Factors Contributing to the Defect in Wafer Fabrication Process: A Case Study of Manufacturer in Semiconductors Product

2018 ◽  
Vol 24 (7) ◽  
pp. 4966-4968
Author(s):  
Mashitah Mohamed Esa ◽  
Nor Azian Abdul Rahman ◽  
Shatina Saad ◽  
Norina Ahmad Jamil ◽  
Nur Athirah
Keyword(s):  
Fabrication Process ◽  
Wafer Fabrication

Predictive Analytics for Equipment Maintenance Operations

2022 ◽  
pp. 340-358
Author(s):  
Simon J. Preis
Keyword(s):  
Semiconductor Manufacturing ◽  
Predictive Analytics ◽  
Fabrication Process ◽  
Wafer Fabrication ◽  
Equipment Maintenance ◽  
Main Research ◽  
Challenges And Opportunities ◽  
Potential Benefits

Predictive maintenance (PdM) is a key application of data analytics in semiconductor manufacturing. The optimization of equipment performance has been found to deliver significant revenue benefits, especially in the wafer fabrication process. This chapter addresses two main research objectives: first, to investigate the particular challenges and opportunities of implementing PdM for wafer fabrication equipment and, second, to identify the implications of PdM on key performance indicators in the wafer fabrication process. The research methodology is based on a detailed case study of a wafer fabrication facility and expert interviews. The findings indicate the potential benefits of PdM beyond improving equipment maintenance operations, and the chapter concludes that the quality of analytics models for PdM in wafer fabrication is critical, but this depends on challenging data preparation processes, per machine type. Without valid predictions, decision-making ability and benefits delivery will be limited.

Capacity Planning for Cluster Tools of Wafer Fabrication Plant

2010 ◽  
Vol 450 ◽  
pp. 365-368
Author(s):  
James C. Chen ◽  
Chia Wen Chen ◽  
Kou Huang Chen ◽  
Chien Hsin Lin
Keyword(s):  
Capacity Planning ◽  
Production Costs ◽  
Wafer Fabrication ◽  
Total Production ◽  
Output Rate ◽  
Cluster Tools ◽  
And Performance ◽  
Using Data ◽  
Capital Intensive

Wafer fabrication is a capital intensive industry. A 12-inch wafer fabrication plant needs a typical investment of US$ 3 billion, and the equipment cost constitutes about two-thirds to three-quarters of the total production costs. Therefore, capacity planning is crucial to the investment and performance of wafer fabrication plants. Several formulae are presented to calculate the required number of machines with sequential, parallel, and batch processing characteristics, respectively. An AutoSched AP simulation model using data from real foundry fabrication plants is used in a case study to evaluate the performance of the proposed formulae. Simulation results indicate that the proposed formulae can quickly and accurately calculate the required number of cluster tools leading to the required monthly output rate.

Considerations on Ultra-Thin Substrate-Less Micro and Nano Systems

2011 ◽  
Author(s):  
Hans H. Gatzen ◽  
Tim Griesbach ◽  
Marc C. Wurz ◽  
Lutz Rissing
Keyword(s):  
Sacrificial Layer ◽  
Mechanical Systems ◽  
Fabrication Process ◽  
Wafer Fabrication ◽  
Flexible Part ◽  
New Devices

For accomplishing ultra-thin micro and nano electromechanical mechanical systems (MEMS / NEMS), we are proposing an approach with substrate-less devices. Instead of fabricating thin devices on regular thickness wafers and thinning down the wafer at the end, the new devices are still fabricated on a thick handling wafer, but are released from them. This is done by means of a sacrificial layer below the device dissolved at the end of the wafer fabrication process. For still achieving sufficient device stiffness, an organic carrier-foil is integrated into the component, resulting in a flexible part with similarities to a macroscopic decal. For avoiding a warping particularly for multilayer devices, a compensation of the film is necessary.

scholarly journals Fuzzy TOPSIS for Multiresponse Quality Problems in Wafer Fabrication Processes

2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
Chiun-Ming Liu ◽  
Mei-Yu Ji ◽  
Wen-Chieh Chuang
Keyword(s):  
Integrated Circuit ◽  
Fuzzy Topsis ◽  
Quality Characteristics ◽  
Fabrication Process ◽  
Wafer Fabrication ◽  
Uncertain Environments ◽  
Real World Data ◽  
Multiple Quality Characteristics ◽  
Order Preference ◽  
Topsis Approach

The quality characteristics in the wafer fabrication process are diverse, variable, and fuzzy in nature. How to effectively deal with multiresponse quality problems in the wafer fabrication process is a challenging task. In this study, the fuzzy technique for order preference by similarity to an ideal solution (TOPSIS), one of the fuzzy multiattribute decision-analysis (MADA) methods, is proposed to investigate the fuzzy multiresponse quality problem in integrated-circuit (IC) wafer fabrication process. The fuzzy TOPSIS is one of the effective fuzzy MADA methods for dealing with decision-making problems under uncertain environments. First, a fuzzy TOPSIS methodology is developed by considering the ambiguity between quality characteristics. Then, a detailed procedure for the developed fuzzy TOPSIS approach is presented to show how the fuzzy wafer fabrication quality problems can be solved. Real-world data is collected from an IC semiconductor company and the developed fuzzy TOPSIS approach is applied to find an optimal combination of parameters. Results of this study show that the developed approach provides a satisfactory solution to the wafer fabrication multiresponse problem. This developed approach can be also applied to other industries for investigating multiple quality characteristics problems.

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