Influence of nucleating agent type on the morphology of extruded polyetherimide foam for printed circuit boards*

2019 ◽  
Vol 56 (3) ◽  
pp. 317-341 ◽  
Author(s):  
Clemens Keilholz ◽  
Daniel Raps ◽  
Thomas Köppl ◽  
Volker Altstädt

This work focuses on the development of foamed high temperature thermoplastic substrates for printed circuit boards. For this application it is necessary to achieve mean cell diameters smaller than 30 µm in order to be able to realize vias and high packaging densities (miniaturization). Different additives as nucleating agents, namely macro- and micro-crystalline talc, silica, calcium carbonate, and wollastonite, were melt-compounded with polyetherimide using a twin-screw extruder. Foamed samples are prepared by foam extrusion using a slit die and CO2 as physical blowing agent. The aim of this study is to analyze the influence of the mean particle size and the particle surface tension on the mean cell diameters. Therefore, the shape of the additives, the foam morphology, and the elongational viscosity were considered. The additives with a suitable particle size and surface tension exhibit a positive influence on the foam morphology, resulting in smaller cell diameters (<30 µm), a narrower cell size distribution and a foam density lower than 900 kg/m3. If the mean particle diameter of the nucleating agents is lower than 0.6 µm in this study, no nucleation effect could be observed. This is related to the fact that no heterogeneous nucleation occurs, if the particle diameter is too small. If the mean particle diameter of the used additives is larger than 1.5 µm, which could be demonstrated in this study in case of polyetherimide, then the additive acts as nucleating agent and heterogeneous nucleation occurs. Furthermore, it was observed that the mean cell diameter was affected by the different surface tensions of the studied nucleating agents.

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000235-000245
Author(s):  
David Shaddock ◽  
Liang Yin

Printed circuit boards have been reported to have limited lifetime at 200 to 250°C. Characterization and modeling high temperature laminates for application at 200 to 250°C was conducted to better quantify the mean lifetime using accelerated testing of key functional parameters. Life testing and model development was applied for via cyclic life, peel strength, and weight loss. Four high temperature laminates consisting of 2 types were evaluated. Via lifetime was characterization using Interconnect Stress Test (IST) coupons. Peel strength was tested using IPC IPC-TM-650 method 2.4.8c. Weight loss was characterized using isothermal aging. Comparison of lifetime is made between the laminate samples.


2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara

2018 ◽  
Vol 23 (2) ◽  
pp. 141-148
Author(s):  
S.Sh. Rekhviashvili ◽  
◽  
M.O. Mamchuev ◽  
V.V. Narozhnov ◽  
M.M. Oshkhunov ◽  
...  

2013 ◽  
Vol 61 (3) ◽  
pp. 731-735
Author(s):  
A.W. Stadler ◽  
Z. Zawiślak ◽  
W. Stęplewski ◽  
A. Dziedzic

Abstract. Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.


2014 ◽  
Vol 13 (10) ◽  
pp. 2601-2607 ◽  
Author(s):  
Jae-chun Lee ◽  
Manoj Kumar ◽  
Min-Seuk Kim ◽  
Jinki Jeong ◽  
Kyoungkeun Yoo

Sign in / Sign up

Export Citation Format

Share Document