Electro-Thermal Actuator for On-Chip Nanoscale Tensile Tests: Analytical Modelling and Multi-Physics Simulations

2007 ◽  
Vol 5 (3) ◽  
pp. 592-607 ◽  
Author(s):  
Alberto Corigliano ◽  
Livio Domenella ◽  
Horacio D. Espinosa ◽  
Yong Zhu
Keyword(s):  
Tensile Tests ◽  
Analytical Modelling ◽  
Thermal Actuator ◽  
On Chip

Mechanical Characterization of Polysilicon Through On-Chip Tensile Tests

2004 ◽  
Vol 13 (2) ◽  
pp. 200-219 ◽  
Author(s):  
A. Corigliano ◽  
B. DeMasi ◽  
A. Frangi ◽  
C. Comi ◽  
A. Villa ◽  
...  
Keyword(s):  
Mechanical Characterization ◽  
Tensile Tests ◽  
On Chip

Improved Nanopositioning Resolution Through Piezoresistive Feedback Control of a MEMS Thermal Actuator

2005 ◽  
Author(s):  
Robert K. Messenger ◽  
Timothy W. McLain ◽  
Larry L. Howell
Keyword(s):  
Electron Microscope ◽  
Feedback Control ◽  
Closed Loop ◽  
Thermal Actuator ◽  
Displacement Sensor ◽  
Mems Devices ◽  
Performance Improvements ◽  
On Chip ◽  
Process Measurements ◽  
Scanning Electron

Utilizing the piezoresistive properties of polysilicon as an on-chip sensing mechanism facilitates the implementation of feedback control on surface-micromachined MEMS devices. We have performed nanopositioning resolution tests on a MEMS thermal actuator, both open and closed loop, to demonstrate the performance improvements possible with feedback control. A thermomechanical in-plane microactuator (TIM), fabricated using the MUMPS fabrication process, was used in this study. The actuator was coupled to a piezoresistive displacement sensor (PRDS) that was fabricated as part of the same process. Measurements of the actuator output, taken using a scanning electron microscope, show that nanopositioning repeatability improved from ±59 nm to ±31 nm when feedback control is employed.

Time-Invariant Deformation of Blood During Necking on an Electrowetting Digital Microfluidic Platform

2019 ◽  
Author(s):  
Curtis Young ◽  
Anand K. Ramasubramanian ◽  
Melinda Simon ◽  
Sang-Joon John Lee
Keyword(s):  
Whole Blood ◽  
Tensile Tests ◽  
Exponential Model ◽  
Width Ratio ◽  
Electrowetting On Dielectric ◽  
Neck Width ◽  
On Chip ◽  
Digital Microfluidic ◽  
Time Invariant ◽  
Neck Radius

Abstract Recent developments in electrowetting-on-dielectric (EWOD) technology have expanded the possibilities for testing methods and investigation of blood. This work evaluated the development of necking geometry of whole blood on an EWOD-based digital microfluidic (DMF) platform. This was achieved by performing tensile tests on whole blood on an EWOD-based device, thereby inducing necking. A time-invariant method was used to evaluate the deformation of the tested dilutions, using minimum neck width and neck radius as two characteristic parameters of the necking geometry. Experiments were performed on blood diluted with phosphate-buffered saline (PBS) at dilutions of 1:20 and 1:10 by volume. Parameter measurements were obtained by recording microscope video of on-chip tensile tests and extracting the necking profile. Neck radius and neck width are obtained from the extracted necking profile and evaluated to compare results. Results from tensile tests on blood at different dilutions showed an exponential decrease in neck radius as neck width decreases. A four-parameter exponential model was fit to the collected data, showing that the 1:20 dilution had a higher neck radius to neck width ratio than the 1:10 dilution over a neck width interval of 0.3 mm to 1.7 mm, suggesting a viscosity effect on the necking geometry. The results demonstrate that the concentration of blood influences the necking profile when deformed under tension that is applied by electrowetting forces.

