1111 FEM Analysis of Thermal Stress on Solder Ball for BGA Type LSI Package
2008 ◽
Vol 2008.6
(0)
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pp. 227-228
2013 ◽
Vol 365-366
◽
pp. 331-334
Keyword(s):
2007 ◽
Vol 336-338
◽
pp. 1531-1533
2008 ◽
Vol 373-374
◽
pp. 786-789
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2000 ◽
Vol 97
(1-3)
◽
pp. 35-43
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2016 ◽
Vol 72
(3)
◽
pp. I_105-I_113
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Keyword(s):
2005 ◽
Vol 297-300
◽
pp. 1698-1703
2014 ◽
Vol 130
◽
pp. 74-81
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2000 ◽
Vol 2000.3
(0)
◽
pp. 53-54
Keyword(s):