Excess Carrier Lifetime in a Bulk p-Type 4H–SiC Wafer Measured by the Microwave Photoconductivity Decay Method

2007 ◽  
Vol 46 (8A) ◽  
pp. 5057-5061 ◽  
Author(s):  
Masashi Kato ◽  
Masahiko Kawai ◽  
Tatsuhiro Mori ◽  
Masaya Ichimura ◽  
Shingo Sumie ◽  
...  
2007 ◽  
Vol 556-557 ◽  
pp. 359-362 ◽  
Author(s):  
Masahiko Kawai ◽  
Tatsuhiro Mori ◽  
Masashi Kato ◽  
Masaya Ichimura ◽  
Shingo Sumie ◽  
...  

We carried out mapping of the excess carrier lifetime for a bulk p-type 4H-SiC wafer by the microwave photoconductivity decay (μ-PCD) method, and we compared the lifetime map with structural defect distribution. Several small regions with short lifetimes compared with surrounding parts are found, and they correspond to regions with high-density structural defects. Excess carrier decay curves for this wafer show a slow component, which originates from minority carrier traps. From temperature dependence of the excess carrier decay curve, we found decrease of the time constant of the slow component with increasing temperature. We compared the activation energy of the time constant with that obtained from the numerical simulation, and concluded that the energy level for the minority carrier trap would be 125 meV from the conduction band.


Author(s):  
Masahiko Kawai ◽  
Tatsuhiro Mori ◽  
Masashi Kato ◽  
Masaya Ichimura ◽  
Shingo Sumie ◽  
...  

2012 ◽  
Vol 717-720 ◽  
pp. 305-308 ◽  
Author(s):  
Atsushi Yoshida ◽  
Masashi Kato ◽  
Masaya Ichimura

We obtained excess carrier lifetime maps by the microwave photoconductivity decay (µ-PCD) method in a free-standing n-type 3C-SiC wafer, and then we compared the lifetime maps with distributions of strains and defects observed by the optical microscopy and the Raman spectroscopy. We found that the excess carrier lifetimes are short in a strained region in 3C-SiC, which indicates that structural defects exist around a strained region.


2010 ◽  
Vol 645-648 ◽  
pp. 207-210 ◽  
Author(s):  
Yoshinori Matsushita ◽  
Masashi Kato ◽  
Masaya Ichimura ◽  
Tomoaki Hatayama ◽  
Takeshi Ohshima

We measured the excess carrier lifetimes in as-grown and electron irradiated p-type 4H-SiC epitaxial layers with the microwave photoconductivity decay (-PCD) method. The carrier lifetime becomes longer with excitation density for the as-grown epilayer. This dependence suggests that e ≥h for the dominant recombination center, where e andh are capture cross sections for electrons and holes, respectively. In contrast, the carrier lifetime does not depend on the excitation density for the sample irradiated with electrons at an energy of 160 keV and a dose of 1×1017 cm-2. This may be due to the fact that recombination centers with e <<h were introduced by the electron irradiation or due to the fact that the acceptor concentration was decreased significantly by the irradiation.


2009 ◽  
Vol 615-617 ◽  
pp. 295-298 ◽  
Author(s):  
Laurent Ottaviani ◽  
Olivier Palais ◽  
Damien Barakel ◽  
Marcel Pasquinelli

We report on measurements of the minority carrier lifetime for different epitaxial 4H-SiC layers by using the microwave photoconductivity decay (µ-PCD) method. This is a non-contacting, non-destructive method very useful for the monitoring of recombination processes in semiconductor material. Distinct samples have been analyzed, giving different lifetime values. Transmittance and absorption spectra have also been carried out. The n-type layers, giving rise to a specific absorption peak near 470 nm, are not sensitive to optical excitation for the used wavelengths, as opposite to p-type layers whose lifetime values depend on thickness and doping.


1997 ◽  
Vol 70 (13) ◽  
pp. 1745-1747 ◽  
Author(s):  
M. Ichimura ◽  
H. Tajiri ◽  
Y. Morita ◽  
N. Yamada ◽  
A. Usami

2012 ◽  
Vol 51 (2R) ◽  
pp. 028006 ◽  
Author(s):  
Masashi Kato ◽  
Yoshinori Matsushita ◽  
Masaya Ichimura ◽  
Tomoaki Hatayama ◽  
Takeshi Ohshima

2012 ◽  
Vol 111 (11) ◽  
pp. 113104 ◽  
Author(s):  
M. W. Shura ◽  
V. Wagener ◽  
J. R. Botha ◽  
M. C. Wagener

2009 ◽  
Vol 1153 ◽  
Author(s):  
Jun Wang ◽  
Mahdi Farrokh Baroughi ◽  
Mariyappan Shanmugam ◽  
Roohollah Samadzadeh-Tarighat ◽  
Siva Sivoththaman ◽  
...  

AbstractSurface passivation of silicon substrates using atomic layer deposited Al2O3 and HfO2 thin films are assessed. Al2O3 and HfO2 dielectric layers with various thicknesses were deposited on both sides of n-type (100) FZ-Si substrates (resistivity 4 – 6 Ω-cm) at 200°C by atomic layer deposition (ALD) system. The effective excess carrier lifetime of as-deposited oxide/Si/oxide structure was measured by microwave-photoconductivity-decay (MWPCD) measurement technique and it was observed that the thicker ALD dielectrics lead to higher effective excess carrier lifetime and better surface passivation. The measurements showed average excess carrier lifetime values of 302 μs and 347 μs for as-deposited Al2O3 and HfO2 passivated Si substrates with 150 ALD cycles, respectively. MWPCD and capacitance-voltage (C-V) measurements suggest that as-deposited ALD HfO2 layer leads to a better surface passivation compared to as-deposited ALD Al2O3 layer. Further, the results suggest that there exist fixed negative charges in the bulk of the ALD dielectrics and this contributes to the field effect passivation of the silicon surfaces.


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