scholarly journals 503 Application of a Thermal Network Method to Thermal Analysis of Electronic Device with Phase Change Materials : Modeling Technique of Latent Heat

2009 ◽  
Vol 2009.46 (0) ◽  
pp. 169-170
Author(s):  
Sadakazu TAKAKUWA ◽  
Masaru ISHIZUKA ◽  
Shinji NAKAGAWA
Keyword(s):  
Thermal Analysis ◽  
Phase Change ◽  
Latent Heat ◽  
Phase Change Materials ◽  
Electronic Device ◽  
Modeling Technique ◽  
Thermal Network ◽  
Materials Modeling ◽  
Network Method ◽  
Thermal Network Method

Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials

2009 ◽  
Author(s):  
Sadakazu Takakuwa ◽  
Masaru Ishizuka ◽  
Shinji Nakagawa ◽  
Kanji Takagi
Keyword(s):  
Phase Change ◽  
Temperature Rise ◽  
Phase Change Materials ◽  
Heat Dissipation ◽  
Design Parameters ◽  
Transient Temperature ◽  
Thermal Network ◽  
Network Method ◽  
Pin Fins ◽  
Thermal Network Method

This paper describes transient cooling technology for electronic equipment using Phase Change Materials (PCMs) and a heat sink with pin fins. We designed an electronic module including paraffin as the PCM and measured its transient temperature rise. The effects of the diameter of pin fins and heat dissipation values were investigated as design parameters. The results show that the temperature rise values were controlled by the thermal absorption effect due to the latent heat of the PCM. It is also confirmed that the proposed thermal network method with an equivalent specific heat model has strong potential for use in the analysis of electronic modules using PCMs.

Thermal analysis by thermal network method with solid-liquid phase change

2020 ◽  
Vol 2020.95 (0) ◽  
pp. 07_704
Author(s):  
Junichi Nakazono ◽  
Yasumitsu Nomura ◽  
Yoshikazu Yaji ◽  
Minoru Sato
Keyword(s):  
Thermal Analysis ◽  
Liquid Phase ◽  
Phase Change ◽  
Thermal Network ◽  
Network Method ◽  
Thermal Network Method ◽  
Solid Liquid
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