515 Microscopic damage behavior in CFRP laminates under thermal cycle loading

2001 ◽  
Vol 2001 (0) ◽  
pp. 507-508
Author(s):  
Shinji OGIHARA ◽  
Takamoto ISHIGURO ◽  
Nobuo TAKEDA ◽  
Akira KOBAYASHI
Keyword(s):  
Thermal Cycle ◽  
Damage Behavior ◽  
Cfrp Laminates ◽  
Cycle Loading ◽  
Microscopic Damage

scholarly journals The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

Metals ◽  
2019 ◽  
Vol 9 (5) ◽  
pp. 518 ◽  
Author(s):  
Congcong Cao ◽  
Keke Zhang ◽  
Baojin Shi ◽  
Huigai Wang ◽  
Di Zhao ◽  
...  
Keyword(s):  
Shear Strength ◽  
Fracture Mechanism ◽  
Thermal Cycle ◽  
Solder Joints ◽  
Joint Interface ◽  
Interface Microstructure ◽  
Average Thickness ◽  
Thermal Cycles ◽  
Initial State ◽  
Cycle Loading

The interface microstructure and shear strength of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal-cycle loading were investigated with scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD) and physical and chemical tests. The results show that an intermetallic compound (IMC) layer of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints evolved gradually from the scalloped into larger wavy forms with increasing number of thermal cycles. The roughness and average thickness of IMC increased with thermal-cycle loading. However, at longer thermal-cycle loading, the shear strength of the joints was reduced by about 40%. The fracture pathway of solder joints was initiated in the solder seam with ductile fracture mechanism and propagated to the solder seam/IMC layer with ductile-brittle mixed-type fracture mechanism, when the number of thermal cycles increased from 100 to 500 cycles. By adding 0.05 wt.% Ni, the growth of the joint interface IMC could be controlled, and the roughness and average thickness of the interfacial IMC layer reduced. As a result, the shear strength of joints is higher than those without Ni. When compared to joint without Ni, the roughness and average thickness of 0.05 wt.% Ni solder joint interface IMC layer reached the minimum after 500 thermal cycles. The shear strength of that joint was reduced to a minimum of 36.4% of the initial state, to a value of 18.2 MPa.

scholarly journals Damage Behavior in Unidirectional CFRP Laminates with Fiber Discontinuity

2013 ◽  
Vol 79 (799) ◽  
pp. 294-303 ◽  
Author(s):  
Hayato NAKATANI ◽  
Kenji NAKAYA ◽  
Akira MATSUBA ◽  
Yousuke KOUNO ◽  
Shinji OGIHARA
Keyword(s):  
Damage Behavior ◽  
Cfrp Laminates

FE Modeling of Stress Distribution in MAO Coating on TC4 Substrate under Thermal Shock Cyclic Loading

2014 ◽  
Vol 941-944 ◽  
pp. 1629-1632 ◽  
Author(s):  
Ye Sheng Zhong ◽  
Li Ping Shi ◽  
Ming Wei Li ◽  
Jia Yu ◽  
Jian Han Liang ◽  
...  
Keyword(s):  
Shear Stress ◽  
Thermal Stress ◽  
Stress Distribution ◽  
Adhesive Strength ◽  
Thermal Cycle ◽  
Radial Stress ◽  
Numerical Study ◽  
Element Analysis ◽  
Solid Element ◽  
Cycle Loading

A numerical study using finite element analysis (FEA) was performed to investigate the thermal, shear and radial stresses developed in MAO coating on substrate of TC4 under thermal cycle loading. The four-node quadrilateral thermal solid element PLANE55 and four-node quadrilateral structural solid element PLANE42 with axisymmetric option was used to model the temperature distribution and thermal stress field of the MAO coating on TC4 substrates. The thermal stress, radial stress and shear stress along the thickness in film/substrate system are analyzed systematically under different thermal cycle loading. It is found that the thermal stress of MAO coating exhibits a linear relationship with thickness of substrate, but it exhibit a parabolic relationship with the thickness of the coating. The radial stress and shear stress distribution of the coating–substrate combination are also calculated. It is observed that high tensile shear stress of MAO coating on TC4 substrate reduces its adhesive strength but high-compressive shear stress improves its adhesive strength.

OS1207 Deformation and Damage Behavior in CFRP Laminates with Fiber Discontinuous Plies

2011 ◽  
Vol 2011 (0) ◽  
pp. _OS1207-1_-_OS1207-3_
Author(s):  
Kenji NAKAYA ◽  
Akira MATSUBA ◽  
Hayato NAKATANI ◽  
Shinji OGIHARA
Keyword(s):  
Damage Behavior ◽  
Cfrp Laminates

OS0808 Influence of the bond coating on the thermal cycle damage behavior in an APSed TBC

2009 ◽  
Vol 2009 (0) ◽  
pp. 406-407
Author(s):  
Yasuhiro YAMAZAKI ◽  
Toshihiko YOSHIDA ◽  
Hirotaka FUKANUMA ◽  
Naoyuki OHNO
Keyword(s):  
Thermal Cycle ◽  
Damage Behavior ◽  
Bond Coating

Numerical Simulation of Gun Bore Damage during Engraving Process of Driving Band

2017 ◽  
Vol 1142 ◽  
pp. 363-366
Author(s):  
He Yang Sun ◽  
Chang Zhi Jia ◽  
Yao Xin He ◽  
Tian Xiao Cui
Keyword(s):  
Damage Mechanics ◽  
Failure Process ◽  
Damage Model ◽  
Firing Process ◽  
Computation Method ◽  
Damage Behavior ◽  
Damage And Failure ◽  
Gun Barrel ◽  
Safety Design ◽  
Microscopic Damage

A Damage mechanics finite element numerical computation method was established based on HLC microscopic damage model to solve the problem of damage, crack initialization and growth inside bore during the firing process. The damage and failure process of the bore surface was simulated numerically during multiple rounds of firing. The law of the barrel material performance changing with the number of firing rounds was analyzed during the engraving process of the driving band and compared with the experimental results. It is proved that HLC microscopic damage model can show the complicate damage behavior and predict the cracking defect, which provides a reference for safety design of the gun barrel.

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