Preparation of zirconium pyrophosphate bonded silicon nitride porous ceramics

2006 ◽  
Vol 22 (8) ◽  
pp. 915-918 ◽  
Author(s):  
F. Chen ◽  
Q. Shen ◽  
F. Q. Yan ◽  
L. M. Zhang
2013 ◽  
Vol 586 ◽  
pp. 166-169 ◽  
Author(s):  
Monika Kašiarová ◽  
Zuzana Vilčeková ◽  
Katarína Bodišová ◽  
Magdaléna Domanická ◽  
Miroslav Hnatko ◽  
...  

Mechanical properties of porous silicon nitride prepared by two different processing routes have been studied. Depth sensing methods was used to measure the hardness and elastic modulus of experimental materials. The results were compared with the hardness and elastic modulus of trabecular bone in order to find out porous ceramics with properties close to that of trabecular bone. Material prepared by infiltration of polyurethane sponge exhibited properties close to the properties of bone and it is the potential material for further investigation in the bioapplication field.


2012 ◽  
Vol 512-515 ◽  
pp. 824-827 ◽  
Author(s):  
Jian Liu ◽  
Kai Liu ◽  
Hong Sheng Wang ◽  
Fang Gao ◽  
Rong Liao

A silicon nitride porous ceramics having excellent mechanical strength and dielectric properties can be employed as a wave-transparent material. The silicon nitride porous ceramic contains a plurality of silicon nitride crystal grains with pores formed in grain boundary which forms a three-dimensional network structure. The properties of the silicon nitride porous ceramics was studied , the porous ceramics was prepared by different process parameters, including the pressure of cold isostatic pressing, temperature of sintering and sintering atmosphere, etc.; A high porosity(>50%), high strength(>120MPa), low dielectric properties(ε<3.2) silicon nitride ceramic can be prepared by appropriate process parameters.


2013 ◽  
Vol 04 (07) ◽  
pp. 407-418
Author(s):  
Miroslav Hnatko ◽  
Zoltán Lenčéš ◽  
Peter Čopan ◽  
Lucia Birošová ◽  
Patrik Matejov ◽  
...  

2012 ◽  
Vol 512-515 ◽  
pp. 873-877
Author(s):  
Fei Chen ◽  
Qiang Shen ◽  
Lian Meng Zhang

In this paper, silicon nitride porous ceramics with high porosity and bimodal pore structure were prepared using pressureless sintering at 900~1100°C. In these porous ceramics, zirconium phosphate (ZrP2O7) was used as a binder and starch and naphthalene powders were used as pore forming agents. The obtained results showed that the porosity could be controlled in the range of 34 % to 70 % by changing the content of pore forming agents. The pores were formed by the continuous reaction of ZrP2O7 at ~250 °C and burnout of starch at ~550 °C (when starch was used as a pore forming agent), or sublimation of naphthalene at 80°C (when naphthalene was used as a pore forming agent). The bimodal pore structure was produced with pore size of less than 0.5m and ~10 m when using starch as a pore forming agent and the pore size of less than 0.5m and ~30μm when using naphthalene as a pore forming agent.


2011 ◽  
Vol 65 (9) ◽  
pp. 1410-1412 ◽  
Author(s):  
Fei Chen ◽  
Lingling Ma ◽  
Qiang Shen ◽  
Lianmeng Zhang

2012 ◽  
Vol 508 ◽  
pp. 21-26 ◽  
Author(s):  
Jun Yan Wu ◽  
Fei Chen ◽  
Ming Zhong Li ◽  
Qiang Shen ◽  
Lian Meng Zhang

In this Paper, Five Fundamental Effective Thermal Conductivity Structural Models (Series, Parallel, Two Forms of Maxwell-Eucken and Effective Medium Theory) Were Used to Analyze and Design Silicon Nitride Porous Ceramics. Then α-Si3N4Matrix Porous Ceramics Were Prepared with ZrP2O7as a Binder and Thermal Conductivity of ZrP2O7Bonded Si3N4Porous Ceramic Was Evaluated. ZrP2O7Bonded Si3N4Porous Ceramic Had Open and Interconnected Pore Structure which is either in EMT or in Maxwell-Euken 2. The Thermal Conductivity of ZrP2O7Bonded Si3N4Porous Ceramics Changes from 2.0 to 0.5 W/m•K with Increasing the Porosity from 20% to 51%. The Obtained Results Showed that the External Porosity Material with Maxwell-Euken 2 Structure Had the Lowest Thermal Conductivity in All Porous Materials. The Open and Interconnected Pore Structure of ZrP2O7Bonded Si3N4Porous Ceramics Provided much Lower Thermal Conductivity.


2008 ◽  
Vol 497 (1-2) ◽  
pp. 495-500 ◽  
Author(s):  
Fei Chen ◽  
Qiang Shen ◽  
Julie M. Schoenung ◽  
Lianmeng Zhang

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