Total Ionizing Dose Effects on Quantum Efficiency and Dark Current of CMOS Image Sensors with Deep-Trench-Isolation

2015 ◽  
Vol 13 (7) ◽  
pp. 539-542 ◽  
Author(s):  
Nayera Ahmed ◽  
Guo-Neng Lu ◽  
François Roy
2014 ◽  
Vol 605 ◽  
pp. 453-456
Author(s):  
Nayera Ahmed ◽  
Guo Neng Lu ◽  
François Roy

We have investigated Total Ionizing Dose (TID) effects on a 1.4μm-pitch, Deep-Trench Isolation (DTI) CMOS image sensor for its use in radiation environment. Our investigation includes characterization and TCAD simulations (with parametric modeling) of the image sensor before and after irradiation with 60Co gamma rays source for TID from 3 to 100 Krad. We have obtained agreements between measured results and simulated ones on degradations of the characteristics Quantum Efficiency (QE) and dark current (Idark). The agreements validate our modeling and simulation approach to evaluating these characteristics. It has been shown that TID causes evolution of interface states of different parts of the pixel, which are responsible for QE and Idark degradations. TID effects on different parts of the pixel can be identified and quantified.


Sensors ◽  
2020 ◽  
Vol 20 (1) ◽  
pp. 287
Author(s):  
Célestin Doyen ◽  
Stéphane Ricq ◽  
Pierre Magnan ◽  
Olivier Marcelot ◽  
Marios Barlas ◽  
...  

A new methodology is presented using well known electrical characterization techniques on dedicated single devices in order to investigate backside interface contribution to the measured pixel dark current in BSI CMOS image sensors technologies. Extractions of interface states and charges within the dielectric densities are achieved. The results show that, in our case, the density of state is not directly the source of dark current excursions. The quality of the passivation of the backside interface appears to be the key factor. Thanks to the presented new test structures, it has been demonstrated that the backside interface contribution to dark current can be investigated separately from other sources of dark current, such as the frontside interface, DTI (deep trench isolation), etc.


2018 ◽  
Vol 65 (1) ◽  
pp. 84-91 ◽  
Author(s):  
Serena Rizzolo ◽  
Vincent Goiffon ◽  
Magali Estribeau ◽  
Philippe Paillet ◽  
Claude Marcandella ◽  
...  

Author(s):  
N. Ahmed ◽  
F. Roy ◽  
G-N. Lu ◽  
B. Mamdy ◽  
J-P. Carrere ◽  
...  

2011 ◽  
Vol 58 (6) ◽  
pp. 3085-3094 ◽  
Author(s):  
Cedric Virmontois ◽  
V. Goiffon ◽  
P. Magnan ◽  
O. Saint-Pe ◽  
S. Girard ◽  
...  

2018 ◽  
Vol 65 (1) ◽  
pp. 92-100 ◽  
Author(s):  
Clementine Durnez ◽  
Vincent Goiffon ◽  
Cedric Virmontois ◽  
Serena Rizzolo ◽  
Alexandre Le Roch ◽  
...  

2008 ◽  
Vol 48 (7) ◽  
pp. 1000-1007 ◽  
Author(s):  
Federico Faccio ◽  
Hugh J. Barnaby ◽  
Xiao J. Chen ◽  
Daniel M. Fleetwood ◽  
Laura Gonella ◽  
...  

2021 ◽  
Vol 127 (3) ◽  
Author(s):  
Avashesh Dubey ◽  
Rakhi Narang ◽  
Manoj Saxena ◽  
Mridula Gupta

Author(s):  
Ryan Q. Rudy ◽  
Kyle M. Grove ◽  
Manuel Rivas ◽  
Jonathon Guerrier ◽  
Cory Cress ◽  
...  

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