Thermal Decomposition of Low Dielectric Constant Pulsed Plasma Fluorocarbon Films: II. Effect of Postdeposition Annealing and Ambients

1999 ◽  
Vol 146 (12) ◽  
pp. 4597-4604 ◽  
Author(s):  
Brett Cruden ◽  
Karen Chu ◽  
Karen Gleason ◽  
Herbert Sawin
1998 ◽  
Vol 84 (1) ◽  
pp. 439-444 ◽  
Author(s):  
Licheng M. Han ◽  
Richard B. Timmons ◽  
Wei W. Lee ◽  
Yuanye Chen ◽  
Zhibing Hu

2007 ◽  
Author(s):  
Azumi Itoh ◽  
Atsutoshi Inokuchi ◽  
Seiji Yasuda ◽  
Akinobu Teramoto ◽  
Tetsuya Goto ◽  
...  

1998 ◽  
Vol 511 ◽  
Author(s):  
Licheng M. Han ◽  
Richard B. Timmons ◽  
Wei W. Lee

ABSTRACTThe utility of a variable duty cycle, pulsed plasma polymerization technique to produce low dielectric constant materials (k < 2.3) is described. The molecular compositions (and thus the dielectric constants) of the plasma polymers are controllable via changes in the plasma duty cycles employed during synthesis, all other reaction variables being held constant. In the present study, this compositional controllability under pulsed conditions is illustrated with two fluoroaromatic monomers. The dielectric constants of the films decrease as the plasma duty cycles employed during polymerization are decreased. Although the as deposited films exhibit relatively poor thermal stability, it was discovered that post-plasma annealing of the films, particularly at 400 °C under N2, provides dramatic improvements in the thermal stability of these materials. Most importantly, this enhanced thermal stability is achieved with relatively minor changes in the dielectric properties of these materials. In fact, synthesis of high thermal stability films having k < 2.0 is demonstrated in this work using the perfluoroaromatic monomer perfluoroallyl benzene.


1998 ◽  
Vol 544 ◽  
Author(s):  
K. K. S. Lau ◽  
K. K. Gleason

IntroductionChemical vapor deposition (CVD) continues to generate immutable interest as a method of producing thin fluorocarbon films. This impetus stems from both the process advantages of CVD and the extensive market potential for the resultant films. Fluorocarbon films find extremely diverse applications because of their unique electrical, chemical and surface properties. They are currently being evaluated, among other applications, as dielectric interconnects in microelectronic circuits1–3 and as passivation coatings in clinical devices.


2008 ◽  
Vol 47 (4) ◽  
pp. 2515-2520 ◽  
Author(s):  
Azumi Itoh ◽  
Atsutoshi Inokuchi ◽  
Seiji Yasuda ◽  
Akinobu Teramoto ◽  
Tetsuya Goto ◽  
...  

2016 ◽  
Vol 31 (8) ◽  
pp. 1027-1037 ◽  
Author(s):  
Nandini G. Sundaram ◽  
Seetharaman Ramachandran ◽  
Lawrence Overzet ◽  
Matthew Goeckner ◽  
Gil-Sik Lee

Abstract


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