Hybrid orientation Si-Si interfaces by hydrophilic wafer bonding and high
temperature oxide dissolution: wafer fabrication technique and device
applications
2008 ◽
Vol 155
(2)
◽
pp. H80
◽
1993 ◽
Vol 07
(16n17)
◽
pp. 3077-3093
◽
Keyword(s):
Keyword(s):
1997 ◽
Vol 36
(1-4)
◽
pp. 87-90
◽
2006 ◽
pp. 1-12
◽