Implementation of a High-Temperature Inelastic Constitutive Model in FEM and Application to Lead-Free Solder Joint Analysis

A new high-temperature lead-free solder joint which withstands up to 300°C utilizing superplasticity in the Al-Zn eutectoid alloy has been developed to realize SiC power semiconductor devices. The new solid state joining process consists of interfacial cleaning of joints utilizing superplasticity of the Al-Zn-eutectoid alloy at 250°C followed by diffusion bonding between 350 and 390°C. The bonding strength of the new joints exhibits almost the same value at the temperature range from RT to 300°C, above which it decreases slightly with increasing temperature. It is also found that the bonding strength of the new joints is 8 times as high as those of a high-temperature Pb-5wt%Sn-1.5wt%Ag solder and the Al-Zn eutectoid alloy solder without utilizing superplasticity at 250°C. The Al-Zn eutectoid alloy solder joint has shown high reliability in the temperature cycle testing between 50°C and 300°C up to 300 cycles.

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The Effects of High Temperature Storage on Lead Free Solder Joint Material Strength Using Pull Test Method

2006 IEEE International Conference on Semiconductor Electronics ◽

10.1109/smelec.2006.380722 ◽

2006 ◽

Cited By ~ 1

Author(s):

Muhammad Najib Harif ◽

Ibrahim Ahmad ◽

Azami Zaharim

Keyword(s):

High Temperature ◽

Solder Joint ◽

Test Method ◽

Lead Free ◽

Material Strength ◽

Lead Free Solder ◽

High Temperature Storage ◽

Free Solder ◽

Joint Material ◽

Temperature Storage

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Low-cycle fatigue failure behavior and life evaluation of lead-free solder joint under high temperature

Microelectronics Reliability ◽

10.1016/j.microrel.2014.08.016 ◽

2014 ◽

Vol 54 (12) ◽

pp. 2922-2928 ◽

Cited By ~ 23

Author(s):

Yongxin Zhu ◽

Xiaoyan Li ◽

Ruiting Gao ◽

Chao Wang

Keyword(s):

High Temperature ◽

Solder Joint ◽

Fatigue Failure ◽

Low Cycle Fatigue ◽

Lead Free ◽

Failure Behavior ◽

Lead Free Solder ◽

Cycle Fatigue ◽

Life Evaluation ◽

Free Solder

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Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints

Journal of Electronic Packaging ◽

10.1115/1.2809442 ◽

2007 ◽

Vol 129 (4) ◽

pp. 496-503 ◽

Cited By ~ 11

Author(s):

John H. L. Pang ◽

F. X. Che

Keyword(s):

High Temperature ◽

Solder Joint ◽

Room Temperature ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Bending Fatigue ◽

Bend Fatigue Test ◽

Bend Tests ◽

Free Solder

Isothermal three-point and four-point cyclic bend fatigue test methods have been developed for Sn–Ag–Cu solder joints. Reported bend tests from the literature were conducted at room temperature (25°C) and there is lack of data for lead-free solder joints. In this study, very-thin quad flat no-lead (VQFN) assembly with Sn–Ag–Cu lead-free solder was tested under three-point and four-point cyclic bending loads at both room temperature (25°C) and high temperature (125°C). The correlation between three-point and four-point bend tests was developed. Two different board surface finishes of electroless Ni and immersion gold (ENIG) and organic solderability preservatives (OSP) were investigated. Bending fatigue resistance of VQFN with OSP finish is slightly better than ENIG finish case. The acceleration factor of failure at high temperature (125°C) is higher than that at room temperature (25°C). Finite element analysis modeling and simulation were performed for different test conditions to investigate the solder joint stress-strain behavior. Volume-averaged energy density was used as a fatigue damage parameter and energy-based bending fatigue models were developed for VQFN with Sn–Ag–Cu solder joint under cyclic bending load at both 25°C and 125°C.

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