With the continuing downscaling in feature sizes, the thermal impact on material properties and geometrical deformations can no longer be ignored in the analysis of the electromagnetic compatibility or electromagnetic interference of package systems, including System-in-Package and antenna arrays. We present a high-performance numerical simulation program that is intended to perform large-scale multiphysics simulations using the finite element method. An efficient domain decomposition method was developed to accelerate the multiphysics loops of electromagnetic–thermal stress simulations by considering the fact that the electromagnetic field perturbations caused by geometrical deformation are small and constrained in one or a few subdomains. The multi-level parallelism of the algorithm was also obtained based on an in-house developed parallel infrastructure. Numerical examples showed that our algorithm is able to enable simulation with multiple processors in parallel and, more importantly, achieve a significant reduction in computation time compared with traditional methods.
Parallel Multiphysics Simulation of Package Systems Using an Efficient Domain Decomposition Method
