A Novel Activation Process for Autocatalytic Electroless Deposition on Silicon Substrates

ABSTRACTA new process for writing a copper pattern into alumina or sapphire substrates is presented. This process employs in sequence ultraviolet laser irradiation and electroless deposition of copper. The laser irradiation activates the substrate and copper is deposited in the activated region when the substrate is immersed in the electroless solution. The laser-activation can be performed months in advance to the deposition.A small amount of metallic aluminum is left on the surface of laser irradiated alumina substrates. The presence of this metallic aluminum appears to play a very important role in the laser surface activation process. In addition to aluminum cluster formation there must be other activation centers that promote copper deposition in laser treated alumina substrates. These catalytic centers are much weaker that the aluminum clusters and have been tentatively identified as surface defects.

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Fabrication of Ordered Metallic Nanocluster Arrays Using a Focused Ion Beam

MRS Proceedings ◽

10.1557/proc-739-h2.7 ◽

2002 ◽

Vol 739 ◽

Author(s):

Matthew D. McMahon ◽

Anthony B. Hmelo ◽

Rene Lopez ◽

Wesley T. Ryle ◽

Allen T. Newton ◽

...

Keyword(s):

Electroless Deposition ◽

Focused Ion Beam ◽

Ion Beam ◽

Laser Deposition ◽

Silicon Substrates ◽

Particle Sizes ◽

Gold Nanocrystals ◽

X Ray ◽

Edx Analysis ◽

Ordered Arrays

ABSTRACTWe have fabricated ordered arrays of gold nanocrystals on FIB-processed silicon substrates using electroless deposition. We have also fabricated ordered arrays of silver nanocrystals on silicon with diameters 40–60 nm separated by 180 nm center-to-center, using pulsed-laser deposition (PLD) to deposit silver on the substrate. The metal nanocrystal arrays are characterized using SEM as well as AFM and energy dispersive x-ray (EDX) analysis. AFM confirms particle sizes measured in SEM, and EDX analysis demonstrates that Ag preferentially clusters at sites that have been damaged by the ion beam. These results suggest that the FIB-PLD combination can be used to create ordered arrays of Ag nanocrystals with diameters of 10 nm or less.

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New Surface-Activation-Process for Electroless Deposition of Adhesive Metal (Ni, Cu) Films on Si Substrates

ECS Meeting Abstracts ◽

10.1149/ma2010-02/31/1966 ◽

2010 ◽

Keyword(s):

Electroless Deposition ◽

Activation Process ◽

Surface Activation ◽

Cu Films ◽

Si Substrates

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A new alternative self-assembled-monolayer activation process for electroless deposition of copper interconnects without a conventional barrier

Electrochemistry Communications ◽

10.1016/j.elecom.2017.12.015 ◽

2018 ◽

Vol 87 ◽

pp. 9-12 ◽

Cited By ~ 6

Author(s):

Giin-Shan Chen ◽

Tzu-Ming Yang ◽

Sung-Te Chen ◽

Yi-Lung Cheng ◽

Jau-Shiung Fang

Keyword(s):

Electroless Deposition ◽

Copper Interconnects ◽

Activation Process ◽

Self Assembled Monolayer ◽

Self Assembled

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Electroless deposition of Ni-P on a silicon surface

Mediterranean Journal of Chemistry ◽

10.13171/mjc64/01705311536-cherkaoui ◽

2017 ◽

Vol 6 (4) ◽

pp. 117-124

Author(s):

Hassan El Grini ◽

Khadija Rahou ◽

Mohammed Cherkaoui ◽

Jean-Noël Chazalviel ◽

François Ozanam ◽

...

Keyword(s):

Electroless Deposition ◽

Sodium Citrate ◽

Ammonium Acetate ◽

Metal Salt ◽

Sodium Hypophosphite ◽

Palladium Chloride ◽

Complexing Agent ◽

Silicon Substrates ◽

Conductive Surface ◽

Deposition Electrolyte

The present article concerns the metallization of silicon substrates by deposition of the nickelphosphorus alloy produced by an autocatalytic chemical process. The deposition electrolyte is composed of a metal salt, a reducing agent (sodium hypophosphite), a complexing agent (sodium citrate) and a buffer (ammonium acetate). The deposition could only be carried out after activation of the silicon by fixing catalytic species on its surface. The immersion of the silicon samples in palladium chloride made it possible to produce relatively thick and regular Ni-P coatings. The immersion time was optimized. The activation of Si was characterized by XPS and the Ni-P coating by XPS and SEM. The electrochemical study did not show any real mechanism changes compared to the Ni-P deposition on a conductive surface.

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