P047 Temperature dependence of Young's modulus and internal friction in Sn-Zn system lead-free solder

2007 ◽  
Vol 2007 (0) ◽  
pp. 689-690
Author(s):  
Yasumasa Fujii ◽  
Teruaki Ono
Keyword(s):  
Internal Friction ◽  
Temperature Dependence ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder

2009 ◽  
Vol 39 (2) ◽  
pp. 223-229 ◽  
Author(s):  
Y.D. Han ◽  
H.Y. Jing ◽  
S.M.L. Nai ◽  
L.Y. Xu ◽  
C.M. Tan ◽  
...  
Keyword(s):  
Temperature Dependence ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Effect of Co-Addition of Ag and Cu on Mechanical Properties of Sn–5Sb Lead-Free Solder

2021 ◽  
Author(s):  
Biao Yuan ◽  
Zhimin Liang ◽  
Zongyuan Yang ◽  
Fei Shen ◽  
Da Xu ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Young’S Modulus ◽  
Room Temperature ◽  
Solder Joints ◽  
Young's Modulus ◽  
Lead Free ◽  
Unloading Rate ◽  
Free Solder ◽  
Co Addition ◽  
Lead Free Solders

AbstractSn–Sb lead-free solders are considered to substitute the tin–lead solders due to their great mechanical properties. At room temperature, the mechanical properties of Ni/Au/Sn–5Sb/Au/Ni and Ni/Au/Sn–5Sb–0.3Ag–0.05Cu/Au/Ni linear solder joints were investigated by nanoindentation experiments at different loads. The results showed that the Sn–Sb intermetallic compound (IMC) was distributed in the β-Sn matrix in Ni/Au/Sn–5Sb/Au/Ni solder joints. Co-addition of Cu and Ag resulted in the formation of the rod-shaped Cu6Sn5 and the fine granular Ag3Sn IMCs. At the same load and loading/unloading rate, the indentation depth and residual indentation morphologies of Ni/Au/Sn–5Sb–0.3Ag–0.05Cu/Au/Ni solder joints were smaller than those of Ni/Au/Sn–5Sb/Au/Ni solder joints. The hardness of the two kinds of solder joints decreased with the increase in load, while the Young’s modulus was independent of load. In addition, compared to the Ni/Au/Sn–5Sb/Au/Ni solder joints, the hardness, Young’s modulus and stress exponents of Ni/Au/Sn–5Sb–0.3Ag–0.05Cu/Au/Ni solder joints achieved an improvement due to the co-addition of Ag and Cu.

scholarly journals Влияние водорода на модуль Юнга и внутреннее трение сплава V-4Ti-4Cr

2021 ◽  
Vol 63 (12) ◽  
pp. 2138
Author(s):  
Б.К. Кардашев ◽  
К.В. Сапожников
Keyword(s):  
Internal Friction ◽  
Temperature Dependence ◽  
Young’S Modulus ◽  
Hydrogen Content ◽  
Young's Modulus ◽  
Relaxation Peak ◽  
Temperature Spectrum ◽  
Temperature Range ◽  
Oscillation Frequencies

Young's modulus and internal friction of the V-4Ti-4Cr alloy with different hydrogen content were studied in the temperature range of 100 − 300 К at oscillation frequencies of about 100 kHz. It is shown that hydrogenation of the alloy gives rise to a minimum in the temperature dependence of Young's modulus due to the precipitation/dissolution of vanadium monohydride particles, and a relaxation peak in the temperature spectrum of internal friction at temperatures of about 140 К, which can be associated with the Snoek-type hydrogen relaxation caused by the Ti-H interaction.

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