Characteristic Corrosion Resistance of Nanocrystalline TiN Films Prepared by High Density Plasma Reactive Magnetron Sputtering

2013 ◽  
Vol 13 (7) ◽  
pp. 4601-4607
Author(s):  
J. H. Kim ◽  
C. G. Kang ◽  
Y. T. Kim ◽  
W. S. Cheong ◽  
P. K. Song
Keyword(s):  
Corrosion Resistance ◽  
Magnetron Sputtering ◽  
High Density ◽  
Reactive Magnetron Sputtering ◽  
Reactive Magnetron ◽  
Tin Films ◽  
Density Plasma

Tribological behavior of TiN films depositid by reactive magnetron sputtering under low pressure

2016 ◽  
Vol 37 (3) ◽  
pp. 289-292 ◽  
Author(s):  
M. V. Ermolenko ◽  
S. M. Zavadski ◽  
D. A. Golosov ◽  
S. N. Melnikov ◽  
E. G. Zamburg
Keyword(s):  
Magnetron Sputtering ◽  
Tribological Behavior ◽  
Low Pressure ◽  
Reactive Magnetron Sputtering ◽  
Reactive Magnetron ◽  
Tin Films

Deposition of thin TiN films by low-power reactive magnetron sputtering

1997 ◽  
Author(s):  
P.V. Mikhalchuk ◽  
A.A. Orlikovsky ◽  
A.G. Vasiliev ◽  
O.I. Lebedev ◽  
D.N. Zakharov
Keyword(s):  
Magnetron Sputtering ◽  
Low Power ◽  
Reactive Magnetron Sputtering ◽  
Reactive Magnetron ◽  
Tin Films

Characterization of Titanium Nitride Films Prepared by DC Reactive Magnetron Sputtering at Different Deposition Time

2007 ◽  
Author(s):  
Kai Yang ◽  
Jianqing Jiang ◽  
Mingyuan Gu
Keyword(s):  
Magnetron Sputtering ◽  
Film Thickness ◽  
Titanium Nitride ◽  
Deposition Time ◽  
Adhesive Property ◽  
Preferred Orientation ◽  
Reactive Magnetron Sputtering ◽  
Reactive Magnetron ◽  
Tin Films ◽  
Dc Reactive Magnetron Sputtering

Titanium nitride (TiN) films were grown on Si (111) and 95W18Cr4V high-speed steel substrates using DC reactive magnetron sputtering technique with different deposition time. The changes in crystal growth orientation of the TiN films were measured by X-ray diffraction (XRD). The surface & cross-sectional morphologies of TiN films were analyzed using field emission scanning electron microscopy (FESEM). The hardness and adhesive property of TiN films were evaluated as well. It is found that the increase of the film thickness favors the formation of the {111} preferred orientation of TiN films. When the {111} preferred orientation is presented, TiN films exhibit a kind of surface morphology of triangular pyramid with right angles. With the increase of the film thickness, the columnar grains continuously grow lengthwise and breadthwise. The size of grains influences the hardness of TiN films more greatly. The adhesive property of the film/substrate interface decreased with increasing film thickness.

Deposition of thin TiN films by low-power reactive magnetron sputtering

1998 ◽  
Author(s):  
P.V. Mikhal'chuk ◽  
A.A. Orlikovsky ◽  
A.G. Vasiliev ◽  
O.I. Lebedev ◽  
D.N. Zakharov
Keyword(s):  
Magnetron Sputtering ◽  
Low Power ◽  
Reactive Magnetron Sputtering ◽  
Reactive Magnetron ◽  
Tin Films
Sign in / Sign up

Export Citation Format

Share Document