion beam. The resistances of metal depositions performed with intentionally defocused ion beams were found to be lower than those performed with focused beams.


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