Metallization of polymers using plasma enhanced chemical vapor deposited titanium nitride as interlayer

1998 ◽  
pp. 51-60
Keyword(s):  
Titanium Nitride ◽  
Chemical Vapor ◽  
Chemical Vapor Deposited ◽  
Metallization Of Polymers

Suppressing the Formation of Cone Structures in Chemical-Vapor-Deposited Aluminum Nitride/Titanium Nitride Films

1996 ◽  
Vol 79 (4) ◽  
pp. 1109-1112 ◽  
Author(s):  
Yi Jun Liu ◽  
Hee Joon Kim ◽  
Takashi Takeuchi ◽  
Yasuyuki Egashira ◽  
Hisamichi M. Kimura ◽  
...  
Keyword(s):  
Aluminum Nitride ◽  
Titanium Nitride ◽  
Chemical Vapor ◽  
Chemical Vapor Deposited

Resistivity reduction and chemical stabilization of organometallic chemical vapor deposited titanium nitride by nitrogen rf plasma

1996 ◽  
Vol 68 (7) ◽  
pp. 1015-1016 ◽  
Author(s):  
M. Danek ◽  
M. Liao ◽  
J. Tseng ◽  
K. Littau ◽  
D. Saigal ◽  
...  
Keyword(s):  
Titanium Nitride ◽  
Chemical Vapor ◽  
Rf Plasma ◽  
Chemical Stabilization ◽  
Chemical Vapor Deposited

Synthesis and Selected Micro-Mechanical Properties of Titanium Nitride Thin Films by the Pyrolysis of Tetrakis Titanium in Ammonia.

1994 ◽  
Vol 363 ◽  
Author(s):  
Y. W. Bae ◽  
W. Y. Lee ◽  
T. M. Besmann ◽  
P. J. Blau ◽  
L. Riester
Keyword(s):  
Thin Films ◽  
Titanium Nitride ◽  
Electron Spectroscopy ◽  
Single Crystal Silicon ◽  
Chemical Vapor ◽  
Silicon Substrates ◽  
X Ray Diffraction ◽  
Crystal Silicon ◽  
Transmission Electron ◽  
Chemical Vapor Deposited

AbstractThin films of titanium nitride were chemical vapor deposited on (100)-oriented single-crystal silicon substrates from tetrakis (dimethylamino) titanium, Ti((CH3)2N)4, and ammonia gas mixtures in a cold-wall reactor at 623 K and 655 Pa. The films were characterized by Auger electron spectroscopy, X-ray diffraction, and transmission electron spectroscopy. The nano-scale hardness of the film, measured by nanoindentation, was 12.7±0.6 GPa. The average kinetic friction coefficient against unlubricated, type- 440C stainless steel was determined using a computer-controlled friction microprobe to be ∼0.43.

Properties of chemical-vapor-deposited titanium nitride

1993 ◽  
Vol 236 (1-2) ◽  
pp. 311-318 ◽  
Author(s):  
J.B. Price ◽  
John O. Borland ◽  
Steve Selbrede
Keyword(s):  
Titanium Nitride ◽  
Chemical Vapor ◽  
Chemical Vapor Deposited

Electroplating of poly(tetrafluoroethylene) using plasma enhanced chemical vapor deposited titanium nitride as an interlayer

1995 ◽  
Vol 67 (16) ◽  
pp. 2311-2313 ◽  
Author(s):  
A. Weber ◽  
A. Dietz ◽  
R. Pöckelmann ◽  
C.‐P. Klages
Keyword(s):  
Titanium Nitride ◽  
Chemical Vapor ◽  
Chemical Vapor Deposited
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