Creep Analysis of Delrin Stents for Cardiac Bioprosthesis Devices

2021 ◽  
pp. 9-27
Author(s):  
E. Miller ◽  
C. B. Gilpin
Keyword(s):  
Author(s):  
Lun Qiu ◽  
John Zhang

The fluid barrier in an unbonded flexible pipe seals the pressure from the internal fluid. Since the barrier is usually made of polymer materials, it is unable to hold the pressure by itself. A metal reinforced hoop layer is usually needed outside the barrier layer in order to resist the pressure. The hoop layer is usually a steel bar with a cross-section of an irregular shape. It is helically wrapped at the outside of the barrier layer. When the pipe is pressurized, the barrier will be supported by the hoop reinforcement layer from outside. However, at the gap between the steel wraps where the barrier layer bridges, material of the barrier will be forced to extrude into the gap. The amount of the extrusion is a function of many parameters such as temperature, material property, and internal pressure and so on. In addition, it is time dependent. The creep effect needs be considered. It is critical to have a proper barrier design for a flexible pipe structure. This article presents a practical finite element method for evaluation of the barrier/gap design. The creep behavior of the polymers is multi-parameter related. Therefore, a series of material tests has been conducted under various stresses and temperatures for nylon, polyethylene and Polyvinylidene Fluoride. In this work a method is given to determine the creep behavior parameters through parameter matching based on the tests. The creep deformation of barrier was analyzed with a finite element model using these parameters.


2015 ◽  
Vol 9 (4) ◽  
Author(s):  
Said-Alvi Yusupovich Murtazaiev ◽  
Valeriy Stanislavovich Lesovik ◽  
Deni Karim-Sultanovich Bataiev ◽  
Natalia Vasilievna Chernysheva ◽  
Magomed Salamuvich Saidumov

1969 ◽  
Vol 12 (54) ◽  
pp. 1270-1278 ◽  
Author(s):  
Sumio MURAKAMI ◽  
Shuhei IWATSUKI

2002 ◽  
Vol 124 (3) ◽  
pp. 205-211 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.


1995 ◽  
Vol 37 (11) ◽  
pp. 1179-1202 ◽  
Author(s):  
N Ogbonna ◽  
N.A Fleck ◽  
A.C.F Cocks

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