A New on Chip Nanomechanical Testing Concept Applied to Brittle and Ductile Thin Films Materials

2008 ◽  
Author(s):  
Thomas Pardoen ◽  
Asmahan Safi ◽  
Michae¨l Coulombier ◽  
Pierre Carbonnelle ◽  
Jean-Pierre Raskin ◽  
...  
Keyword(s):  
Thin Films ◽  
Elastic Modulus ◽  
Fracture Stress ◽  
Mechanical Response ◽  
Recent Literature ◽  
Tensile Tests ◽  
Uniaxial Tensile ◽  
Large Strains ◽  
Nanomechanical Testing ◽  
On Chip

A novel, versatile concept of micromachines has been developed to measure the mechanical response of films, beams or tubes, with thickness ranging between 10 to 1000 nm. Its capacity to study large strains and fracture is one of its key advantages. This new technique has been used to characterize the elastic modulus and fracture stress of two types of brittle films: polysilicon and silicon nitride. The Young’s modulus agrees with the literature data. The fracture stress of polysilicon is shown to increase with decreasing specimen surface size, in agreement with the recent literature. In addition, uniaxial tensile tests have been performed on 210 nm-thick Al films up to fracture. These results show that large ductility can be obtained in very thin freestanding films, which is important for many micro- and nano-systems developments.

Ductility of Thin Metallic Films

2009 ◽  
Vol 633-634 ◽  
pp. 615-635 ◽  
Author(s):  
Thomas Pardoen ◽  
Michael Coulombier ◽  
Alexandre Boe ◽  
A. Safi ◽  
Charles Brugger ◽  
...  
Keyword(s):  
Grain Boundaries ◽  
Strain Hardening ◽  
Recent Literature ◽  
Void Nucleation ◽  
Tensile Tests ◽  
Metallic Films ◽  
Good Resistance ◽  
Internal Damage ◽  
On Chip ◽  
Plastic Localization

Depending on the loading conditions, geometry and material characteristics, the ductility of thin metallic films is controlled either by the resistance to plastic localization or by the resistance to internal damage. New on-chip tensile tests performed on submicron aluminium films show significant strain hardening capacity leading to relatively good resistance to necking, while damage occurs through void nucleation at grain boundaries followed by their growth and coalescence. These results are discussed in the light of several other studies presented in the recent literature in order to unravel the origins of the frequently reported poor ductility of thin metallic films, and the various means existing to improve it.

scholarly journals Effect of Cutting Edge Geometry on Chip Flow Direction – Analytical Modelling and Experimental Validation

Procedia CIRP ◽  
2017 ◽  
Vol 58 ◽  
pp. 353-357 ◽  
Author(s):  
A. D’Acunto ◽  
Gael Le Coz ◽  
Abdelhadi Moufki ◽  
D. Dudzinski
Keyword(s):  
Experimental Validation ◽  
Flow Direction ◽  
Cutting Edge ◽  
Analytical Modelling ◽  
Edge Geometry ◽  
Chip Flow ◽  
On Chip

Quasi-Static and Fatigue Fracture Strength of Microsized Silicon Film Measured by On-Chip Test Method

2000 ◽  
Author(s):  
Taeko Ando ◽  
Tetsuo Yoshioka ◽  
Mitsuhiro Shikida ◽  
Kazuo Sato
Keyword(s):  
Fracture Strain ◽  
Silicon Film ◽  
Single Crystal Silicon ◽  
Tensile Tests ◽  
Fatigue Tests ◽  
Test Method ◽  
Uniaxial Tensile ◽  
Silicon Thin Film ◽  
Crystal Silicon ◽  
On Chip

Abstract Quasi-static and fatigue tests under uniaxial tensile loading condition were carried out for single-crystal-silicon in a direction of <110> by using on-chip testing method. A film specimen and tensile testing system were integrated on a silicon chip. A measurement system allowing both quasi-static and dynamic loading was newly introduced. In quasi-static loading measured fracture strain of silicon thin-film was 3.4%. Fatigue fractures were observed during 103∼106 cycles when the maximum strains of sinusoidal wave were higher than the average fracture strain of tensile tests.

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