Electrodeposition of Ru onto Ru and Au Seed Layers from Solutions of Ruthenium Nitrosyl Sulfate and Ruthenium Chloride

Author(s):  
Ryan R. Gusley ◽  
Quintin Cumston ◽  
Kevin R. Coffey ◽  
Alan C. West ◽  
Katayun Barmak
2018 ◽  
Author(s):  
Juan Sanz García ◽  
Martial Boggio-Pasqua ◽  
Ilaria Ciofini ◽  
Marco Campetella

<div>The ability to locate minima on electronic excited states (ESs) potential energy surfaces (PESs) both in the case of bright and dark states is crucial for a full understanding of photochemical reactions. This task has become a standard practice for small- to medium-sized organic chromophores thanks to the constant developments in the field of computational photochemistry. However, this remains a very challenging effort when it comes to the optimization of ESs of transition metal complexes (TMCs), not only due to the presence of several electronic excited states close in energy, but also due to the complex nature of the excited states involved. In this article, we present a simple yet powerful method to follow an excited state of interest during a structural optimization in the case of TMC, based on the use of a compact hole-particle representation of the electronic transition, namely the natural transition orbitals (NTOs). State tracking using NTOs is unambiguously accomplished by computing the mono-electronic wavefunction overlap between consecutive steps of the optimization. Here, we demonstrate that this simple but robust procedure works not only in the case of the cytosine but also in the case of the ES optimization of a ruthenium-nitrosyl complex which is very problematic with standard approaches.</div>


2011 ◽  
Vol 32 (4) ◽  
pp. 643-646
Author(s):  
Xiao YANG ◽  
Shiwei LIU ◽  
Congxia XIE ◽  
Shitao YU ◽  
Fusheng LIU
Keyword(s):  

2014 ◽  
Vol 11 (4) ◽  
pp. 501-510 ◽  
Author(s):  
Jan Sorensen ◽  
Mirjam Lilja ◽  
Maria Astrand ◽  
Torben Sorensen ◽  
Philip Procter ◽  
...  
Keyword(s):  

2021 ◽  
Vol 5 (5) ◽  
Author(s):  
Takafumi Nakano ◽  
Tomoya Higo ◽  
Ayuko Kobayashi ◽  
Shinji Miwa ◽  
Satoru Nakatsuji ◽  
...  
Keyword(s):  

RSC Advances ◽  
2016 ◽  
Vol 6 (13) ◽  
pp. 10450-10455 ◽  
Author(s):  
Zhixin Jin ◽  
Yinglin Wang ◽  
Shixin Chen ◽  
Gang Li ◽  
Lingling Wang ◽  
...  

A convenient method to control the morphology of TiO2 NRs and the performance of DSSCs via seed layers is presented.


2002 ◽  
Vol 242-245 ◽  
pp. 297-303 ◽  
Author(s):  
Yukiko Kubota ◽  
Dieter Weller ◽  
Mei-Ling Wu ◽  
Xiaowei Wu ◽  
Ganping Ju ◽  
...  

2006 ◽  
Vol 914 ◽  
Author(s):  
Alain Kaloyeros ◽  
Yu Zhu ◽  
Kathleen Dunn ◽  
Richard Mayti ◽  
Christopher Miller ◽  
...  

AbstractUltra-thin platinum (Pt) films grown by atomic layer deposition (ALD) have been investigated as an alternative to conventional physical vapor deposited (PVD) Cu as seed layer for copper (Cu) electroplating. The wetting angles between the electrolyte and both Pt and Cu seed layers were analyzed using sessile-drop contact-angle analysis prior to plating. Both constant current and pulse reverse current (PRC) were applied to electroplate Cu on both types of blanket seed layers. Scanning electron microscope (SEM) revealed that Cu nucleation density on ALD Pt is lower than on its PVD Cu counterpart, after 30 seconds plating using PRC. Nevertheless, Cu nuclei were observed after only 1.0 minute plating on ALD Pt surfaces, and continuous Cu films were achieved at longer plating times. To fill trench structures coated with ALD Pt/TaN, PRC was applied using the same organic-additive-free electrolyte. Initial results suggest that these seed layers were adequate for ECD fill of trenches with 200 nm feature size and aspect ratio 7:1. The composition and microstructure of the Cu films were analyzed by Auger electron spectroscopy (AES), X-ray diffraction (XRD), and cross-sectional transmission electron microscopy (TEM). Thermal stability of the Cu/Pt system was examined by annealing in forming gas at 450°C for 1 hour and subsequent analysis by XRD and TEM.


2012 ◽  
Vol 2012 ◽  
pp. 1-5 ◽  
Author(s):  
Rakefet Ofek Almog ◽  
Hadar Ben-Yoav ◽  
Yelena Sverdlov ◽  
Tsvi Shmilovich ◽  
Slava Krylov ◽  
...  

Integrated polypyrrole, a conductive polymer, interconnects on polymeric substrates were microfabricated for flexible sensors and actuators applications. It allows manufacturing of moving polymeric microcomponents suitable, for example, for micro-optical-electromechanical (MOEMS) systems or implanted sensors. This generic technology allows producing “all polymer” components where the polymers serve as both the structural and the actuating materials. In this paper we present two possible novel architectures that integrate polypyrrole conductors with other structural polymers: (a) polypyrrole embedded into flexible polydimethylsiloxane (PDMS) matrix forming high aspect ratio electrodes and (b) polypyrrole deposited on planar structures. Self-aligned polypyrrole electropolymerization was developed and demonstrated for conducting polymer lines on either gold or copper seed layers. The electropolymerization process, using cyclic voltammetry from an electrolyte containing the monomer, is described, as well as the devices’ characteristics. Finally, we discuss the effect of integrating conducting polymers with metal seed layer, thus enhancing the device durability and reliability.


2006 ◽  
Vol 45 (21) ◽  
pp. 8608-8617 ◽  
Author(s):  
Mariela Videla ◽  
Julián S. Jacinto ◽  
Ricardo Baggio ◽  
María T. Garland ◽  
Priti Singh ◽  
...  

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