scholarly journals 812 Application of a thermal network method to the thermal analysis of electronic devices including phase change materials

2007 ◽  
Vol 2007.44 (0) ◽  
pp. 315-316
Author(s):  
Noriyuki Fujii ◽  
Masaru Ishizuka ◽  
Shinji Nakagawa
Author(s):  
Sadakazu Takakuwa ◽  
Masaru Ishizuka ◽  
Shinji Nakagawa ◽  
Kanji Takagi

This paper describes transient cooling technology for electronic equipment using Phase Change Materials (PCMs) and a heat sink with pin fins. We designed an electronic module including paraffin as the PCM and measured its transient temperature rise. The effects of the diameter of pin fins and heat dissipation values were investigated as design parameters. The results show that the temperature rise values were controlled by the thermal absorption effect due to the latent heat of the PCM. It is also confirmed that the proposed thermal network method with an equivalent specific heat model has strong potential for use in the analysis of electronic modules using PCMs.


2020 ◽  
Vol 2020.95 (0) ◽  
pp. 07_704
Author(s):  
Junichi Nakazono ◽  
Yasumitsu Nomura ◽  
Yoshikazu Yaji ◽  
Minoru Sato

2013 ◽  
Vol 694-697 ◽  
pp. 695-698 ◽  
Author(s):  
Ze Jin Lin ◽  
Jie Hong Yuan ◽  
Yuan Li ◽  
Xi Jie Yan ◽  
Shi Ming Zhou ◽  
...  

Based on the thermal network method and heat transfer theory, a temperature field simulation model of complicated thermal analysis system was established by Matlab Simulink. Based on the model, a steady-state temperature field of a helicopter tail reducer was calculated in the normal lubrication. The model is more accurate and reliable than the traditional algorithm. Meanwhile, the model can calculate the time-varying process of the temperature field, corresponding to the transient temperature field.


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