Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials

2009 ◽  
Author(s):  
Sadakazu Takakuwa ◽  
Masaru Ishizuka ◽  
Shinji Nakagawa ◽  
Kanji Takagi
Keyword(s):  
Phase Change ◽  
Temperature Rise ◽  
Phase Change Materials ◽  
Heat Dissipation ◽  
Design Parameters ◽  
Transient Temperature ◽  
Thermal Network ◽  
Network Method ◽  
Pin Fins ◽  
Thermal Network Method

This paper describes transient cooling technology for electronic equipment using Phase Change Materials (PCMs) and a heat sink with pin fins. We designed an electronic module including paraffin as the PCM and measured its transient temperature rise. The effects of the diameter of pin fins and heat dissipation values were investigated as design parameters. The results show that the temperature rise values were controlled by the thermal absorption effect due to the latent heat of the PCM. It is also confirmed that the proposed thermal network method with an equivalent specific heat model has strong potential for use in the analysis of electronic modules using PCMs.

A Temperature Field Model of Complicated Thermal Analysis System Based on Thermal Network Method

2013 ◽  
Vol 694-697 ◽  
pp. 695-698 ◽  
Author(s):  
Ze Jin Lin ◽  
Jie Hong Yuan ◽  
Yuan Li ◽  
Xi Jie Yan ◽  
Shi Ming Zhou ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
Temperature Field ◽  
Transient Temperature ◽  
Thermal Network ◽  
Heat Transfer Theory ◽  
Steady State Temperature ◽  
Network Method ◽  
Temperature Field Model ◽  
Thermal Network Method ◽  
Analysis System

Based on the thermal network method and heat transfer theory, a temperature field simulation model of complicated thermal analysis system was established by Matlab Simulink. Based on the model, a steady-state temperature field of a helicopter tail reducer was calculated in the normal lubrication. The model is more accurate and reliable than the traditional algorithm. Meanwhile, the model can calculate the time-varying process of the temperature field, corresponding to the transient temperature field.

scholarly journals Ageing of Aluminum Power Connectors Based on Current Cycle Test

2019 ◽  
Vol 4 (1) ◽  
pp. 110-114 ◽  
Author(s):  
Ghareeb Moustafa
Keyword(s):  
Contact Resistance ◽  
Temperature Rise ◽  
Operating Conditions ◽  
Heat Sources ◽  
Thermal Network ◽  
Network Method ◽  
Current Cycle ◽  
Thermal Network Method ◽  
Lower Temperature ◽  
A Current

The effect of current cycle on the behavior of contact resistance of clamped connectors was investigated experimentally to characterize the thermal behavior of the used clamped connector and optimizing the installation procedure in order to reduce contact resistance and ensure a lower temperature during normal operating conditions. The thermal network method is used for calculating the temperature rise of the connector when loaded by a current. The method is based on substitution of the connector geometry by a circuit consisting of thermal resistances, capacitance and heat sources. The temperature rise is determined using the network simulation program PSPICE with the corresponding thermal model libraries. The validity of the obtained results has been checked by comparing the computed values with those measured experimentally. The agreement was found satisfactory

Thermal analysis by thermal network method with solid-liquid phase change

2020 ◽  
Vol 2020.95 (0) ◽  
pp. 07_704
Author(s):  
Junichi Nakazono ◽  
Yasumitsu Nomura ◽  
Yoshikazu Yaji ◽  
Minoru Sato
Keyword(s):  
Thermal Analysis ◽  
Liquid Phase ◽  
Phase Change ◽  
Thermal Network ◽  
Network Method ◽  
Thermal Network Method ◽  
Solid Liquid

Estimation of Cooling Performance of PCM Module by Using CFD Analysis With Enthalpy Porosity Method

2011 ◽  
Author(s):  
Tomoyuki Hatakeyama ◽  
Masaru Ishizuka ◽  
Shinji Nakagawa ◽  
Sadakazu Takakuwa
Keyword(s):  
Phase Change ◽  
Cfd Analysis ◽  
Cooling Performance ◽  
Thermal Network ◽  
Network Method ◽  
Calculation Results ◽  
Computational Fluid Dynamics Cfd ◽  
Phase Change Phenomena ◽  
Thermal Network Method ◽  
Module Performance

This paper describes transient cooling technology for electronic equipment using Phase Change Material (PCM). In previous our report, we can estimate the cooling performance of PCM by using thermal network method, which can not calculate melted PCM flow. In this paper, we further consider the heat transfer phenomena of PCM more deeply by using Computational Fluid Dynamics (CFD) analysis with Enthalpy Porosity Method. By using this method, we can calculate phase change phenomena and flowing phenomena of melted PCM with CFD analysis. The calculation results showed that, high temperature and low temperature location exist on the substrate in the case that PCM module is set vertically. If several devices are cooled with PCM module, most power consuming device must be set in lower part of PCM module. Further, we discussed the reason why the thermal network method can predict PCM module performance though natural convective flow can not be expressed in the thermal network method.

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